UCM1H221MNL1GS

The UCM1H221MNL1GS is a chip-type aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 220 µF capacitance at 50 V in a low-impedance SMD can package (φ8 × 10 mm), optimized for automatic carrier-tape mounting and high-reliability applications.

With a wide operating temperature range from −55 °C to +105 °C, AEC-Q200 qualification, and defined ripple and leakage characteristics, this part is targeted at demanding electronic systems that require stable bulk capacitance, controlled loss (tan δ), and robust endurance.

Key Features

• Capacitance & Voltage: 220 µF nominal capacitance with a rated voltage of 50 V and tolerance of −20% to +20%.
• Low Impedance Design: Chip-type, low-impedance construction with tan δ = 0.10 measured at 20 °C, 120 Hz, supporting efficient AC performance.
• Ripple Handling: Specified ripple performance of 335 mA at 120 Hz (low frequency) and 670 mA at 10 kHz (high frequency) for demanding ripple-current environments.
• Leakage Current: Low leakage current rated at 110 µA (as specified), suitable where controlled leakage is required.
• Temperature & Endurance: Operating range −55 °C to +105 °C with endurance specified at 2000 hours at 105 °C (for φD ≤ 10 mm sizes).
• Package & Mounting: Surface-mount radial can (φ8 × 10L) supplied on embossed carrier taping for automatic placement; surface-mount land size recommendation L: 8.3 × W: 8.3 mm.
• Standards & Compliance: AEC-Q200 qualification and RoHS compliance are documented for use in regulated environments.

Typical Applications

• Automotive Electronics — AEC-Q200 qualification and the −55 °C to +105 °C temperature range make this capacitor suitable for automotive electronic modules that require reliable bulk capacitance.
• Automated PCB Assembly — Chip-type can package with embossed carrier taping facilitates high-volume automatic placement on surface-mount lines.
• Power Filtering and Decoupling — 220 µF capacitance combined with low impedance and specified ripple current ratings supports bulk smoothing and ripple suppression on DC power rails.

Unique Advantages

• Designed for automated production: Embossed carrier taping and chip-type SMD can form factor simplify pick-and-place integration into automated assembly workflows.
• Robust thermal capability: Rated for continuous operation up to 105 °C with a guaranteed endurance test of 2000 hours at 105 °C, supporting high-temperature duty cycles.
• Low-loss AC performance: tan δ = 0.10 at 20 °C, 120 Hz provides predictable dielectric loss for designs where loss angle matters.
• Specified ripple performance: Clear low- and high-frequency ripple current ratings (335 mA at 120 Hz; 670 mA at 10 kHz) enable designers to quantify thermal and ripple handling in power circuits.
• AEC-Q200 qualified and RoHS compliant: Documented qualification and environmental compliance support regulated and reliability-focused designs.
• Compact SMD can package: φ8 × 10 mm footprint delivers 220 µF capacitance in a small surface-mount form factor for space-constrained boards.

Why Choose UCM1H221MNL1GS?

UCM1H221MNL1GS positions itself as a durable, production-friendly aluminum electrolytic solution for engineers who need compact bulk capacitance with verified low-impedance behavior. Its combination of 220 µF at 50 V, controlled tan δ, defined ripple and leakage specifications, and AEC-Q200 qualification makes it suitable for reliability-focused projects and high-volume manufacturing.

This part is a fit for designs that require predictable thermal and electrical performance across −55 °C to +105 °C, supported by embossed carrier taping for automated assembly and documented endurance and soldering-heat characteristics for robust lifecycle performance.

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