MIMX9352XVTXMAB

The MIMX9352XVTXMAB is an NXP i.MX 9352 series microprocessor IC combining ARM® Cortex®-A55 application cores with an ARM® Cortex®-M33 real-time core. It delivers a mix of high-performance application processing and low-power real-time control for embedded and industrial systems.

Designed for smart home, building control, contactless HMI, IoT edge and industrial applications, the device emphasizes integration, deterministic control and edge machine-learning capability to streamline system design and reduce BOM complexity.

Key Features

• Core architecture — Dual ARM Cortex-A55 application processors (up to 1.7 GHz) plus a general-purpose ARM Cortex-M33 real-time core running up to 250 MHz, providing a separation of application and control tasks.
• Neural Processing Unit (NPU) — Integrated NPU capable of 256 MACs up to 1.0 GHz targeting 8‑bit and 16‑bit integer networks for on-device inference and ML acceleration.
• Memory and storage interfaces — 16-bit DRAM interface supporting LPDDR4/LPDDR4X with inline ECC and up to 2 GByte DDR space; multiple uSDHC hosts including eMMC 5.1 (HS400 DDR) and SDXC options.
• Image and display — Image Sensor Interface (ISI) supporting common pixel formats, programmable resolutions up to 2K and pixel rates up to 200 Mpixel/s; display interfaces include LCD, LVDS, MIPI-CSI and MIPI-DSI.
• Connectivity — Dual 1 Gbps Ethernet controllers (one with Time Sensitive Networking support), USB 2.0 (2 ports), and CANbus/CAN-FD for robust networked control.
• Security and reliability — Hardware boot security, cryptography, eFuse, true random number generator, secure RTC and tamper detection for secure embedded deployments.
• On-chip memory and boot — Separate 256 KB boot ROM for Cortex-A55 and 256 KB boot ROM for Cortex-M33, plus 640 KB on-chip RAM to support fast startup and secure boot scenarios.
• Industrial-grade qualification and temperature range — Extended industrial qualification with operating temperature range of −40°C to 125°C for demanding environments.
• Package and IO — 306-FCBGA (14 × 14 mm) surface-mount package with 1.8 V I/O support for standard embedded PCB designs.

Typical Applications

• Industrial Human Machine Interface (HMI) — Drives touchscreen and display subsystems while handling application logic and secure boot for operator interfaces.
• Industrial vision and scanning — Image Sensor Interface and on-chip image processing enable 2K capture, downscaling and color-space conversion for vision and scanning systems.
• IoT edge and contactless HMI — Combines application cores, real-time control and NPU acceleration for low-latency inference and secure edge processing.
• Energy and metering equipment — Industrial qualification, robust communications (Gigabit Ethernet, CANbus) and tamper detection support grid, meter and charging applications.

Unique Advantages

• Dual-domain processing: Application-grade Cortex-A55 cores paired with a Cortex-M33 real-time core enable separation of high-performance tasks and deterministic control.
• Edge ML acceleration: Integrated NPU offers on-device inference for 8‑bit/16‑bit networks, reducing latency and offload to cloud resources.
• Broad multimedia I/O: High-speed ISI and multiple display interfaces simplify camera and HMI integration for vision and user-interface products.
• Industrial connectivity: Dual 1 Gbps Ethernet (one with TSN), USB, and CANbus/CAN-FD support high-bandwidth, deterministic and field-level communications.
• Security-focused hardware: Boot security, cryptography, eFuse and RNG provide building blocks for secure system designs and protected firmware.
• Industrial robustness: Extended temperature range (−40°C to 125°C) and industrial qualification help ensure reliable operation in harsh environments.

Why Choose MIMX9352XVTXMAB?

The MIMX9352XVTXMAB positions itself as a highly integrated solution for embedded and industrial designs that require application performance, real-time control and on-edge ML capability. Its combination of Cortex-A55 application cores, Cortex-M33 real-time core and an NPU provides flexible partitioning of workloads to optimize power and responsiveness.

Designed and supported by NXP Semiconductors, this device is suitable for developers building industrial HMI, vision, IoT edge, gateway and energy equipment where secure boot, robust connectivity and extended temperature operation are required. The integrated interfaces and memory options simplify system architecture and help accelerate time-to-market.

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