MPC880ZP66
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 645 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC880 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 3A991A2 | Ethernet | 10Mbps (2), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Speed | 66MHz | Supplier Device Package | 357-PBGA (25×25) | ||
| USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC880ZP66 – IC MPU MPC8XX 66MHz 357BGA
The MPC880ZP66 is an NXP Semiconductors MPC8xx-series single-chip microprocessor featuring a 32-bit MPC8xx core running at 66 MHz. Designed for embedded controller and communications applications, the device integrates on-chip system and communications functionality to simplify system design.
With integrated communications processor resources, multiple Ethernet interfaces, a USB 2.0 port, and a DRAM controller, the MPC880ZP66 is suited to consumer-grade embedded networking and control systems that require compact, surface-mount packaging and 3.3 V I/O.
Key Features
- Core Single 32-bit MPC8xx core operating at 66 MHz, built on Power Architecture technology with integrated memory management and instruction/data caches as implemented across the MPC885/MPC880 family.
- Memory and Bus On-chip support for DRAM controllers and a system integration unit (SIU) to manage internal bus functions.
- Communications and Offload Communications Processor Module (CPM) and communications co-processor resources for protocol handling; additional HDLC/SDLC interfaces for serial protocol support.
- Ethernet Multiple Ethernet controllers: two 10 Mbps interfaces and two 10/100 Mbps interfaces to support varied networking configurations.
- USB Integrated USB 2.0 port (1) for host or device connectivity in embedded peripherals.
- Power and I/O 3.3 V I/O voltage simplifies power supply design for standard embedded systems.
- Package and Mounting 357-ball PBGA package (357-PBGA, 25 × 25 mm) in a surface-mount form factor to support compact board layouts.
- Operational Range Consumer-grade qualification with operating temperature range of 0°C to 95°C.
- Regulatory RoHS-compliant for lead-free assembly processes.
- Graphics No graphics acceleration—optimized for control and communications tasks rather than graphics processing.
Typical Applications
- Embedded Networking Equipment Use in routers, gateways, and network controllers that benefit from multiple Ethernet ports and on-chip communications processing.
- Communications Controllers Deployment in systems requiring protocol offload and serial link handling via the CPM and HDLC/SDLC interfaces.
- USB-Enabled Embedded Devices Integration into consumer-grade devices and peripherals that require a USB 2.0 interface alongside network connectivity.
- Single-Chip Controller Applications Compact embedded controllers that require DRAM support, integrated I/O, and a surface-mount PBGA package for space-constrained designs.
Unique Advantages
- Integrated communications subsystems On-chip CPM and serial protocol interfaces reduce external components and simplify firmware integration for communications tasks.
- Multiple network interfaces A combination of 10 Mbps and 10/100 Mbps Ethernet ports enables flexible networking topologies without additional MAC controllers.
- Compact surface-mount PBGA 357-PBGA (25×25) package supports high-density board designs while keeping the processor footprint small.
- Standard 3.3 V I/O Aligns with common embedded power rails to streamline power supply design and system integration.
- RoHS compliance Facilitates lead-free manufacturing and regulatory alignment for consumer products.
- Consumer-grade operating range 0°C to 95°C operation suits a wide range of consumer embedded environments.
Why Choose MPC880ZP66?
The MPC880ZP66 combines a 32-bit MPC8xx core with integrated communications peripherals and memory interfaces to deliver a compact, single-chip solution for embedded networking and controller applications. Its multi-Ethernet capability, USB 2.0 support, and CPM-based protocol offload reduce BOM complexity and board-level integration effort.
This part is appropriate for designers building consumer-grade embedded systems that need reliable communications features, standard 3.3 V I/O, and a surface-mount PBGA package. RoHS compliance and the MPC8xx family feature set provide a scalable foundation for product development and deployment.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC880ZP66.

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