LS1026AXE8P1A

IC MPU QORIQ 1.4GHZ 780FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.4GHz 780-FCPBGA (23x23)

Quantity 800 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1026A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package780-FCPBGA (23x23)ECCN5A002A1 NXP
Ethernet10GbE (2), 2.5GbE (1), 1GbE (4)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.4GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (3) + PHY

Overview of LS1026AXE8P1A – IC MPU QORIQ 1.4GHZ 780FCPBGA

The LS1026AXE8P1A is a QorIQ Layerscape microprocessor based on ARM® Cortex®-A72 cores, delivering dual‑core 64‑bit processing at 1.4 GHz in a 780‑FCPBGA (23 × 23 mm) package. It integrates high‑speed interfaces and packet processing features targeted at embedded networking, storage, security and industrial applications.

Designed for systems that require balanced CPU performance, hardware packet acceleration and extensive I/O, this industrial‑qualified device combines multiple Ethernet ports, SATA and USB 3.0 with DDR4 memory support and hardware security features to simplify system design.

Key Features

  • Core Dual ARM® Cortex®‑A72 64‑bit cores running at 1.4 GHz, providing host compute for control-plane and application tasks.
  • Packet processing acceleration Integrated packet classification and distribution accelerators reduce CPU load by offloading common packet handling and buffer management tasks.
  • Memory DDR4 memory controller support for modern system memory performance and capacity.
  • High‑speed networking Multi‑rate Ethernet connectivity with two 10 GbE ports, one 2.5 GbE port and four 1 GbE ports for flexible deployment in networking equipment.
  • Storage and PCIe Single SATA 6 Gbps port for storage and multiple PCIe Gen3 controllers (as described in the product series) to support high‑bandwidth peripherals and expansion.
  • USB Three USB 3.0 interfaces with integrated PHY for high‑speed peripheral connectivity.
  • Security Secure Boot and ARM TrustZone® support, plus an integrated security engine for high‑speed protocol processing and secure key handling.
  • Package & mounting 780‑FCPBGA (23 × 23 mm) package, surface‑mount mounting for compact board integration.
  • Qualification & operating range Industrial qualification with operating temperature range from −40 °C to 105 °C. RoHS compliant.

Typical Applications

  • Enterprise routers and switches — Use the multi‑rate Ethernet and packet acceleration to handle control and data‑plane tasks in wired networking equipment.
  • Network attached storage (NAS) — Combine DDR4 memory support, SATA 6 Gbps and PCIe connectivity for compact storage controllers and appliances.
  • Security appliances — Offload IPsec/SSL processing to the integrated security engine while using Secure Boot and TrustZone® for a hardened platform.
  • Service provider gateways and vCPE — Dual Cortex‑A72 cores with packet processing acceleration suit gateways and virtual CPE platforms requiring balanced performance and connectivity.

Unique Advantages

  • Highly integrated connectivity: Multiple Ethernet ports (10 GbE, 2.5 GbE, 1 GbE), USB 3.0 and SATA reduce external PHY and bridge requirements, simplifying BOM and board layout.
  • Hardware packet offload: Dedicated packet processing accelerators free general‑purpose cores for application logic and value‑added services, improving system efficiency.
  • Security‑focused architecture: Secure Boot, ARM TrustZone® and an integrated security engine enable secure device boot and high‑speed cryptographic operations.
  • Industrial temperature and qualification: −40 °C to 105 °C operating range and industrial qualification support deployment in harsh and mission‑critical environments.
  • Family scalability and design reuse: The LS1026A family is provided in a 23 × 23 mm package and the series offers pin compatibility with related Layerscape devices, enabling hardware and software reuse for performance scaling.

Why Choose LS1026AXE8P1A?

The LS1026AXE8P1A positions itself as a balanced embedded processor that combines dual ARM Cortex‑A72 compute with dedicated packet and security accelerators and broad high‑speed I/O. Its combination of DDR4 memory support, multi‑rate Ethernet, SATA and USB 3.0 makes it suitable for networking, storage and security platforms that require integration without sacrificing system flexibility.

This industrial‑qualified device is aimed at designers who need predictable thermal and environmental performance, scalable family options for design reuse, and integrated security and packet processing to streamline system architecture and reduce time‑to‑market.

Request a quote or submit a purchase inquiry to obtain pricing, lead time and ordering information for the LS1026AXE8P1A.

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