MPC885VR133
| Part Description |
MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25) |
|---|---|
| Quantity | 709 Available (as of October 8, 2026) |
| Product Category | Microprocessors |
|---|---|
| Part Series | MPC885 |
| Manufacturer | NXP USA Inc. |
| Manufacturing Status | Obsolete |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Co-Processors/DSP | Communications; CPM, Security; SEC | Core Processor | MPC8xx | Device Package | 357-PBGA (25x25) | ||
|---|---|---|---|---|---|---|---|
| ECCN | 5A002A1 FRE | Ethernet | 10Mbps (3), 10/100Mbps (2) | Graphics Acceleration | No | ||
| HTS Code | 8542.31.0001 | Moisture Sensitivity Level | 3 (168 Hours) | Mounting Method | Surface Mount | ||
| Mounting Type | Surface Mount | Number of Cores/Bus Width | 1 Core, 32-Bit | Operating Temperature | 0°C ~ 95°C (TA) | ||
| Package / Case | 357-BBGA | RAM Controllers | DRAM | REACH Compliance | REACH Unaffected | ||
| RoHS Compliance | ROHS3 Compliant | Security Features | Cryptography | Speed | 133MHz | ||
| Supplier Device Package | 357-PBGA (25×25) | USB | USB 2.0 (1) | Voltage – I/O | 3.3V |
Overview of MPC885VR133 – IC MPU MPC8XX 133MHz 357-PBGA (25×25)
The MPC885VR133 is a single-core, 32-bit microprocessor IC in the MPC885 family, running at 133 MHz on a Power Architecture™ core. Designed for embedded and communications-focused applications, it combines a CPU, system integration unit and communications processor module for integrated control and networking tasks.
With on-chip communications peripherals, a DRAM controller, hardware security support and both Ethernet and USB interfaces, the MPC885VR133 targets controller, networking and security appliance designs that require a compact, integrated solution from NXP Semiconductors.
Key Features
- Core Single-issue 32-bit MPC8xx core at 133 MHz built on Power Architecture™ technology, including instruction and data caches for responsive embedded performance.
- Memory & Caches Integrated memory management with on-chip caches (instruction and data) and DRAM controller support to simplify system memory design.
- Communications Processing On-chip Communications Processor Module (CPM) supporting communications-oriented tasks and offloading to dedicated hardware.
- Security & Cryptography Dedicated security co-processor (SEC) and cryptography features to support encrypted communications and secure data handling.
- Ethernet Multiple Ethernet controllers: three 10 Mbps ports and two 10/100 Mbps ports, enabling flexible wired networking topologies.
- USB One USB 2.0 interface for host or device connectivity.
- Additional Interfaces HDLC/SDLC support for serial link framing and legacy communications protocols.
- Power & I/O 3.3 V I/O voltage for common embedded system compatibility.
- Package & Mounting 357-ball PBGA package (25×25 mm), surface-mountable for compact board designs.
- Operating Range & Qualification Consumer-grade qualification with operating temperature range of 0 °C to 95 °C.
Typical Applications
- Communications & Networking Equipment Integration of multiple Ethernet ports and CPM functionality makes this device suitable for network controllers, routers or access devices.
- Embedded Controllers Single-chip CPU plus DRAM controller and peripheral integration supports general embedded control and management tasks.
- Security Appliances On-chip cryptography and the SEC co-processor enable encrypted communications and secure processing for appliances and gateways.
- USB-enabled Systems Built-in USB 2.0 interface facilitates connectivity for peripherals, configuration or host/device roles in embedded products.
Unique Advantages
- Integrated Communications Subsystem: Multiple Ethernet controllers, USB and HDLC/SDLC interfaces reduce external component count and simplify board design.
- Built-in Security Acceleration: On-chip SEC and cryptography features offload security tasks from the CPU, improving throughput for encrypted traffic.
- Power Architecture Core: 133 MHz MPC8xx core with instruction and data caches delivers deterministic embedded performance for control and networking workloads.
- Compact, Surface-Mount Package: 357-ball PBGA (25×25 mm) enables high-density PCB layouts while supporting robust thermal and mechanical mounting.
- Design-Ready Peripherals: DRAM controller and CPM functionality simplify system integration and accelerate time-to-market for embedded products.
Why Choose MPC885VR133?
The MPC885VR133 offers a balanced combination of a Power Architecture™ MPC8xx core, communications-oriented peripherals and on-chip security acceleration in a compact PBGA package. Its integrated Ethernet, USB and HDLC/SDLC interfaces, together with a DRAM controller and CPM, make it well suited for embedded networking and controller applications that demand a consolidated hardware footprint.
Backed by NXP Semiconductors and documented in the MPC885/MPC880 PowerQUICC hardware specifications, the MPC885VR133 is appropriate for designers seeking a single-chip embedded MPU with communications and security features, a 3.3 V I/O domain, and a consumer-grade operating temperature range of 0 °C to 95 °C.
Request a quote or submit a purchase inquiry to obtain pricing, availability and lead-time information for the MPC885VR133. Our team will assist with technical details and order processing to support your design cycle.

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