MIMX9332AVTYMAB

IC
Part Description

Microprocessor IC

Quantity 1,643 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 9332
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSI
ECCNN/AEthernetGBE (2)Graphics AccelerationNo
HTS CodeN/AMoisture Sensitivity LevelN/AMounting MethodSurface Mount
Number of Cores/Bus Width2, 1 Core, 64-BitQualificationAutomotiveRAM ControllersLPDDR4
REACH ComplianceREACH UnknownRoHS ComplianceUnknownUSBUSB 2.0 (2)

Overview of MIMX9332AVTYMAB – Microprocessor IC

The MIMX9332AVTYMAB is a high-integration microprocessor IC based on dual Arm® Cortex®-A55 application cores and a Cortex®-M33 real-time core. It combines multi-core application processing, a dedicated neural processing unit (NPU) for machine‑learning inference, and a rich set of I/O to address smart home, building control, contactless HMI, IoT edge and industrial applications.

Designed for power-optimized edge compute, the device pairs performance (Cortex‑A55 up to 1.7 GHz) and efficient real-time control (Cortex‑M33 up to 250 MHz) with integrated memory interfaces, image-sensor support, high-speed networking and hardware security features to simplify system design and deployment.

Key Features

  • Core Architecture  Dual Arm® Cortex®-A55 application cores operating up to 1.7 GHz, plus a Cortex®-M33 real-time core up to 250 MHz for low-power and deterministic tasks.
  • Neural Processing Unit (NPU)  Integrated NPU with 256 MACs operating up to 1.0 GHz and 2 OPS/MAC to accelerate 8-bit and 16-bit integer neural network inference.
  • Media and DSP  Media Processing Engine (MPE) with Arm® NEON™ support and a floating point unit (VFPv4‑D16) for multimedia and signal processing workloads.
  • Memory and Storage  Supports LPDDR4/LPDDR4X with inline ECC and up to a 2 Gbyte DDR address space; FlexSPI flash with XIP support; multiple uSDHC interfaces including eMMC 5.1 (HS400) and SDXC/SDIO options.
  • Image Sensor Interface (ISI)  Programmable image input with support up to 2K horizontal resolution, pixel rates up to 200 Mpixel/s, image downscaling, color space conversion and interlaced-to-progressive conversion.
  • Display Interfaces  Integrated controllers for LCD, LVDS, MIPI-CSI and MIPI-DSI to support a range of user‑interface and camera configurations.
  • Networking and USB  Dual 1 Gbps Ethernet controllers (one supporting Time Sensitive Networking), and two USB 2.0 ports for connectivity and peripheral integration.
  • Security and Trust  Hardware security features including boot security, cryptography, eFuse, a random number generator, secure RTC and tamper detection to support secure boot and trusted execution.
  • On‑Chip Memory and Boot  Dedicated Boot ROMs (256 KB each for A55 and M33) and 640 KB on-chip RAM to accelerate system bring-up and secure boot flows.
  • Package and Compliance  Surface-mount device with RoHS-compliant status for environmental compliance in assembly.

Typical Applications

  • Smart Home  Edge compute and HMI control for appliances, voice/UI processing and local machine-learning inference.
  • Building Control  Centralized or distributed controllers for HVAC, access control and sensor aggregation requiring deterministic control and networking.
  • Contactless HMI  Camera and sensor interfacing with image processing and ML inference for gesture, presence or touchless interfaces.
  • IoT Edge Compute  Local inference, protocol bridging and secure device management with dual application cores and a real-time domain for I/O responsiveness.
  • Industrial  Gateway and compute nodes requiring Ethernet connectivity with TSN support, robust security features and real-time control.

Unique Advantages

  • Balanced Heterogeneous Processing: Dual Cortex‑A55 cores for application workloads plus a Cortex‑M33 for deterministic control simplifies partitioning of real-time and high-level tasks.
  • Built‑in ML Acceleration: On‑chip NPU with 256 MACs accelerates integer neural networks, reducing the need for external accelerators and lowering system complexity.
  • Comprehensive Imaging Support: ISI with up to 2K resolution and 200 Mpixel/s pixel rate enables camera-based HMI and vision pre-processing without large external subsystems.
  • Robust Connectivity: Dual 1 Gbps Ethernet (one with TSN capability) plus multiple storage interfaces and USB provide flexible options for networking and peripheral expansion.
  • Hardware Security Building Blocks: Boot security, cryptography, eFuse, RNG, secure RTC and tamper detection help implement layered device trust and secure boot chains.
  • Memory Ecosystem Support: LPDDR4/LPDDR4X with inline ECC and multi-mode uSDHC/eMMC support enable scalable memory and storage configurations for diverse application needs.

Why Choose MIMX9332AVTYMAB?

The MIMX9332AVTYMAB positions itself as a power-optimized, highly integrated processor for edge and embedded systems that require combined application and real-time processing, machine‑learning acceleration, and broad I/O. Its mix of dual Cortex®-A55 cores, a Cortex®-M33 controller, an NPU, extensive imaging and networking interfaces, and hardware security primitives lets designers consolidate system functions and reduce BOM complexity.

This device is suited for engineers building smart home, building automation, contactless HMI, IoT edge and industrial solutions that demand local inference, responsive control, and secure operation while leveraging a memory and connectivity-rich platform for scalability.

Request a quote or submit a purchase inquiry to receive pricing and availability information for the MIMX9332AVTYMAB. Our sales team can provide lead-time details and support for your BOM planning.

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    Date Founded: 2006


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