 | | LS1026AXE8MQA | NXP Semiconductors | IC MPU QORIQ 1.2GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 1,171 | |
 | | LS1026AXE8P1A | NXP Semiconductors | IC MPU QORIQ 1.4GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 45 | |
 | | LS1026AXE8Q1A | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 835 | |
 | | LS1026AXE8T1A | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 975 | |
 | | LS1026AXN8MQA | NXP Semiconductors | IC MPU QORLQ LS1 1.2GHZ 780FBGA | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TJ) | Core Processor: ARM® Cortex®-A72 Ethernet: 10GbE (2), 2.5GbE (3), 1GbE (8) Operating Temperature: -40°C ~ 105°C (TJ) Security Features: Secure Boot, TrustZone Mounting Type: Surface Mount Supplier Device Package: 780-FBGA (23×23) | 1,090 | |
 | | LS1026AXN8P1A | NXP Semiconductors | IC MPU QORIQ 1.4GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 169 | |
 | | LS1026AXN8Q1A | NXP Semiconductors | IC MPU QORIQ 1.6GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 95 | |
 | | LS1026AXN8T1A | NXP Semiconductors | IC MPU QORIQ 1.8GHZ 780FCPBGA | Microprocessors | 780-FCPBGA (23x23) | N/A | -40°C ~ 105°C | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit Ethernet: 10GbE (2), 2.5GbE (1), 1GbE (4) Operating Temperature: -40°C ~ 105°C Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Package / Case: 780-FBGA, FCBGA Supplier Device Package: 780-FCPBGA (23×23) | 1,404 | |
 | | LS1027ASN7KQA | NXP Semiconductors | IC MPU QORIQ LAYER 1GHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 840 | |
 | | LS1027AXE7HNA | NXP Semiconductors | IC MPU QORIQ 800MHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 859 | |
 | | LS1027AXN7HNA | NXP Semiconductors | IC MPU QORIQ 800MHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 771 | |
 | | LS1027AXN7PQA | NXP Semiconductors | IC MPU QORIQ 1.5GHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Graphics Acceleration: Yes Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Security Features: Secure Boot, TrustZone® Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 418 | |
 | | LS1028ASN7KQA | NXP Semiconductors | IC MPU QORIQ LAYER 1GHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 1,122 | |
 | | LS1028AXE7KQA | NXP Semiconductors | IC MPU QORIQ LAYER 1GHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 709 | |
 | | LS1028AXN7NQA | NXP Semiconductors | IC MPU QORIQ 1.3GHZ 448FBGA | Microprocessors | 448-FBGA (17x17) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A72 Number of Cores/Bus Width: 2 Core, 64-Bit RAM Controllers: DDR3L SDRAM, DDR4 SDRAM Ethernet: 1Gbps (1), 2.5Gbps (5) Operating Temperature: -40°C ~ 105°C (TA) Mounting Type: Surface Mount Supplier Device Package: 448-FBGA (17×17) | 677 | |
| N/A | N/A | LS102MASE7BFA | NXP Semiconductors | IC MPU QORLQ LS1 650MHZ 448PBGA | Microprocessors | 448-PBGA w/Heat Spreader (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM1136JF-S Number of Cores/Bus Width: 2 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23×23) | 189 | |
| N/A | N/A | LS102MASE7EHA | NXP Semiconductors | IC MPU QORLQ LS1 650MHZ 448PBGA | Microprocessors | 448-PBGA w/Heat Spreader (23x23) | N/A | 0°C ~ 70°C (TA) | Core Processor: ARM1136JF-S Number of Cores/Bus Width: 2 Core, 32-Bit Operating Temperature: 0°C ~ 70°C (TA) Mounting Type: Surface Mount Package / Case: 448-FBGA Exposed Pad Supplier Device Package: 448-PBGA w/Heat Spreader (23×23) | 161 | |
| N/A | | LS1043ABE9MQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Supplier Device Package: 780-FBGA (23×23) | 489 | |
| N/A | | LS1043ABE9PQB | NXP Semiconductors | TRAYS (ALT: LS1043ABE9PQB) | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Ethernet: 1GbE (7), 10GbE (1), 2.5GbE (2) Mounting Type: Surface Mount Number of Cores/Bus Width: 4 Core, 64-Bit Operating Temperature: -40°C ~ 105°C (TA) RAM Controllers: DDR3L, DDR4 Security Features: ARM TZ, Boot Security Supplier Device Package: 780-FBGA (23×23) | 655 | |
| N/A | | LS1043ACE9MQB | NXP Semiconductors | LAYERSCAPE 64-BIT ARM CORTEX-A53 | Microprocessors | 780-FBGA (23x23) | N/A | -40°C ~ 105°C (TA) | Core Processor: ARM® Cortex®-A53 Number of Cores/Bus Width: 4 Core, 64-Bit RAM Controllers: DDR3L, DDR4 Ethernet: 1GbE (4), 2.5GbE (2), 10GbE (1) Operating Temperature: -40°C ~ 105°C (TA) Security Features: ARM TZ, Boot Security Mounting Type: Surface Mount Supplier Device Package: 780-FBGA (23×23) | 727 | |