MVF30NN152CKU26

The MVF30NN152CKU26 is an NXP Vybrid VF3xx-series microprocessor IC based on a single ARM® Cortex®-A5 32‑bit core running at 266 MHz in a 176‑HLQFP (24×24) exposed‑pad package. Designed for embedded and industrial applications, it combines a general‑purpose processing core with multimedia, display and networking peripherals to support connected, secure system designs.

This device targets applications that require a compact, surface‑mount MPU with integrated I/O, industrial temperature qualification (−40 °C to 85 °C) and hardware security capabilities, while supporting common memory types and display/video interfaces.

Key Features

• Core — ARM® Cortex®‑A5 32‑bit single core running at 266 MHz, providing deterministic application processing for embedded workloads.
• Memory Interfaces — Integrated controllers supporting LPDDR2, DDR3 and DRAM, enabling flexible memory choices for code and data storage.
• Display and Video — On‑chip display and video support including DCU, GPU, LCD, VideoADC and VIU for graphical user interfaces and camera/video capture.
• Networking and Connectivity — Dual 10/100 Mbps Ethernet interfaces and CAN support for industrial networking and field connectivity.
• USB — USB 2.0 OTG with PHY (1) for host/device connectivity and peripheral integration.
• Multimedia Acceleration — NEON™ MPE multimedia co‑processor and graphics acceleration to offload media and signal processing tasks.
• Security — Comprehensive hardware security features including ARM TrustZone, CAAM, HAB, RTIC, Secure JTAG, SNVS, tamper detection, TrustZone Address Space Controller and TrustZone watchdog.
• Analog and Audio — Integrated analog peripherals including ADC/DAC and audio interfaces suitable for sensor interfacing and media applications.
• System and Timing — Rich timer and debug resources; hardware watchdog and integrity checking for system reliability.
• Package and Temperature — 176‑LQFP exposed pad, surface‑mount package (176‑HLQFP 24×24) qualified for industrial temperature operation (−40 °C to 85 °C).
• Power and I/O — I/O voltage specified at 3.3 V with system operating characteristics available in the Vybrid series documentation.
• Compliance — RoHS compliant.

Typical Applications

• Industrial Control and Automation — Deterministic processing, dual Ethernet and CAN support make it suitable for PLCs, gateways and motor control front‑ends.
• Human‑Machine Interfaces (HMI) — Display controllers, GPU and multimedia acceleration enable responsive graphical user interfaces for panels and operator stations.
• Secure Embedded Systems — Hardware security features including TrustZone, CAAM and HAB support protected boot and secure storage for IoT and secure endpoints.
• Imaging and Video Capture — Video Interface Unit (VIU) and VideoADC support camera input and video processing tasks for vision‑enabled applications.

Unique Advantages

• Integrated peripheral set: On‑chip display, video, networking and audio interfaces reduce external component count and simplify BOM.
• Hardware security suite: Multiple built‑in security modules (TrustZone, CAAM, HAB, SNVS) provide layered protection for secure boot and runtime isolation.
• Industrial readiness: Qualified for −40 °C to 85 °C operation and packaged in a 176‑HLQFP exposed‑pad surface mount package for robust deployments.
• Flexible memory support: Controllers for LPDDR2, DDR3 and DRAM allow designers to scale memory choices to application needs.
• Connectivity options: Dual 10/100 Ethernet, USB OTG and CAN interfaces enable networked and field‑bus capable systems without additional controllers.

Why Choose MVF30NN152CKU26?

The MVF30NN152CKU26 positions itself as a compact, feature‑rich microprocessor for embedded and industrial designs that demand integrated multimedia, connectivity and hardware security. Its ARM® Cortex®‑A5 core at 266 MHz, combined with extensive peripheral integration and industrial temperature qualification, makes it suitable for HMI, secure IoT gateways, imaging and control applications.

Designers benefit from reduced system complexity through on‑chip interfaces and security engines, plus flexible memory support and a surface‑mount 176‑HLQFP package for volume deployment. The device is a strong fit for projects that require a balance of performance, integration and security within an industrial temperature range.

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