UCQ1C331MCL1GS

The UCQ1C331MCL1GS is an aluminum electrolytic, surface-mount capacitor from Nichicon's UCQ series, offering 330 µF of capacitance at a 16 V rating in a compact φ8 × 10 mm can. Designed for automated pick-and-place assembly with embossed carrier taping, this chip-type capacitor targets applications that require stable performance across a wide temperature range.

With AEC-Q200 qualification, a −55 °C to 105 °C operating range, and a rated endurance of 2000 hours at 105 °C, the UCQ1C331MCL1GS is positioned for demanding electronics including automotive and audio equipment where temperature tolerance and production-readiness matter.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance with a 16 V voltage rating and ±20% tolerance (120 Hz, 20 °C).
• Low Loss Performance — Tangent of loss angle (tan δ) of 0.22 measured at 120 Hz and 20 °C, suitable where reduced dissipation is required.
• Ripple Current Capability — 250 mA low-frequency ripple current at 120 Hz and 375 mA high-frequency ripple current at 10 kHz for power-filtering duty in compact designs.
• Leakage Current — Product-specified leakage current of 52.8 µA, supporting predictable bias behavior after charge.
• Robust Temperature & Endurance — Operates from −55 °C to 105 °C with a rated lifetime of 2000 hours at 105 °C.
• Automotive-Grade Reliability — AEC-Q200 qualification for use in applications requiring component-level automotive qualification.
• SMD Can Package & Assembly — Radial can SMD (φ8 × 10L) with embossed carrier taping and a recommended PCB land size of 8.3 × 8.3 mm for automated assembly.
• RoHS Compliant — Meets RoHS requirements for restricted substances.

Typical Applications

• Automotive Electronics — Suitable for vehicle electronic modules where AEC-Q200 qualification and wide temperature tolerance are required.
• Audio Equipment — Chip-type design intended for audio use, providing stable capacitance and low loss across the audible-relevant temperature range.
• Automated SMD Assembly — Embossed carrier taping and an SMD can package optimized for high-volume automatic mounting processes.

Unique Advantages

• High Capacitance in a Compact Footprint — 330 µF in a φ8 × 10 mm package enables high energy storage where board space is limited.
• Qualified for Automotive Applications — AEC-Q200 rating supports use in designs that demand automotive-level component qualification.
• Wide Operating Temperature Range — −55 °C to 105 °C operation and 2000-hour endurance at 105 °C provide reliability in thermally demanding environments.
• Production-Ready Packaging — Embossed carrier taping and specified surface-mount land size streamline placement and reduce handling time in volume manufacturing.
• Predictable Electrical Behavior — Specified tan δ, ripple current ratings, and leakage current give designers verifiable parameters for power-filtering and decoupling design decisions.

Why Choose UCQ1C331MCL1GS?

The UCQ1C331MCL1GS delivers a combination of high capacitance, automotive-grade qualification, and compact SMD packaging that suits engineers designing for automotive and audio equipment where temperature resilience and manufacturing efficiency are priorities. Its endurance rating and defined electrical characteristics make it a reliable choice for volume production and long-term operation in challenging environments.

Manufactured by Nichicon and supplied in embossed carrier tape for automated assembly, this part supports streamlined integration into production workflows while maintaining RoHS compliance and traceable performance parameters.

Request a quote or contact sales to discuss pricing, lead times, and sample availability for UCQ1C331MCL1GS.