MPC880ZP66

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 645 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC880
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPMCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN3A991A2Ethernet10Mbps (2), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceRoHS non-compliantSpeed66MHzSupplier Device Package357-PBGA (25×25)
USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC880ZP66 – IC MPU MPC8XX 66MHz 357BGA

The MPC880ZP66 is an NXP Semiconductors MPC8xx-series single-chip microprocessor featuring a 32-bit MPC8xx core running at 66 MHz. Designed for embedded controller and communications applications, the device integrates on-chip system and communications functionality to simplify system design.

With integrated communications processor resources, multiple Ethernet interfaces, a USB 2.0 port, and a DRAM controller, the MPC880ZP66 is suited to consumer-grade embedded networking and control systems that require compact, surface-mount packaging and 3.3 V I/O.

Key Features

  • Core  Single 32-bit MPC8xx core operating at 66 MHz, built on Power Architecture technology with integrated memory management and instruction/data caches as implemented across the MPC885/MPC880 family.
  • Memory and Bus  On-chip support for DRAM controllers and a system integration unit (SIU) to manage internal bus functions.
  • Communications and Offload  Communications Processor Module (CPM) and communications co-processor resources for protocol handling; additional HDLC/SDLC interfaces for serial protocol support.
  • Ethernet  Multiple Ethernet controllers: two 10 Mbps interfaces and two 10/100 Mbps interfaces to support varied networking configurations.
  • USB  Integrated USB 2.0 port (1) for host or device connectivity in embedded peripherals.
  • Power and I/O  3.3 V I/O voltage simplifies power supply design for standard embedded systems.
  • Package and Mounting  357-ball PBGA package (357-PBGA, 25 × 25 mm) in a surface-mount form factor to support compact board layouts.
  • Operational Range  Consumer-grade qualification with operating temperature range of 0°C to 95°C.
  • Regulatory  RoHS-compliant for lead-free assembly processes.
  • Graphics  No graphics acceleration—optimized for control and communications tasks rather than graphics processing.

Typical Applications

  • Embedded Networking Equipment  Use in routers, gateways, and network controllers that benefit from multiple Ethernet ports and on-chip communications processing.
  • Communications Controllers  Deployment in systems requiring protocol offload and serial link handling via the CPM and HDLC/SDLC interfaces.
  • USB-Enabled Embedded Devices  Integration into consumer-grade devices and peripherals that require a USB 2.0 interface alongside network connectivity.
  • Single-Chip Controller Applications  Compact embedded controllers that require DRAM support, integrated I/O, and a surface-mount PBGA package for space-constrained designs.

Unique Advantages

  • Integrated communications subsystems  On-chip CPM and serial protocol interfaces reduce external components and simplify firmware integration for communications tasks.
  • Multiple network interfaces  A combination of 10 Mbps and 10/100 Mbps Ethernet ports enables flexible networking topologies without additional MAC controllers.
  • Compact surface-mount PBGA  357-PBGA (25×25) package supports high-density board designs while keeping the processor footprint small.
  • Standard 3.3 V I/O  Aligns with common embedded power rails to streamline power supply design and system integration.
  • RoHS compliance  Facilitates lead-free manufacturing and regulatory alignment for consumer products.
  • Consumer-grade operating range  0°C to 95°C operation suits a wide range of consumer embedded environments.

Why Choose MPC880ZP66?

The MPC880ZP66 combines a 32-bit MPC8xx core with integrated communications peripherals and memory interfaces to deliver a compact, single-chip solution for embedded networking and controller applications. Its multi-Ethernet capability, USB 2.0 support, and CPM-based protocol offload reduce BOM complexity and board-level integration effort.

This part is appropriate for designers building consumer-grade embedded systems that need reliable communications features, standard 3.3 V I/O, and a surface-mount PBGA package. RoHS compliance and the MPC8xx family feature set provide a scalable foundation for product development and deployment.

Request a quote or submit an inquiry to receive pricing and availability information for the MPC880ZP66.

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