MPC885VR133

IC MPU MPC8XX 133MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 133MHz 357-PBGA (25x25)

Quantity 709 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC885
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A002A1 FREEthernet10Mbps (3), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptographySpeed133MHz
Supplier Device Package357-PBGA (25×25)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC885VR133 – IC MPU MPC8XX 133MHz 357-PBGA (25×25)

The MPC885VR133 is a single-core, 32-bit microprocessor IC in the MPC885 family, running at 133 MHz on a Power Architecture™ core. Designed for embedded and communications-focused applications, it combines a CPU, system integration unit and communications processor module for integrated control and networking tasks.

With on-chip communications peripherals, a DRAM controller, hardware security support and both Ethernet and USB interfaces, the MPC885VR133 targets controller, networking and security appliance designs that require a compact, integrated solution from NXP Semiconductors.

Key Features

  • Core  Single-issue 32-bit MPC8xx core at 133 MHz built on Power Architecture™ technology, including instruction and data caches for responsive embedded performance.
  • Memory & Caches  Integrated memory management with on-chip caches (instruction and data) and DRAM controller support to simplify system memory design.
  • Communications Processing  On-chip Communications Processor Module (CPM) supporting communications-oriented tasks and offloading to dedicated hardware.
  • Security & Cryptography  Dedicated security co-processor (SEC) and cryptography features to support encrypted communications and secure data handling.
  • Ethernet  Multiple Ethernet controllers: three 10 Mbps ports and two 10/100 Mbps ports, enabling flexible wired networking topologies.
  • USB  One USB 2.0 interface for host or device connectivity.
  • Additional Interfaces  HDLC/SDLC support for serial link framing and legacy communications protocols.
  • Power & I/O  3.3 V I/O voltage for common embedded system compatibility.
  • Package & Mounting  357-ball PBGA package (25×25 mm), surface-mountable for compact board designs.
  • Operating Range & Qualification  Consumer-grade qualification with operating temperature range of 0 °C to 95 °C.

Typical Applications

  • Communications & Networking Equipment  Integration of multiple Ethernet ports and CPM functionality makes this device suitable for network controllers, routers or access devices.
  • Embedded Controllers  Single-chip CPU plus DRAM controller and peripheral integration supports general embedded control and management tasks.
  • Security Appliances  On-chip cryptography and the SEC co-processor enable encrypted communications and secure processing for appliances and gateways.
  • USB-enabled Systems  Built-in USB 2.0 interface facilitates connectivity for peripherals, configuration or host/device roles in embedded products.

Unique Advantages

  • Integrated Communications Subsystem: Multiple Ethernet controllers, USB and HDLC/SDLC interfaces reduce external component count and simplify board design.
  • Built-in Security Acceleration: On-chip SEC and cryptography features offload security tasks from the CPU, improving throughput for encrypted traffic.
  • Power Architecture Core: 133 MHz MPC8xx core with instruction and data caches delivers deterministic embedded performance for control and networking workloads.
  • Compact, Surface-Mount Package: 357-ball PBGA (25×25 mm) enables high-density PCB layouts while supporting robust thermal and mechanical mounting.
  • Design-Ready Peripherals: DRAM controller and CPM functionality simplify system integration and accelerate time-to-market for embedded products.

Why Choose MPC885VR133?

The MPC885VR133 offers a balanced combination of a Power Architecture™ MPC8xx core, communications-oriented peripherals and on-chip security acceleration in a compact PBGA package. Its integrated Ethernet, USB and HDLC/SDLC interfaces, together with a DRAM controller and CPM, make it well suited for embedded networking and controller applications that demand a consolidated hardware footprint.

Backed by NXP Semiconductors and documented in the MPC885/MPC880 PowerQUICC hardware specifications, the MPC885VR133 is appropriate for designers seeking a single-chip embedded MPU with communications and security features, a 3.3 V I/O domain, and a consumer-grade operating temperature range of 0 °C to 95 °C.

Request a quote or submit a purchase inquiry to obtain pricing, availability and lead-time information for the MPC885VR133. Our team will assist with technical details and order processing to support your design cycle.

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