MPC885CZP133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 479 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC885 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (3), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | -40°C ~ 100°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | RoHS non-compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC885CZP133 – IC MPU MPC8XX 133MHz 357-PBGA (25×25)
The MPC885CZP133 is a single‑core 32‑bit microprocessor in the MPC885 family, featuring a 133 MHz MPC8xx core built on Power Architecture™ technology. Designed for embedded and communications applications, it integrates a communications processor module (CPM), security functions, DRAM controller support, and multiple wired networking interfaces to deliver an integrated platform for industrial and networking systems.
Key Features
- Core & Architecture 32‑bit MPC8xx single‑issue core running at 133 MHz; compatible with the Power Architecture definition and including thirty‑two 32‑bit general purpose registers.
- On‑chip Memory Instruction and data caches (8 KB each) to improve code and data locality for embedded workloads.
- Bus and Memory Interface External bus maximum frequency 80 MHz (1:1 mode supported at lower core frequencies; 133 MHz core supports 2:1 mode). Integrated DRAM controller support simplifies system memory design.
- Communications & Co‑processing Integrated Communications Processor Module (CPM) and security co‑processor (SEC) for communications offload and cryptography acceleration.
- Ethernet & USB Multiple Ethernet controllers (three 10 Mbps and two 10/100 Mbps interfaces) plus a USB 2.0 interface for connected embedded networking and peripheral connectivity.
- Additional Interfaces HDLC/SDLC support and other CPM‑driven serial interfaces for protocol handling and serial communications.
- Power & I/O 3.3 V I/O signaling for standard embedded interfacing.
- Package & Mounting 357‑ball PBGA package (25 × 25 mm), surface mount, for compact board integration.
- Operating Range & Qualification Industrial qualification with operating temperature range −40 °C to 100 °C for deployment in demanding environments.
- Environmental Compliance RoHS‑compliant supply status.
Typical Applications
- Industrial Communications Equipment — Multiport Ethernet and CPM support make this part suitable for protocol offload, switching control, and serial communications in industrial controllers.
- Networking Appliances — Integrated Ethernet controllers and USB 2.0 interface enable use in routers, gateways, and networked appliances requiring embedded processing and security.
- Secure Embedded Systems — On‑chip security co‑processor and cryptography features support embedded devices that require data protection and secure communications.
- Protocol Converters and Serial Gateways — HDLC/SDLC and CPM resources enable implementation of serial protocol handling and legacy interface bridging.
Unique Advantages
- Integrated Communications Subsystem: CPM plus multiple Ethernet controllers and HDLC/SDLC support reduce external logic and simplify board design for networking applications.
- Built‑in Security Acceleration: On‑chip SEC and cryptography features enable secure data handling without heavy software overhead.
- Industrial‑Ready Temperature Range: −40 °C to 100 °C qualification supports deployment in harsh and industrial environments.
- Compact PBGA Footprint: 357‑ball (25×25 mm) PBGA enables a high‑density implementation for space‑constrained embedded systems.
- Power Architecture Compatibility: The MPC8xx core’s Power Architecture heritage and 8 KB instruction/data caches provide a familiar programming and performance profile for embedded firmware developers.
Why Choose MPC885CZP133?
The MPC885CZP133 positions itself as an integrated, communications‑focused embedded processor for industrial and networking applications that require on‑chip protocol handling, multiple Ethernet interfaces, and built‑in security acceleration. Its 133 MHz MPC8xx core, combined with CPM resources, DRAM controller support, and industrial temperature qualification, makes it suitable for designs that demand reliable connectivity and secure data processing in compact hardware footprints.
For system designers and procurement teams building embedded networking, industrial communications, or secure gateway products, the MPC885CZP133 offers a balanced combination of integration, interface density, and environmental robustness aligned to long‑life embedded deployments.
Request a quote or submit an inquiry to receive pricing and availability information for the MPC885CZP133. Our team can provide lead‑time details and support for your procurement needs.

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