UCM1H470MCL1GS

The UCM1H470MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface‑mount assembly. It delivers 47 µF capacitance at a 50 V rating in a compact φ6.3×5.8 mm can with embossed carrier taping for automated placement.

Engineered for demanding environments, this part supports a −55 °C to 105 °C operating range, AEC‑Q200 qualification, and endurance of 2000 hours at 105 °C, making it suitable for electronic systems that require verified high‑temperature reliability.

Key Features

• Capacitance & Voltage — 47 µF nominal capacitance with a rated voltage of 50 V and tolerance of −20% to +20% for predictable charge storage.
• Low Impedance Chip Type — Specified as a chip‑type, low‑impedance design with an impedance of 680 mΩ to support stable performance in power circuits.
• Thermal and Endurance Performance — Rated for operation from −55 °C to 105 °C and endurance of 2000 hours at 105 °C, supporting long‑term high‑temperature use.
• Ripple and Leakage Characteristics — Low‑frequency ripple current of 97.5 mA (120 Hz), high‑frequency ripple current of 195 mA (10 kHz), and leakage current of 23.5 µA for controlled loss and heating.
• Loss Tangent (tan δ) — tan δ specified at 0.10 (measurement: 20 °C, 120 Hz, 50 V) for predictable dissipation characteristics.
• Compact Surface‑Mount Package — Small φ6.3×5.8 mm can in an SMD radial-style package with recommended land pattern 6.6×6.6 mm for high‑density PCB layouts.
• Assembly‑Ready Packaging — Supplied in embossed carrier taping for compatibility with automated pick‑and‑place equipment.
• Qualification & Compliance — AEC‑Q200 rated and RoHS compliant, addressing regulatory and industry qualification requirements.

Typical Applications

• Automotive electronics — Intended for use in automotive electronic modules where AEC‑Q200 qualification and high‑temperature endurance are required.
• Power supply modules — Suitable for board‑level power modules and assemblies that need compact, surface‑mount capacitance with defined ripple and leakage limits.
• Automated assembly lines — Packaged in embossed carrier tape for seamless integration into automated mounting processes.

Unique Advantages

• High‑temperature endurance: Rated for 2000 hours at 105 °C, providing long life under elevated operating temperatures.
• AEC‑Q200 qualification: Documented industry qualification supports use in regulated automotive and similarly demanding applications.
• Low impedance performance: 680 mΩ impedance helps minimize voltage drop and thermal dissipation in power circuits.
• Compact SMD form factor: φ6.3×5.8 mm size enables space‑efficient PCB designs while maintaining required capacitance.
• Assembly‑friendly packaging: Embossed carrier taping supports high throughput automated placement and consistent handling.
• Measured dissipation characteristics: tan δ of 0.10 at 20 °C and 120 Hz provides a verifiable basis for thermal and loss budgeting.

Why Choose UCM1H470MCL1GS?

UCM1H470MCL1GS combines a compact SMD can package with low‑impedance electrical performance and verified endurance at elevated temperatures. Its AEC‑Q200 rating and RoHS compliance position it for integration into designs where qualification and regulatory compliance matter.

This part is suited for engineers and procurement teams designing compact power systems and automotive electronics that require reliable film capacitance, predictable ripple handling, and assembly‑ready packaging to streamline manufacturing.

If you need pricing, lead‑time, or a formal quote for UCM1H470MCL1GS, submit a request for a quote or RFQ and our team will provide detailed purchasing information promptly.