MPC885VR66

IC MPU MPC8XX 66MHZ 357BGA
Part Description

MPC8xx Microprocessor IC MPC8xx 1 Core, 32-Bit 66MHz 357-PBGA (25x25)

Quantity 1,445 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesMPC885
ManufacturerNXP USA Inc.
Manufacturing StatusObsolete
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

Co-Processors/DSPCommunications; CPM, Security; SECCore ProcessorMPC8xxDevice Package357-PBGA (25x25)
ECCN5A002A1 FREEthernet10Mbps (3), 10/100Mbps (2)Graphics AccelerationNo
HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)Mounting MethodSurface Mount
Mounting TypeSurface MountNumber of Cores/Bus Width1 Core, 32-BitOperating Temperature0°C ~ 95°C (TA)
Package / Case357-BBGARAM ControllersDRAMREACH ComplianceREACH Unaffected
RoHS ComplianceROHS3 CompliantSecurity FeaturesCryptographySpeed66MHz
Supplier Device Package357-PBGA (25×25)USBUSB 2.0 (1)Voltage – I/O3.3V

Overview of MPC885VR66 – IC MPU MPC8XX 66MHz 357-PBGA

The MPC885VR66 is a single-core, 32-bit microprocessor based on the MPC8xx Power Architecture core, optimized for embedded controller and communications applications. It integrates a CPU core, system integration functions and the Communications Processor Module (CPM), delivering a compact, highly integrated solution for networking, communications and embedded control designs.

With a 66 MHz core, 3.3 V I/O, on-chip cryptography support and a 357-PBGA (25×25) surface-mount package, the MPC885VR66 targets designs requiring integrated peripheral support, deterministic interfaces and industry-standard connectivity options.

Key Features

  • Core and Architecture – MPC8xx single 32-bit core built on Power Architecture technology with instruction and data caches (8 KB each), providing deterministic processing for embedded tasks.
  • Clock Speed – 66 MHz core frequency, suitable for control and communications workloads where predictable timing is required.
  • Voltage and Mounting – 3.3 V I/O and surface-mount 357-PBGA (25×25) package for compact board-level integration.
  • Communications Co-processors – Integrated Communications Processor Module (CPM) and security co-processor (SEC) for offloading protocol and cryptography functions.
  • Ethernet – Multiple Ethernet controllers: three 10 Mbps controllers and two 10/100 Mbps controllers for flexible network interfacing.
  • USB – Single USB 2.0 interface for host or device connectivity.
  • Memory Support – DRAM controller on-chip to support external memory for system code and data.
  • Additional Interfaces – HDLC/SDLC support for serial framing and legacy communications protocols.
  • Security Features – On-chip cryptography block to support secure communications and data protection tasks.
  • Operating Range – Specified operating temperature range of 0 °C to 95 °C for consumer-grade deployments.
  • Compliance – RoHS compliant for modern manufacturing and environmental standards.

Typical Applications

  • Embedded Controllers – Use as the main processing element in controllers requiring integrated peripheral support and deterministic I/O timing.
  • Networking and Communications Equipment – Leverage multiple Ethernet controllers, the CPM and HDLC/SDLC interfaces for routers, switches and protocol gateways.
  • Security and Encryption Appliances – On-chip cryptography and the SEC co-processor enable secure data handling and encrypted communications.
  • USB-Enabled Devices – Integrate USB 2.0 connectivity for device or host roles in consumer and industrial peripherals.

Unique Advantages

  • Highly integrated communications peripherals – Multiple Ethernet controllers, CPM and HDLC/SDLC support reduce external interface components and simplify board design.
  • On-chip security acceleration – Built-in cryptography and SEC co-processor offload security operations from the CPU core, improving throughput for encrypted traffic.
  • Compact BGA package – 357-PBGA (25×25) package enables dense PCB layouts while supporting high-pin-count connectivity.
  • Deterministic 32-bit core – Single MPC8xx core with dedicated caches provides stable, predictable performance for embedded control tasks.
  • Broad interface set – Ethernet, USB 2.0, DRAM controller and serial framing interfaces allow the MPC885VR66 to serve multiple roles within a system.
  • RoHS compliant – Supports environmentally conscious manufacturing requirements.

Why Choose MPC885VR66?

The MPC885VR66 combines a Power Architecture-based MPC8xx core with a Communications Processor Module and dedicated security resources to deliver a single-chip solution for embedded communications and control applications. Its mix of Ethernet ports, USB 2.0, DRAM support and HDLC/SDLC interfaces makes it suitable for designs that need integrated connectivity and protocol handling in a compact footprint.

Designed for consumer-grade temperature environments and supplied in a 357-PBGA (25×25) package, the MPC885VR66 offers a balance of integration, interface breadth and deterministic processing for developers building networking equipment, secure communication appliances and embedded controllers within the MPC885 family ecosystem.

Request a quote or submit a purchase inquiry for the MPC885VR66 to obtain pricing, availability and ordering information.

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