MPC885CVR133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 1,097 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC885 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (3), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC885CVR133 – IC MPU MPC8XX 133MHZ 357BGA
The MPC885CVR133 is a single‑core 32‑bit microprocessor in the MPC8xx family, built on Power Architecture™ technology and optimized for embedded and communications applications. The device integrates a MPC8xx core running at 133 MHz with on‑chip system integration and communications peripherals, delivering a compact, industrial‑qualified solution for networking, control and secure communications designs.
With integrated communications processing, cryptographic acceleration and a wide operating temperature range, the MPC885CVR133 targets embedded systems that require combined processor performance, peripheral integration and industrial robustness.
Key Features
- Core Single‑issue MPC8xx 32‑bit core operating at 133 MHz; includes thirty‑two 32‑bit general‑purpose registers for deterministic execution.
- Power Architecture Technology Implements Power Architecture™ technology with on‑chip MMUs and instruction/data caches for efficient code and data handling.
- Caches 8‑Kbyte instruction cache and 8‑Kbyte data cache to improve system throughput for typical embedded workloads.
- Communications Processing (CPM) Integrated communications processor module (CPM) to handle serial protocols and offload I/O tasks.
- Security On‑chip security/co‑processor (SEC) providing cryptography features suitable for encrypted communications.
- Memory Interface DRAM controller support for external memory expansion.
- Ethernet and USB Multiple Ethernet controllers (three 10 Mbps, two 10/100 Mbps) and one USB 2.0 interface to support diverse networking and peripheral connections.
- Serial Protocols Additional interface support including HDLC/SDLC for common telecom and data link protocols.
- Electrical 3.3 V I/O voltage for standard embedded system compatibility.
- Package and Mounting 357‑PBGA (25 × 25 mm) package, surface‑mount for high‑density board designs.
- Operating Range Industrial qualification with operating temperature of −40 °C to 100 °C for deployment in demanding environments.
- Bus and Timing Notes External bus maximum frequency documented at up to 80 MHz; the 133 MHz core frequency supports 2:1 mode operation per device specification.
Typical Applications
- Communications and Networking Use as a compact host processor with multiple Ethernet interfaces and CPM for routers, gateways and network appliances.
- Industrial Control Embedded control systems that require industrial temperature operation and integrated I/O and memory interfaces.
- Secure Communications Devices requiring on‑chip cryptography acceleration for encrypted data paths and secure links.
- Embedded Controllers Single‑chip controller roles where integration of CPU, DRAM controller, serial protocols and USB reduce system BOM.
Unique Advantages
- Highly integrated communications peripherals: On‑chip CPM plus multiple Ethernet controllers and USB 2.0 minimize external components and simplify board design.
- Built‑in security acceleration: SEC co‑processor and cryptography features enable secure data handling without heavy software overhead.
- Industrial temperature qualification: Rated for −40 °C to 100 °C operation to meet harsher environmental requirements.
- Balanced performance and deterministic behavior: 133 MHz MPC8xx core with MMU and 8 KB instruction/data caches supports responsive embedded processing.
- Compact, surface‑mount PBGA package: 357‑pin PBGA (25 × 25 mm) provides high pin density for complex system integration in a small footprint.
- Standard 3.3 V I/O: Simplifies interfacing with common embedded peripherals and I/O standards.
Why Choose MPC885CVR133?
The MPC885CVR133 combines a 133 MHz MPC8xx Power Architecture core with integrated communications and security subsystems, presented in a 357‑pin PBGA package and qualified for industrial temperatures. This combination makes it well suited for embedded designs that need a single‑chip solution for networking, secure communications and control while reducing external components.
Designers seeking a robust, integrated MPU for industrial and communications applications will find the MPC885CVR133 offers a practical balance of performance, peripheral set and operating range, backed by the MPC885 family hardware specifications.
Request a quote or submit a quote request to obtain pricing, availability and lead‑time information for the MPC885CVR133.

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