MIMX9331CVTXMAB

IC
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC i.MX 93 2 Core, 64-Bit 250MHz, 1.7GHz 306-FCBGA (14x14)

Quantity 522 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 9331
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package306-FCBGA (14x14)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernetGBE (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case306-LFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Speed250MHz, 1.7GHzSupplier Device Package306-FCBGA (14×14)USBUSB 2.0 (2)
Voltage – I/O1.8V

Overview of MIMX9331CVTXMAB – ARM Cortex-A55 & Cortex-M33 Dual-Core Applications Processor

The MIMX9331CVTXMAB is an industrial-qualified microprocessor IC from NXP Semiconductors’ i.MX 9331 series. It combines dual Arm Cortex‑A55 application processors operating up to 1.7 GHz with a general-purpose Arm Cortex‑M33 core running up to 250 MHz to address mixed real-time and application processing needs.

Designed for embedded systems in smart home, building control, contactless HMI and IoT edge and industrial use cases, the device emphasizes performance, power efficiency and integrated connectivity for compact, robust designs.

Key Features

  • Core & CPU Architecture Dual Arm Cortex‑A55 processors (64‑bit) up to 1.7 GHz and a Cortex‑M33 core up to 250 MHz provide a split between high-performance application processing and low-power real-time control.
  • Neural Processing Unit (NPU) On‑chip NPU supporting 256 MACs at up to 1.0 GHz (targeting 8‑bit and 16‑bit integer workloads) to accelerate ML inference while offloading the application cores.
  • Memory & Boot 16‑bit DRAM interface supporting LPDDR4/LPDDR4X with inline ECC and up to 2 GByte external memory space; integrated Boot ROMs and on‑chip RAM for secure and fast boot.
  • Storage & Host Three uSDHC controllers including eMMC 5.1 (8‑bit, HS400 DDR), SDXC and SDIO host support for flexible storage options.
  • Display & Image Interfaces Integrated display and camera support with LCD, LVDS, MIPI‑DSI and MIPI‑CSI interfaces and an Image Sensor Interface capable of up to 2K resolutions and pixel rates to 200 Mpixel/s.
  • Connectivity Dual 1 Gbps Ethernet controllers (one with Time‑Sensitive Networking support), two USB 2.0 ports and CANbus provide broad wired connectivity for industrial networks and gateways.
  • Security & Tamper Protection Hardware security features include boot security, cryptography engines, eFuse, true random number generator, secure RTC and tamper detection for system hardening.
  • Package, IO and Voltage Supplied in a 306‑FCBGA (14 × 14 mm) surface‑mount package with 1.8 V I/O support for compact board integration.
  • Industrial Grade Qualification for industrial applications and an operating temperature range of ‑40 °C to 105 °C for deployment in harsh environments.

Typical Applications

  • Industrial Human Machine Interface (HMI) Drives responsive graphics and application logic while supporting touchless or traditional interfaces with robust connectivity.
  • Industrial Vision & Scanning Camera interface and image processing support enable 2K sensors, preprocessing and ML acceleration for vision tasks.
  • Industrial Automation & Grid Equipment Dual Gigabit Ethernet with TSN support and CANbus enable low‑latency control and robust networked automation or energy‑grid applications.
  • Contactless HMI & Access Control Combines low‑power real‑time control with secure boot and cryptography to implement secure, responsive contactless interfaces.
  • Embedded IoT Edge Devices On‑board NPU, LPDDR4 memory support and multi‑host storage interfaces suit edge inference and local data management tasks.

Unique Advantages

  • Balanced dual‑domain processing: Combines high‑performance Cortex‑A55 cores with a Cortex‑M33 real‑time core to segregate application and control tasks efficiently.
  • On‑chip ML acceleration: Integrated NPU offloads inference workloads from application cores, reducing system-level CPU load for intelligent edge functions.
  • Comprehensive industrial connectivity: Dual Gigabit Ethernet (one TSN capable), CANbus and multiple USB/SD host controllers simplify integration into industrial networks and storage architectures.
  • Hardened security stack: Boot security, cryptography, eFuse and RNG features provide a hardware foundation for secure device deployment.
  • Industrial temperature and packaging: 306‑FCBGA 14×14 mm package and ‑40 °C to 105 °C rating support compact designs for demanding environments.

Why Choose MIMX9331CVTXMAB?

The MIMX9331CVTXMAB positions itself as an integrated, industrial‑qualified application processor for embedded designs that require both high‑performance application processing and deterministic real‑time control. With dual Cortex‑A55 cores, a Cortex‑M33 co‑processor, an on‑chip NPU and a broad set of interfaces, it enables consolidation of compute, connectivity and security functions into a single device.

This part is suited to engineers building industrial HMI, vision, automation and IoT edge systems who need scalable performance, hardware security primitives and industrial temperature operation, backed by a comprehensive platform architecture and memory/host options for flexible system design.

Request a quote or submit an inquiry to receive pricing, availability and technical support for the MIMX9331CVTXMAB.

Request a Quote

















    No file selected



    Our team will respond within 24 hours.


    I agree to receive newsletters and promotional emails. I can unsubscribe at any time.

    Certifications and Membership
    NQA AS9100 CMYK ANAB
    NQA AS9100 ANAB Badge
    ESD2020 Badge
    ESD2020 Association Badge
    GIDEP Badge
    GIDEP Badge
    Suntsu ERAI MemberVerification
    Suntsu ERAI Member Verification
    Available Shipping Methods
    FedEx
    UPS
    DHL
    Accepted Payment Methods
    American Express
    American Express
    Discover
    Discover
    MasterCard
    MasterCard
    Visa
    Visa
    UnionPay
    UnionPay

    Date Founded: 2006


    Headquarters: Eindhoven, North Brabant, Netherlands


    Employees: 38,000+


    Revenue: $10.53 Billion


    Certifications and Memberships: ISO9001:2015, IATF16949:2016


    Featured Products
    Latest News
    keyboard_arrow_up