MIMX9351XVTXMAB

The MIMX9351XVTXMAB is an NXP i.MX 93 series microprocessor IC featuring dual Arm® Cortex®-A55 application processors and an Arm® Cortex®-M33 for real-time and low-power tasks. It combines multi-core application processing, a dedicated neural processing unit (NPU), and a flexible set of high-speed interfaces to address industrial and IoT edge designs.

Targeted at industrial and embedded markets, this device delivers balanced performance and system integration with hardware security primitives, dual 1 Gbps Ethernet, camera/display interfaces, and support for LPDDR4 memory with inline ECC.

Key Features

• Dual Application and Real-Time Cores – Two Arm® Cortex®-A55 processors operating up to 1.7 GHz for application workloads, plus a Cortex®-M33 CPU operating up to 250 MHz for real-time and low-power processing.
• Neural Processing Unit (NPU) – On-chip NPU capability described as 256 MACs operating up to 1.0 GHz (targeting 8-bit and 16-bit integer workloads), enabling on-device machine learning inference.
• Memory Subsystem – 16-bit DRAM interface supporting LPDDR4/LPDDR4X with inline ECC and up to 2 GByte DDR memory space; on-chip RAM and boot ROM for system boot and runtime.
• Image and Display Interfaces – Image Sensor Interface (ISI) supporting programmable resolutions up to 2K and pixel rates up to 200 Mpixel/s; display controller support including LCD, LVDS, MIPI-CSI, and MIPI-DSI.
• High-Speed Connectivity – Dual 1 Gbps Ethernet controllers (one supporting Time Sensitive Networking), two USB 2.0 ports, and CANbus for robust control networks.
• Storage and Host Controllers – Multiple uSDHC interfaces including eMMC 5.1 (HS400 DDR signaling) and SDXC support for high-performance onboard storage options.
• Security and Trust – Hardware security features including boot security, cryptography, eFuse, random number generator, secure RTC, and tamper detection.
• Package, Power and Temp – Supplied in a 306-FCBGA (14×14 mm) package, 1.8 V IO support, industrial qualification, and operating temperature range of −40 °C to 125 °C.
• Reliability and On-Chip Memory – Boot ROMs for both Cortex®-A55 and Cortex®-M33, on-chip RAM and TCM, and cache/ECC protections noted for system robustness.

Typical Applications

• Industrial Human Machine Interface (HMI) – Driving responsive user interfaces and display pipelines with support for LCD, LVDS, and MIPI-DSI.
• Industrial Vision and Scanning – Camera input and image processing via the Image Sensor Interface for applications such as machine vision and scanning systems.
• EV Charging and Energy Equipment – Gateway and control functions leveraging dual Gigabit Ethernet, CANbus, and real-time Cortext-M33 control.
• Industrial Automation and Access Control – Real-time control, secure boot, and cryptographic features suited for touchless access control and automation nodes.
• Energy Metering and Grid Equipment – Secure, industrial-temperature operation with tamper detection and hardware cryptography for critical infrastructure devices.

Unique Advantages

• Heterogeneous Processing – Combination of high-performance Cortex-A55 cores and a Cortex-M33 real-time core enables separation of application and control tasks on a single device.
• On-Device ML Acceleration – Integrated NPU resources allow local inference for integer-based neural networks, reducing off-chip processing requirements.
• Industrial-Grade Operation – Extended operating temperature (−40 °C to 125 °C) and industrial qualification support deployment in demanding environments.
• Comprehensive Security – Multiple hardware security primitives (boot security, eFuses, RNG, secure RTC, tamper detection) help protect firmware and system integrity.
• Robust Connectivity – Dual 1 Gbps Ethernet (with TSN support), CANbus, and multiple host/storage interfaces simplify integration into industrial networks and gateways.
• Memory Integrity – LPDDR4/LPDDR4X support with inline ECC and on-chip memory blocks contribute to system reliability and data integrity.

Why Choose MIMX9351XVTXMAB?

The MIMX9351XVTXMAB positions itself as a highly integrated processor solution for embedded and industrial applications that require a blend of application-level performance, real-time control, and on-device machine learning. With dual Cortex-A55 cores, a Cortex-M33 core, an NPU, robust connectivity and storage options, and industrial temperature qualification, it is suited to designs that demand both compute versatility and system reliability.

This device is appropriate for engineers building industrial HMI, vision, gateway, and control systems who need a single-package solution that combines secure boot and hardware cryptography, Ethernet and CAN connectivity, and memory features that include inline ECC. Its package and industrial qualification support long-term deployment in harsh environments while reducing BOM complexity.

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