LS1026AXE8MQA

IC MPU QORIQ 1.2GHZ 780FCPBGA
Part Description

ARM® Cortex®-A72 Microprocessor IC QorIQ® Layerscape 2 Core, 64-Bit 1.2GHz 780-FCPBGA (23x23)

Quantity 1,430 Available (as of October 8, 2026)
Product CategoryMicroprocessors
Part SeriesLS1026A
ManufacturerNXP USA Inc.
Manufacturing StatusActive
Manufacturer Standard Lead Time18 Weeks
Datasheet

Specifications & Environmental

Core ProcessorARM® Cortex®-A72Device Package780-FCPBGA (23x23)ECCN5A002A1 NXP
Ethernet10GbE (2), 2.5GbE (1), 1GbE (4)HTS Code8542.31.0001Moisture Sensitivity Level3 (168 Hours)
Mounting MethodSurface MountMounting TypeSurface MountNumber of Cores/Bus Width2 Core, 64-Bit
Operating Temperature-40°C ~ 105°CPackage / Case780-FBGA, FCBGARAM ControllersDDR4
REACH ComplianceREACH UnaffectedRoHS ComplianceROHS3 CompliantSATASATA 6Gbps (1)
Security FeaturesSecure Boot, TrustZone®Speed1.2GHzSupplier Device Package780-FCPBGA (23×23)
USBUSB 3.0 (3) + PHY

Overview of LS1026AXE8MQA – IC MPU QORIQ 1.2GHZ 780FCPBGA

The LS1026AXE8MQA is a dual-core, 64-bit ARM® Cortex®-A72 microprocessor in the NXP QorIQ Layerscape family, operating at 1.2 GHz. It combines high-performance CPU cores with integrated packet-processing acceleration and a broad set of high-speed interfaces for embedded networking, storage, security and industrial applications.

Designed for industrial qualification and wide temperature operation, the device targets designs demanding consolidated connectivity, hardware-assisted packet handling and on-chip security support while simplifying system integration through DDR4 memory support and a compact 23 × 23 mm FCPBGA package.

Key Features

  • Core Dual ARM® Cortex®-A72 cores, 64-bit architecture at 1.2 GHz for compute-intensive embedded tasks.
  • Memory Integrated DDR4 memory controller for modern high-bandwidth system memory.
  • Networking Multiple integrated Ethernet controllers: two 10 GbE, one 2.5 GbE and four 1 GbE ports to support diverse network topologies and throughput requirements.
  • Storage & USB SATA 6 Gbps interface for storage subsystems and three USB 3.0 ports with PHY for high-speed peripheral connectivity.
  • High-speed I/O PCIe® Gen3 capability and high-speed SERDES connectivity (as described in series datasheet) for expansion and high-throughput I/O.
  • Security Hardware-supported Secure Boot and ARM® TrustZone® for platform integrity and system-level isolation.
  • Packaging & Mounting 780-FCPBGA package (23 × 23 mm), surface-mount with industrial-grade mounting and assembly compatibility.
  • Operating Range & Compliance Industrial qualification with an operating temperature range of −40 °C to 105 °C and RoHS compliance.

Typical Applications

  • Enterprise Routing & Switching Use the integrated multi-rate Ethernet and packet processing acceleration to implement control-plane and line-card controller functions.
  • Network Attached Storage (NAS) Combine SATA 6 Gbps, high-speed PCIe I/O and USB 3.0 to deliver connected storage solutions with high throughput.
  • Security Appliances Leverage Secure Boot, TrustZone and on-chip security acceleration for encrypted tunnels and secure gateway functions.
  • Service Provider Gateways & vCPE Scale network functions with hardware acceleration and multiple Ethernet ports for managed CPE and gateway platforms.
  • Single Board Computers Integrate into compact SBC designs requiring industrial temperature support and a rich set of peripherals.

Unique Advantages

  • Integrated high-speed interfaces: Two 10 GbE, one 2.5 GbE, four 1 GbE, SATA 6 Gbps and multiple USB 3.0 ports reduce external PHY and bridge requirements.
  • Hardware packet processing acceleration: On-chip packet handling offloads general-purpose cores to improve deterministic packet throughput and system efficiency.
  • Built-in platform security: Secure Boot and ARM TrustZone support system integrity and trusted execution without adding external security controllers.
  • Industrial-qualified temperature range: −40 °C to 105 °C supports deployment in harsh and wide-temperature environments.
  • Compact BGA package: 780-FCPBGA (23 × 23 mm) balances high I/O density with a small PCB footprint for embedded system designs.
  • DDR4 memory support: Modern memory interface for higher bandwidth and system performance in data- and packet-intensive applications.

Why Choose LS1026AXE8MQA?

The LS1026AXE8MQA delivers a balanced combination of dual ARM® Cortex®-A72 compute performance, multi-rate Ethernet connectivity and hardware packet acceleration in an industrial-grade package. Its integrated security features and modern memory interface make it suitable for embedded networking, storage and security-focused products that require consolidated functionality and reliable operation across wide temperatures.

Customers designing systems that demand high-speed interfaces, on-chip packet handling and industrial qualification will find the LS1026AXE8MQA a practical building block for scalable, maintainable platform designs within the Layerscape ecosystem.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the LS1026AXE8MQA.

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