MIMX9352CVTXMAB

IC
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC i.MX 93 2, 1 Core, 64-Bit 250MHz, 1.7GHz 306-FCBGA (14x14)

Quantity 338 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 9352
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package306-FCBGA (14x14)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernetGBE (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2, 1 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case306-LFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Speed250MHz, 1.7GHzSupplier Device Package306-FCBGA (14×14)USBUSB 2.0 (2)
Voltage – I/O1.8V

Overview of MIMX9352CVTXMAB – ARM Cortex Application Processor

The MIMX9352CVTXMAB is an industrial-qualified microprocessor from the NXP i.MX 9352 family built around ARM® Cortex® application and real-time cores. It combines dual Cortex‑A55 application processors with an ARM Cortex‑M33 real-time core and an integrated Neural Processing Unit (NPU) to address compute‑intensive and control tasks in embedded systems.

Designed for edge and industrial use, the device delivers a balance of performance and power efficiency while integrating robust interfaces and security features for industrial human‑machine interfaces, vision and automation applications.

Key Features

  • CPU Subsystem Dual ARM Cortex‑A55 application processors operating up to 1.7 GHz and a Cortex‑M33 real‑time core operating up to 250 MHz for deterministic control and low‑power tasks.
  • Neural Processing Unit (NPU) Integrated NPU with 256 MACs operating up to 1.0 GHz, targeting 8‑bit and 16‑bit integer RNN workloads and supporting 8‑bit weights for on‑device ML inference.
  • Memory and Storage Supports LPDDR4/LPDDR4X with inline ECC and up to 2 Gbyte DDR memory space; on‑chip RAM (640 KB) plus boot ROM for Cortex‑A55 and Cortex‑M33.
  • Display and Image Interfaces Display controllers and image interfaces include LCD, LVDS, MIPI‑CSI and MIPI‑DSI with programmable resolutions up to 2K and image processing features such as color space conversion and downscaling.
  • Connectivity Dual 1 Gbps Ethernet controllers (one supporting Time Sensitive Networking), two USB 2.0 ports, CANbus and multiple SD/eMMC host interfaces (eMMC 5.1, SDXC, SDIO) to support diverse system I/O.
  • Security Hardware security features include boot security, cryptography accelerators, eFuse, true random number generator, secure RTC and tamper detection to support secure boot and runtime protection.
  • System Reliability Cache and memory protection with parity/ECC on L1/L2/TLB and on external memory interfaces; industrial qualification and RoHS compliance for deployment in harsh environments.
  • Package and Thermal Surface‑mount 306‑FCBGA package (14 × 14 mm) rated for industrial operating temperatures from −40 °C to 105 °C and 1.8 V I/O signaling.

Typical Applications

  • Industrial HMI High‑performance application cores, display interfaces and security features enable responsive, secure human‑machine interfaces for factories and control rooms.
  • Industrial Vision & Scanning MIPI‑CSI support, image processing, and the NPU enable on‑device image capture, preprocessing and machine‑learning inference for vision systems and scanners.
  • Industrial Automation & Grid Equipment Dual Gigabit Ethernet (with TSN capability), CANbus and robust security features support deterministic networking and protected control in automation and energy equipment.
  • Touchless Access & Building Control Combined low‑latency real‑time processing (Cortex‑M33) and application processing (Cortex‑A55) allow responsive sensor fusion and secure, connected building control systems.

Unique Advantages

  • Heterogeneous compute architecture: Dual Cortex‑A55 cores plus a Cortex‑M33 core and an NPU provide a flexible partitioning of workloads—application, real‑time control and ML inference—within a single package.
  • Integrated security primitives: On‑chip cryptography, eFuses, RNG and tamper detection simplify secure boot and runtime protection, reducing external security hardware requirements.
  • Industrial connectivity: Dual 1 Gbps Ethernet, CANbus and multiple SD/eMMC/USB interfaces support a wide range of industrial networking and storage options for gateway and edge designs.
  • Memory resilience: LPDDR4/LPDDR4X support with inline ECC and parity/ECC protection across caches and TLBs improves data integrity for long‑life industrial deployments.
  • Qualified for industrial environments: Rated for −40 °C to 105 °C operation and delivered in a compact 306‑FCBGA surface‑mount package for reliable deployment in harsh conditions.

Why Choose MIMX9352CVTXMAB?

The MIMX9352CVTXMAB combines multi‑core application performance, deterministic real‑time processing and on‑chip ML acceleration with industrial‑grade interfaces and security features. This integration reduces system complexity while enabling responsive, connected and protected embedded solutions.

It is well suited for engineers designing industrial HMI, vision systems, automation gateways and energy equipment who require a scalable platform with strong connectivity, memory resilience and hardware security for long‑term deployments.

Request a quote or submit a pricing inquiry to evaluate the MIMX9352CVTXMAB for your next industrial embedded design. Our team can provide availability and support information for production planning and integration.

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