UCM1H331MNS1GS

The UCM1H331MNS1GS is a chip-type, low-impedance aluminum electrolytic capacitor from Nichicon’s UCM series, specified for surface-mount assembly. It delivers 330 µF at 50 V in a compact φ10×10L package with embossed carrier taping for automatic placement.

Designed for applications that demand AEC-Q200 qualification and extended high-temperature endurance, this part offers a broad operating range from −55°C to +105°C and vibration-resistant construction for demanding environments.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance at a rated voltage of 50 V with ±20% tolerance (measured at 20°C, 120 Hz).
• Low Loss / Dissipation — tan δ (DF) specified at measurement condition 20°C, 120 Hz; maximum tan δ for 50 V is 0.10, supporting efficient AC performance.
• High Ripple Current Capability — Low-frequency ripple current 450 mA (120 Hz) and high-frequency ripple current 900 mA (10 kHz), enabling robust handling of AC stress in power circuits.
• Leakage Current — Specified leakage current of 165 µA, measured after voltage application conditions per the product specification.
• High-Temperature Endurance — Rated endurance of 2000 hours at 105°C when restored to 20°C, matching chip-size endurance requirements for φD ≤ 10.
• Wide Operating Temperature — −55°C to +105°C for use across a broad thermal range.
• Surface-Mount Packaging & Assembly — Chip-type SMD in a φ10×10L can with embossed carrier taping, applicable to automatic mounting machines for efficient PCB assembly.
• Vibration Resistant — Vibration-resistant construction for improved mechanical durability in physically demanding installations.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant as specified in the product data.

Typical Applications

• Automotive Electronics — Suitable for automotive electronic modules where AEC-Q200 qualification and operation to 105°C are required.
• Surface-Mount Power Modules — Chip-type SMD with embossed carrier taping for automated assembly in compact power conversion and regulation boards.
• Vibration-Prone Systems — Vibration-resistant construction makes this capacitor appropriate for electronics exposed to mechanical stress and motion.

Unique Advantages

• AEC-Q200 Qualification: Provides the traceable qualification needed for automotive-grade reliability and design confidence.
• Compact, Assembly-Ready Package: φ10×10L chip-type can with embossed carrier taping enables high-density PCB layouts and automated placement.
• Low Impedance and Controlled Loss: Specified tan δ and high ripple-current ratings (450 mA @120 Hz, 900 mA @10 kHz) help manage AC stress and thermal rise in power circuits.
• High-Temperature Endurance: 2000 hours at 105°C supports long-term operation in elevated-temperature environments.
• Vibration Resistance: Built to withstand mechanical vibration, reducing risk of failure in mobile and harsh-environment applications.
• Regulatory Compliance: RoHS compliant for environmentally conscious designs.

Why Choose UCM1H331MNS1GS?

UCM1H331MNS1GS combines a compact chip-type SMD package with low-impedance characteristics and automotive-grade qualification to meet the needs of designs that require both electrical performance and environmental robustness. Its rated 330 µF/50 V capability, specified ripple currents, controlled loss (tan δ), and 2000-hour high-temperature endurance provide verifiable performance for demanding applications.

This capacitor is a practical choice for engineers specifying space-efficient, assembly-friendly components for automotive and other harsh-environment electronics where vibration resistance, RoHS compliance, and AEC-Q200 qualification are required.

Request a quote or contact sales to discuss pricing and availability for UCM1H331MNS1GS and to receive volume and lead-time information tailored to your project needs.