MPC885CVR133

IC MPU MPC8XX 133MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25)

Quantity 1,097 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC885
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A002A1 FREEthernet10Mbps (3), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature-40°C ~ 100°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptographySpeed133MHz
Supplier Device Package357-PBGA (25×25)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC885CVR133 – IC MPU MPC8XX 133MHZ 357BGA

The MPC885CVR133 is a single‑core 32‑bit microprocessor in the MPC8xx family, built on Power Architecture™ technology and optimized for embedded and communications applications. The device integrates a MPC8xx core running at 133 MHz with on‑chip system integration and communications peripherals, delivering a compact, industrial‑qualified solution for networking, control and secure communications designs.

With integrated communications processing, cryptographic acceleration and a wide operating temperature range, the MPC885CVR133 targets embedded systems that require combined processor performance, peripheral integration and industrial robustness.

Key Features

  • Core  Single‑issue MPC8xx 32‑bit core operating at 133 MHz; includes thirty‑two 32‑bit general‑purpose registers for deterministic execution.
  • Power Architecture Technology  Implements Power Architecture™ technology with on‑chip MMUs and instruction/data caches for efficient code and data handling.
  • Caches  8‑Kbyte instruction cache and 8‑Kbyte data cache to improve system throughput for typical embedded workloads.
  • Communications Processing (CPM)  Integrated communications processor module (CPM) to handle serial protocols and offload I/O tasks.
  • Security  On‑chip security/co‑processor (SEC) providing cryptography features suitable for encrypted communications.
  • Memory Interface  DRAM controller support for external memory expansion.
  • Ethernet and USB  Multiple Ethernet controllers (three 10 Mbps, two 10/100 Mbps) and one USB 2.0 interface to support diverse networking and peripheral connections.
  • Serial Protocols  Additional interface support including HDLC/SDLC for common telecom and data link protocols.
  • Electrical  3.3 V I/O voltage for standard embedded system compatibility.
  • Package and Mounting  357‑PBGA (25 × 25 mm) package, surface‑mount for high‑density board designs.
  • Operating Range  Industrial qualification with operating temperature of −40 °C to 100 °C for deployment in demanding environments.
  • Bus and Timing Notes  External bus maximum frequency documented at up to 80 MHz; the 133 MHz core frequency supports 2:1 mode operation per device specification.

Typical Applications

  • Communications and Networking  Use as a compact host processor with multiple Ethernet interfaces and CPM for routers, gateways and network appliances.
  • Industrial Control  Embedded control systems that require industrial temperature operation and integrated I/O and memory interfaces.
  • Secure Communications  Devices requiring on‑chip cryptography acceleration for encrypted data paths and secure links.
  • Embedded Controllers  Single‑chip controller roles where integration of CPU, DRAM controller, serial protocols and USB reduce system BOM.

Unique Advantages

  • Highly integrated communications peripherals: On‑chip CPM plus multiple Ethernet controllers and USB 2.0 minimize external components and simplify board design.
  • Built‑in security acceleration: SEC co‑processor and cryptography features enable secure data handling without heavy software overhead.
  • Industrial temperature qualification: Rated for −40 °C to 100 °C operation to meet harsher environmental requirements.
  • Balanced performance and deterministic behavior: 133 MHz MPC8xx core with MMU and 8 KB instruction/data caches supports responsive embedded processing.
  • Compact, surface‑mount PBGA package: 357‑pin PBGA (25 × 25 mm) provides high pin density for complex system integration in a small footprint.
  • Standard 3.3 V I/O: Simplifies interfacing with common embedded peripherals and I/O standards.

Why Choose MPC885CVR133?

The MPC885CVR133 combines a 133 MHz MPC8xx Power Architecture core with integrated communications and security subsystems, presented in a 357‑pin PBGA package and qualified for industrial temperatures. This combination makes it well suited for embedded designs that need a single‑chip solution for networking, secure communications and control while reducing external components.

Designers seeking a robust, integrated MPU for industrial and communications applications will find the MPC885CVR133 offers a practical balance of performance, peripheral set and operating range, backed by the MPC885 family hardware specifications.

Request a quote or submit a quote request to obtain pricing, availability and lead‑time information for the MPC885CVR133.

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