LS1027AXN7PQA

The LS1027AXN7PQA is an NXP QorIQ Layerscape microprocessor featuring two ARM® Cortex®-A72 cores running up to 1.5 GHz. Designed for embedded and industrial applications, it combines multi-gigabit Ethernet, high-speed I/O and robust security features for edge compute and networking functions.

With integrated memory controllers, a broad set of peripheral interfaces and industrial qualification, this device targets designs that require balanced compute performance, deterministic networking and system-level integration.

Key Features

• Core and Architecture  Dual ARM® Cortex®-A72 cores (32/64-bit) running up to 1.5 GHz with 48 KB L1 instruction and 32 KB L1 data caches per core and a shared 1 MB L2 cache.
• Interconnect  Cache Coherent Interconnect (CCI-400) support for coherent multi-master operation.
• Memory  One 32-bit DDR3L/DDR4 SDRAM controller with ECC support, rated up to 1.6 GT/s.
• Ethernet and Networking  TSN-capable Ethernet switch with four external ports and an Ethernet controller with TSN functionality; combination of 1G and 2.5G SerDes-based interfaces and multiple SGMII/QSGMII/10G options in the silicon.
• High-speed SerDes and PCIe  Four SerDes lanes supporting peripherals including two PCI Express 3.0 controllers and other high-speed interfaces.
• Storage and USB  One SATA 6 Gbit/s controller and two USB 2.0/3.0 controllers with integrated PHY for high-bandwidth storage and peripheral connectivity.
• Peripheral Interfaces  CAN (two modules, optionally supporting Flexible Data-rate), two eSDHC controllers (SD/eMMC), three SPI, eight I2C, one FlexSPI, 1 DUART, six LPUARTs, GPIO, PWMs and six SAI audio interfaces.
• Security  Hardware security features including Secure Boot and Arm TrustZone® to support platform integrity and trusted execution.
• System and DMA  Queue DMA (qDMA) and enhanced DMA (eDMA) controllers, Generic Interrupt Controller (GIC) and Thermal Monitor Unit (TMU) for efficient data movement and system management.
• Graphics and Acceleration  Integrated graphics acceleration capability for offloading display or graphics-related tasks.
• Package and Mounting  448-ball FBGA package (17 × 17 mm), surface-mount mounting for high-density PCB designs.
• Industrial Qualification and Temperature  Industrial qualification with operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

• Industrial Networking  TSN-capable Ethernet switching and multi-rate SerDes interfaces enable deterministic networking and real-time communication in industrial control systems.
• Edge Compute and Secure Gateways  Dual Cortex-A72 cores, TrustZone® and Secure Boot support secure edge processing and protocol translation for gateway devices.
• Storage and NAS Appliances  SATA 6 Gbit/s and high-speed USB ports provide local storage and high-throughput peripheral support for compact storage controllers.
• Automated Test and Control  Rich peripheral set (CAN, SPI, I2C, PWM, UARTs) and industrial temperature range suit data acquisition, motion control and machine interface applications.

Unique Advantages

• Balanced compute and networking: Dual Cortex-A72 cores paired with TSN-capable Ethernet and multiple SerDes lanes let designs combine application processing with deterministic networking.
• Integrated memory and ECC: DDR3L/DDR4 controller with ECC improves system reliability while simplifying memory subsystem design.
• Comprehensive peripheral set: Wide range of I/O (SATA, USB3.0, CAN, SPI, I2C, UART, SAI) reduces external controllers and BOM complexity.
• Security foundations: Secure Boot and TrustZone® provide hardware-assisted platform integrity for secure embedded deployments.
• Industrial readiness: Industrial qualification and −40 °C to 105 °C operating range support demanding environmental conditions.
• Compact package: 448-FBGA (17 × 17 mm) offers a small footprint for high-density systems without sacrificing I/O capability.

Why Choose LS1027AXN7PQA?

The LS1027AXN7PQA positions itself as a versatile embedded processor for designs that need a combination of application processing, deterministic networking and broad peripheral integration. Its dual ARM® Cortex®-A72 cores, memory ECC support and TSN-capable Ethernet make it suitable for industrial and edge applications where reliability and secure operation matter.

Engineers selecting this part benefit from a compact 448-ball FBGA package, industrial temperature qualification and an extensive set of high-speed interfaces—enabling scalable, integrated designs with reduced external components and clear upgrade paths within the Layerscape family.

Request a quote or submit a procurement inquiry to get pricing, lead time and availability for the LS1027AXN7PQA.