MIMX9351CVTXMAB

IC
Part Description

ARM® Cortex®-A55, ARM® Cortex®-M33 Microprocessor IC i.MX 93 2 Core, 64-Bit 250MHz, 1.7GHz 306-FCBGA (14x14)

Quantity 895 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part Seriesi.MX 9351
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time2 Weeks
Datasheet

Specifications & Environmental

Co-Processors/DSPMultimedia; NEON™ MPECore ProcessorARM® Cortex®-A55, ARM® Cortex®-M33Device Package306-FCBGA (14x14)
Display & Interface ControllersLCD, LVDS, MIPI-CSI, MIPI-DSIECCNN/AEthernetGBE (2)
Graphics AccelerationNoHTS CodeN/AMoisture Sensitivity LevelN/A
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°C (TJ)Package / Case306-LFBGA, FCBGARAM ControllersLPDDR4
REACH ComplianceREACH UnknownRoHS ComplianceUnknownSecurity FeaturesBoot Security, Cryptography, eFuse, Random Number Generator, Secure RTC, Tamper Detection
Speed250MHz, 1.7GHzSupplier Device Package306-FCBGA (14×14)USBUSB 2.0 (2)
Voltage – I/O1.8V

Overview of MIMX9351CVTXMAB – Dual‑Core 64‑Bit Microprocessor (Cortex‑A55 + Cortex‑M33)

The MIMX9351CVTXMAB is an industrial‑qualified microprocessor IC from NXP’s i.MX 93 family that combines high‑performance 64‑bit application cores with a low‑power real‑time core. It integrates two ARM Cortex‑A55 processors (up to 1.7 GHz) alongside an ARM Cortex‑M33 running up to 250 MHz, targeted at smart home, building control, contactless HMI, IoT edge and industrial applications.

Designed for edge intelligence and robust networked systems, this device delivers a mix of compute, machine‑learning acceleration, secure boot and extensive connectivity in a 306‑FCBGA (14×14) surface‑mount package rated for −40 °C to 105 °C operation.

Key Features

  • CPU subsystem Two ARM Cortex‑A55 cores operating up to 1.7 GHz with 32 KB L1 instruction and data caches per core, 64 KB per‑core L2 cache, and a 256 KB cluster L3 cache; plus an ARM Cortex‑M33 core up to 250 MHz with 16 KB system and code caches and 256 KB tightly coupled memory (TCM).
  • Neural processing & multimedia Integrated Neural Processing Unit (NPU) capable of ML inference (256 MACs operating up to 1.0 GHz) and a Media Processing Engine (MPE) with ARM NEON support and floating point unit for multimedia acceleration.
  • Memory & boot 16‑bit external DRAM interface supporting LPDDR4/LPDDR4X with inline ECC, on‑chip RAM (640 KB) and dedicated boot ROMs (256 KB each for Cortex‑A55 and Cortex‑M33) for secure boot support.
  • Display & image interfaces Display and camera interfaces including LCD, LVDS, MIPI‑CSI and MIPI‑DSI; image sensor interface supports programmable resolutions up to 2K and pixel rates up to 200 Mpixel/s with on‑chip image processing and downscaling.
  • Connectivity Dual 1 Gbps Ethernet controllers (one supporting Time Sensitive Networking per datasheet), two USB 2.0 ports, and CAN bus for robust networked control.
  • Security Hardware security features including boot security, cryptography acceleration, eFuses, random number generator, secure RTC and tamper detection.
  • Package & environmental 306‑FCBGA (14×14) surface‑mount package, industrial qualification, 1.8 V I/O and operating temperature range −40 °C to 105 °C.

Typical Applications

  • Industrial HMI Enables responsive user interfaces and touch control by combining application processing on Cortex‑A55 with real‑time management on the Cortex‑M33.
  • Industrial vision & scanning Image sensor interface and on‑chip image processing support camera inputs up to 2K for vision, scanning and inspection systems.
  • IoT edge & building control Local inference with the NPU plus secure boot and network interfaces make it suitable for edge gateways and building automation nodes.
  • EV charging & energy equipment Dual GBE, CAN bus connectivity and industrial temperature rating suit energy meters, grid equipment and EV charging station controllers.

Unique Advantages

  • Heterogeneous processing: Combines dual Cortex‑A55 64‑bit application cores with a Cortex‑M33 real‑time core to consolidate application and control functions in one device.
  • On‑device ML acceleration: Integrated NPU and NEON/MPE reduce the need for external accelerators, enabling local inference and faster response for edge applications.
  • Industrial readiness: Industrial qualification and −40 °C to 105 °C operation support deployment in harsh environments and long‑life applications.
  • Comprehensive connectivity: Dual 1 Gbps Ethernet (one TSN capable), USB, CAN and multiple SD/eMMC interfaces simplify networked and storage design choices.
  • Security built in: Boot ROMs, hardware cryptography, eFuses and tamper detection provide a foundation for secure products and protected supply chains.
  • Flexible memory support: LPDDR4/LPDDR4X with inline ECC and multiple host storage interfaces offer scalable memory and storage configurations.

Why Choose MIMX9351CVTXMAB?

The MIMX9351CVTXMAB is positioned for embedded designs that require a balance of application performance, real‑time control and secure edge processing. Its combination of Cortex‑A55 application cores, Cortex‑M33 real‑time core, integrated NPU and industrial qualification makes it suitable for industrial HMI, vision, gateway and energy applications.

Engineers will find a compact, highly integrated solution with robust connectivity and security primitives that support scalable product development and long‑term deployment in industrial environments.

Request a quote or submit an inquiry to receive pricing, availability and lead‑time information for the MIMX9351CVTXMAB. Our team can provide technical details to help evaluate the device for your design.

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