MPC885CZP66

The MPC885CZP66 is a single‑core, 32‑bit microprocessor in the MPC885 family, featuring a 66 MHz MPC8xx core built on Power Architecture™ technology. Designed for embedded and communications applications, it integrates a communications processor module (CPM), security/cryptography support, DRAM controller functions and multiple Ethernet and USB interfaces to simplify system design and improve integration.

Key Features

• Core & Architecture – MPC8xx single‑issue 32‑bit core (1 core, 32‑bit) operating at 66 MHz with on‑chip MMU and processor features defined by the MPC885 family.
• Memory & Cache – Integrated DRAM controller and family architecture that includes instruction and data caches as described in the MPC885 hardware specification.
• Communications & Security – Communications Processor Module (CPM) and a security/encryption block (SEC) provide hardware support for communications and cryptography functions.
• Ethernet & USB – Multiple Ethernet controllers (three 10 Mbps and two 10/100 Mbps ports as specified) and one USB 2.0 interface enable robust wired connectivity options.
• Additional Interfaces – HDLC/SDLC support for serial link protocols and CPM‑managed communications channels for flexible peripheral interfacing.
• Power & I/O – 3.3 V I/O voltage for standard embedded system compatibility.
• Package & Mounting – 357‑PBGA (25 × 25) supplier device package, surface‑mount mounting type.
• Industrial Qualification & Temperature Range – Industrial qualification with an operating temperature range of −40 °C to 100 °C for deployment in demanding environments.
• RoHS Compliance – RoHS‑compliant device for environmental regulatory adherence.

Typical Applications

• Embedded Networking Equipment – Use the integrated Ethernet controllers and CPM for routers, gateways and communications interfaces requiring multiple PHYs and protocol handling.
• Industrial Controllers – Industrial control systems benefit from the industrial temperature range, DRAM controller support and 3.3 V I/O compatibility.
• Secure Communications Appliances – On‑chip security/cryptography blocks support devices that require hardware encryption for data in transit.
• USB‑Enabled Embedded Systems – Systems needing a USB 2.0 interface for host or device connectivity can leverage the integrated USB support.

Unique Advantages

• Highly integrated communications engine: The combination of an MPC8xx core, CPM and SIU reduces external controller requirements and simplifies board design.
• Multiple wired connectivity options: Several Ethernet controllers (10 Mbps and 10/100 Mbps) plus USB 2.0 provide versatile physical interfaces for networking and peripheral connectivity.
• Hardware security support: Built‑in security/cryptography capability enables offloading of cryptographic tasks from the CPU to improve system throughput.
• Industrial‑grade operation: −40 °C to 100 °C operating range and industrial qualification make the device suitable for harsh environments.
• Compact surface‑mount package: 357‑PBGA (25 × 25) ball grid array offers a high‑density form factor for space‑constrained designs.
• RoHS compliant: Meets environmental compliance requirements for modern manufacturing and deployment.

Why Choose MPC885CZP66?

The MPC885CZP66 positions itself as a compact, industrial‑qualified embedded microprocessor that brings together a Power Architecture™ MPC8xx core, communications co‑processing, hardware security and multiple wired interfaces in a single package. It is well suited for engineers building integrated networking, communications and industrial control systems who need a balance of on‑chip peripheral integration, security capability and rugged temperature performance.

With its 3.3 V I/O, DRAM controller support and 357‑PBGA footprint, the MPC885CZP66 offers a practical platform for designs that prioritize integration, predictable thermal/environmental behavior and straightforward BOM reduction through on‑chip communications and security features.

Request a quote or submit a procurement inquiry to evaluate the MPC885CZP66 for your next embedded or communications design.