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Total Products: 5,357
ImageData
Sheet		Part NumberManufacturerDescriptionCategoryDevice PackageVoltageOperating
Temp		Additional SpecificationsQtyGet A
Quote
MPC885CZP133
MPC885CZP133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
1,085
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MPC885CZP66
MPC885CZP66NXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A-40°C ~ 100°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 100°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
836
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QUOTE
MPC885VR133
MPC885VR133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
872
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QUOTE
MPC885VR66
MPC885VR66NXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
42
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MPC885VR66-NXP
MPC885VR66-NXPNXP SemiconductorsIC MPU MPC8XX 66MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
66MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
1,865
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QUOTE
MPC885VR80
MPC885VR80NXP SemiconductorsIC MPU MPC8XX 80MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
80MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
432
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QUOTE
MPC885ZP133
MPC885ZP133NXP SemiconductorsIC MPU MPC8XX 133MHZ 357BGAMicroprocessors357-PBGA (25x25)N/A0°C ~ 95°C (TA)
Core Processor:
MPC8xx
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
133MHz
Co-Processors/DSP:
Communications; CPM, Security; SEC
RAM Controllers:
DRAM
Graphics Acceleration:
No
Ethernet:
10Mbps (3), 10/100Mbps (2)
USB:
USB 2.0 (1)
Voltage – I/O:
3.3V
Operating Temperature:
0°C ~ 95°C (TA)
Security Features:
Cryptography
Mounting Type:
Surface Mount
Package / Case:
357-BBGA
Supplier Device Package:
357-PBGA (25×25)
Additional Interfaces:
HDLC/SDLC, I2C, IrDA, PCMCIA, SPI, TDM, UART/USART
803
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QUOTE
MPL485A-I/AJA
MPL485A-I/AJAMicrochip TechnologyIC MPU 100MHZ 121TFBGAMicroprocessors121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES 128, 192, 256
Mounting Type:
Surface Mount
Package / Case:
121-TFBGA
Supplier Device Package:
121-TFBGA (10×10)
Additional Interfaces:
I2C, I2S, DMA, SPI, POR, PWM, UART/USART, WDT
1,441
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MPL485AT-I/AJA
MPL485AT-I/AJAMicrochip TechnologyIC MPU 100MHZ 121TFBGAMicroprocessors121-TFBGA (10x10)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-M4
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
100MHz
RAM Controllers:
SRAM
Graphics Acceleration:
No
USB:
USB 2.0 (1)
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
AES 128, 192, 256
Mounting Type:
Surface Mount
Package / Case:
121-TFBGA
Supplier Device Package:
121-TFBGA (10×10)
Additional Interfaces:
I2C, I2S, DMA, SPI, POR, PWM, UART/USART, WDT
582
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N/A
MQ801866IntelRISC MPU, 16-BITMicroprocessorsN/AN/AN/A

N/A

720
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N/A
MQ80386-16IntelRISC MPU, 32-BIT, 16MHZ CQFP164MicroprocessorsN/AN/AN/A

N/A

191
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QUOTE
N/A
MQ80386-25IntelIC MPU 386 25MHZ 164CQFPMicroprocessors164-CQFP (28.71x28.71)N/A-55°C ~ 125°C (TC)
Core Processor:
Intel 386®
Speed:
25MHz
Co-Processors/DSP:
80386
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
-55°C ~ 125°C (TC)
Mounting Type:
Surface Mount
Package / Case:
164-BCQFP Exposed Pad
Supplier Device Package:
164-CQFP (28.71×28.71)
1,625
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N/A
MQ80960MC-25IntelIC MPU 25MHZ 164CQFPMicroprocessors164-CQFP (28.71x28.71)N/A0°C ~ 85°C (TC)
Core Processor:
Intel® 80960XA
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
164-BCQFP Exposed Pad
Supplier Device Package:
164-CQFP (28.71×28.71)
783
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N/A
MQ80960MC25IntelIC MPU 25MHZ 164CQFPMicroprocessors164-CQFP (28.71x28.71)N/A0°C ~ 85°C (TC)
Core Processor:
Intel® 80960XA
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
25MHz
Graphics Acceleration:
No
Voltage – I/O:
5V
Operating Temperature:
0°C ~ 85°C (TC)
Mounting Type:
Surface Mount
Package / Case:
164-BCQFP Exposed Pad
Supplier Device Package:
164-CQFP (28.71×28.71)
394
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QUOTE
MVF30NN151CKU26
MVF30NN151CKU26NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
796
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QUOTE
MVF30NN152CKU26
MVF30NN152CKU26NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
359
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MVF30NS151CKU26
MVF30NS151CKU26NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
1,089
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QUOTE
MVF30NS152CKU26
MVF30NS152CKU26NXP SemiconductorsIC MPU VYBRID 266MHZ 176HLQFPMicroprocessors176-HLQFP (24x24)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
266MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Security Features:
ARM TZ, CAAM, HAB, RTIC, Secure JTAG, SNVS, Tamper, TZ ASC, TZ WDOG
Mounting Type:
Surface Mount
Package / Case:
176-LQFP Exposed Pad
Supplier Device Package:
176-HLQFP (24×24)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
254
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QUOTE
MVF50NN151CMK40
MVF50NN151CMK40NXP SemiconductorsIC MPU VYBRID 400MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
400MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
872
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QUOTE
MVF50NN151CMK50
MVF50NN151CMK50NXP SemiconductorsIC MPU VYBRID 500MHZ 364LFBGAMicroprocessors364-LFBGA (17x17)N/A-40°C ~ 85°C (TA)
Core Processor:
ARM® Cortex®-A5
Number of Cores/Bus Width:
1 Core, 32-Bit
Speed:
500MHz
Co-Processors/DSP:
Multimedia; NEON™ MPE
RAM Controllers:
LPDDR2, DDR3, DRAM
Graphics Acceleration:
Yes
Display & Interface Controllers:
DCU, GPU, LCD, VideoADC, VIU
Ethernet:
10/100Mbps (2)
USB:
USB 2.0 OTG + PHY (1)
Voltage – I/O:
3.3V
Operating Temperature:
-40°C ~ 85°C (TA)
Mounting Type:
Surface Mount
Package / Case:
364-LFBGA
Supplier Device Package:
364-LFBGA (17×17)
Additional Interfaces:
CAN, I2C, IrDA, LIN, SCI, SDHC, SPI, UART/USART
725
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QUOTE

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