MIMX9331XVTXMAB

IC
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC i.MX 93 2 Core, 64-Bit 250MHz, 1.7GHz 306-FCBGA (14x14)

Quantity 176 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 9331
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package306-FCBGA (14x14)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernetGBE (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 125°C (TJ)Package / Case306-LFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Speed250MHz, 1.7GHzSupplier Device Package306-FCBGA (14×14)USBUSB 2.0 (2)
Voltage – I/O1.8V

Overview of MIMX9331XVTXMAB – Dual ARM® Cortex®-A55 / Cortex®-M33 Microprocessor

The MIMX9331XVTXMAB is an NXP i.MX 93 family microprocessor featuring dual ARM® Cortex®-A55 application cores paired with a Cortex®-M33 real-time/core power domain. The platform combines high-performance application processing (up to 1.7 GHz for Cortex‑A55) with a low‑power 250 MHz Cortex‑M33 for deterministic control, making it suited for smart home, building control, contactless HMI, IoT edge and industrial applications.

Key Features

  • Core processors  Dual ARM® Cortex®-A55 application cores (up to 1.7 GHz) for 64‑bit application processing, plus an ARM® Cortex®-M33 core up to 250 MHz for real‑time and low‑power tasks.
  • Neural processing  Integrated NPU to accelerate machine learning inference (supports 8‑ and 16‑bit integer networks; 256 MACs up to 1.0 GHz as documented in the datasheet).
  • Memory and storage  16‑bit DRAM interface supporting LPDDR4/LPDDR4X with inline ECC and up to 2 GByte DDR memory space; on‑chip RAM and boot ROMs for both Cortex® clusters.
  • Display and imaging  Display and camera interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI; Image Sensor Interface (ISI) supports up to 2K resolutions and pixel rates up to 200 Mpixel/s.
  • Connectivity  Dual 1 Gbps Ethernet controllers (one supports Time Sensitive Networking), two USB 2.0 ports and CANbus for robust networked designs.
  • Security  Hardware security features including boot security, cryptography, eFuse, random number generator, secure RTC and tamper detection.
  • I/O and peripherals  Three uSDHC interfaces (including eMMC 5.1 and SDXC support) and multimedia acceleration via NEON™ MPE and FPU on application cores.
  • Package and environmental  306‑ball FCBGA (14 × 14 mm) package, surface mount, industrial qualification with operating temperature range −40°C to 125°C and RoHS compliance.

Typical Applications

  • Industrial HMI  Drives responsive user interfaces and secure connectivity while separating UI tasks (Cortex‑A55) from real‑time monitoring (Cortex‑M33).
  • Industrial vision and scanning  Uses the image sensor interface and on‑chip image processing to handle up to 2K camera inputs and preprocessing for vision tasks.
  • EV charging and industrial automation  Provides deterministic control with CANbus and real‑time Cortex‑M33 performance, plus robust Ethernet connectivity including TSN support.
  • Touchless access control and IoT edge  Combines ML acceleration, secure boot and cryptography for edge inference and protected device operation.

Unique Advantages

  • Balanced performance and real‑time control: Dual Cortex‑A55 cores for application workloads combined with a Cortex‑M33 for deterministic, low‑latency tasks.
  • Edge ML acceleration: Integrated NPU enables on‑device inference for 8‑ and 16‑bit neural networks, reducing reliance on external accelerators.
  • Industrial‑grade connectivity: Dual 1 Gbps Ethernet (one with TSN) plus CANbus and multiple USB ports simplify integration into industrial networks.
  • Comprehensive security features: Boot security, cryptography, eFuse, RNG, secure RTC and tamper detection support protected deployments.
  • Robust imaging pipeline: MIPI‑CSI, ISI with up to 2K support and on‑chip image processing enable camera‑based applications without extra components.
  • Wide temperature and industrial qualification: −40°C to 125°C operating range and industrial qualification make it suitable for demanding environments.

Why Choose MIMX9331XVTXMAB?

The MIMX9331XVTXMAB positions itself as a versatile, industrially qualified processor that pairs high‑performance 64‑bit application processing with a dedicated real‑time core and on‑chip ML acceleration. Its combination of secure boot, hardware cryptography, rich imaging interfaces and multi‑GbE connectivity addresses the needs of industrial HMI, vision, automation and IoT edge designs.

For developers and system designers seeking a single, integrated device to consolidate application processing, real‑time control and secure edge inference, this part offers a compact FCBGA package, broad I/O support and documented on‑chip resources to simplify system architecture and BOM.

Request a quote or submit a procurement inquiry to get pricing and availability for MIMX9331XVTXMAB. Our team can provide lead‑time information and volume pricing to support your design schedule.

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