UCM1H331MNL1GS

The UCM1H331MNL1GS is a chip-type, low-impedance aluminum electrolytic capacitor in a surface-mount radial-can package. It offers 330 µF capacitance at a 50 V rating with construction tailored for automated placement and high-temperature operation up to 105°C.

Targeted at automotive and surface-mount power-electronics designs, this Nichicon UCM-series part delivers controlled loss characteristics and ripple handling for applications that require AEC-Q200 qualification and RoHS compliance.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with ±20% tolerance, rated for 50 V operation.
• Low-Impedance Chip Construction — Designed as a chip-type low impedance capacitor; tangent of loss angle (tan δ) specified at 0.1 (20°C, 120 Hz) to indicate controlled dissipation.
• Ripple Current Capability — Low-frequency ripple current 450 mA at 120 Hz and high-frequency ripple current 900 mA at 10 kHz to support dynamic power demands.
• Leakage Current — Specified leakage current of 165 µA.
• Temperature & Endurance — Operating range −55°C to +105°C with a rated endurance of 2000 hours at 105°C.
• Package & Mounting — φ10 × 10L radial can SMD package for surface-mount assembly; packaged in embossed carrier tape for automated placement. Recommended land size L: 1.03 cm × W: 1.03 cm.
• Standards & Compliance — AEC-Q200 qualified and RoHS compliant; product is listed as in mass production.

Typical Applications

• Automotive Electronics — Designed for AEC-Q200-qualified automotive designs that require a 330 µF, 50 V surface-mount capacitor with elevated temperature endurance.
• Surface-Mount Power Modules — Suited for power-supply and power-management PCBs that use compact radial-can SMD capacitors for board-level filtering and decoupling.
• Automated Assembly Lines — Embossed carrier taping enables high-throughput placement on automatic mounting equipment for volume production.
• High-Temperature Environments — Rated for continuous operation up to 105°C with verified endurance at that temperature.

Unique Advantages

• AEC-Q200 Qualification — Provides a documented reliability baseline for automotive applications that require component-level qualification.
• Low Loss at Line Frequency — tan δ of 0.1 (20°C, 120 Hz) supports reduced dissipation in AC-biased or ripple-intensive circuits.
• Effective Ripple Handling — Dual ripple ratings (450 mA at 120 Hz and 900 mA at 10 kHz) address both low- and high-frequency power ripple conditions.
• Assembly-Ready Packaging — Embossed carrier taping and surface-mount case style simplify integration into automated manufacturing workflows.
• Compact SMD Can — φ10 × 10L footprint provides a high capacitance-per-package-volume option for constrained board space.
• Endurance at Elevated Temperature — 2000 hours at 105°C supports designs that must withstand sustained high-temperature operation.

Why Choose UCM1H331MNL1GS?

UCM1H331MNL1GS combines a high-value capacitance (330 µF) and 50 V rating with a low-impedance chip construction optimized for surface-mount, automated assembly. Its AEC-Q200 qualification and RoHS compliance make it a practical choice for designs requiring verified reliability and regulatory conformity.

This part is suited to designers and procurement teams building automotive and high-temperature power-electronics systems that need robust ripple handling, controlled loss characteristics, and endurance at elevated temperatures. Its mass-production status supports volume supply for production programs.

Request a quote or submit a parts inquiry to get pricing and availability for UCM1H331MNL1GS and to discuss sample or volume requirements for your project.