LS1026AXN8T1A

IC MPU QORIQ 1.8GHZ 780FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.8GHz 780-FCPBGA (23x23)

Quantity 285 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1026A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package780-FCPBGA (23x23)ECCN5A002A1 NXP
Ethernet10GbE (2), 2.5GbE (1), 1GbE (4)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.8GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (3) + PHY

Overview of LS1026AXN8T1A – IC MPU QORIQ 1.8GHZ 780FCPBGA

The LS1026AXN8T1A is an NXP QorIQ Layerscape microprocessor featuring dual ARM® Cortex®-A72 64-bit cores running at 1.8 GHz. It combines compute performance with integrated packet-processing acceleration and a broad set of high-speed I/O for networking, storage, security and industrial applications.

Designed for embedded systems that require multi-gigabit connectivity and robust security, the device delivers a compact, surface-mount 780-FCPBGA (23 × 23 mm) package with industrial qualification and a wide operating temperature range.

Key Features

  • Core and Performance Dual ARM® Cortex®-A72 64-bit cores at 1.8 GHz provide high-performance general-purpose compute for embedded and networking workloads.
  • Memory Integrated DDR4 memory controller for modern high-speed system memory support.
  • Networking Interfaces Multiple Ethernet controllers including two 10 GbE, one 2.5 GbE and four 1 GbE ports enable scalable multi-rate network connectivity.
  • High-Speed I/O Supports PCIe Gen3 connectivity, one SATA 6 Gbps interface and three USB 3.0 ports with PHY for storage and peripheral expansion.
  • Security Hardware security features include Secure Boot and ARM® TrustZone® to support secure system boot and trusted execution environments.
  • Packet Processing Acceleration Integrated packet processing acceleration offloads classification, distribution and buffer management to improve system throughput.
  • Package and Mounting 780-FCPBGA (23 × 23 mm) surface-mount package suitable for compact board designs.
  • Industrial Qualification & Temperature Industrial qualification with an operating temperature range of −40 °C to 105 °C for deployment in demanding environments.
  • Compliance RoHS compliant for environmental compatibility in assembly and manufacturing.

Typical Applications

  • Enterprise Routers and Switches Use the multi-rate Ethernet and PCIe connectivity to implement control and data-plane functions in routing and switching platforms.
  • Network Attached Storage (NAS) Combine SATA 6 Gbps, USB 3.0 and high-performance CPU cores for compact NAS controllers and storage appliances.
  • Security Appliances Leverage Secure Boot, TrustZone and integrated packet acceleration for VPN gateways, firewalls and secure gateways.
  • Service Provider Gateways and vCPE High-speed Ethernet and packet processing acceleration enable service provider edge functions and virtual CPE deployments.
  • Single Board Computers Compact package and broad I/O make the device suitable for high-performance single board computer designs.

Unique Advantages

  • Highly integrated connectivity: Two 10 GbE, one 2.5 GbE, four 1 GbE ports plus PCIe Gen3, SATA and USB 3.0 reduce the need for external bridge chips and simplify board routing.
  • Packet processing offload: Integrated acceleration for classification and buffer management reduces CPU load and increases system throughput for networking workloads.
  • Security-first architecture: Secure Boot and ARM TrustZone provide hardware-backed mechanisms to establish a trusted platform foundation.
  • Industrial-ready: Rated for −40 °C to 105 °C and industrial qualification for reliable operation in harsh environments.
  • Compact BGA footprint: 780-FCPBGA (23 × 23 mm) package enables high-density board designs without sacrificing I/O capability.
  • Series-level scalability: Pin-compatibility across related QorIQ Layerscape devices enables hardware and software reuse for performance scaling within the product family.

Why Choose LS1026AXN8T1A?

The LS1026AXN8T1A positions dual 64-bit Cortex-A72 cores and extensive high-speed connectivity in a compact, industrial-qualified BGA package, delivering a balanced combination of compute, networking and security for embedded designs. It is well suited to customers building networking, storage and security systems that need integrated acceleration and multi-rate Ethernet connectivity.

With DDR4 memory support, hardware security features and series-level compatibility for hardware/software reuse, the LS1026AXN8T1A offers a scalable platform for designs targeting long-term deployment and evolving performance requirements.

Request a quote or submit an inquiry to obtain pricing, lead times and availability for the LS1026AXN8T1A. Our team can provide technical details and support to help integrate this QorIQ Layerscape processor into your design.

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