UCX1H681MNS1MS

The UCX1H681MNS1MS is a chip-type aluminum electrolytic capacitor in the Nichicon UCX series designed for surface-mount applications. It delivers 680 µF at 50 V with a high operating temperature range up to 135°C and is available in carrier-tape packaging for automated assembly; the part is in mass production.

Engineered for demanding thermal and ripple environments, this device combines a 70 mΩ ESR (measured at 20°C, 100 kHz), specified low- and high-frequency ripple current ratings, and AEC‑Q200 qualification to address reliability-sensitive applications requiring long endurance at elevated temperature.

Key Features

• Electrical Capacity — 680 µF nominal capacitance with ±20% tolerance, rated at 50 V for bulk energy storage and transient management in compact SMD form.
• Low Temperature ESR Specification — ESR specified at 70 mΩ measured at 20°C/100 kHz, with added ESR data after -40°C testing to support designs across the full temperature range.
• Ripple Current Handling — Low-frequency ripple: 600 mA at 120 Hz; high-frequency ripple: 1.2 A at 10 kHz, enabling sustained AC stress performance within rated conditions.
• High-Temperature Endurance — Rated lifetime of 2000 hours at 135°C with endurance criteria (capacitance change within ±30%, tan δ within limits, leakage current ≤ initial spec) defined by the datasheet.
• Wide Operating Temperature — Specified for -40°C to +135°C operation, supporting high-temperature applications referenced in the product data.
• Surface-Mount, Tape-Fed Package — Chip can-style SMD (φ18 × 16.5 mm) packaged on embossed carrier taping for compatibility with automated placement equipment; recommended land size: 18.3 × 18.3 mm.
• Reliability & Standards — AEC‑Q200 qualified as indicated in the product information, and RoHS compliant per the product data.

Typical Applications

• Automotive electronics — Designed for use in automotive systems where AEC‑Q200 qualification, high-temperature capability to 135°C, and robust ripple handling are required.
• High-temperature equipment — Suitable for electronic assemblies that must operate reliably at elevated ambient temperatures up to 135°C, per the product specifications.
• Automated SMT production — Embossed carrier taping and chip-type SMD construction facilitate pick-and-place assembly for volume manufacturing.

Unique Advantages

• High thermal endurance: 2000 hours rated at 135°C provides quantifiable endurance data for high-temperature designs.
• Measured low-temperature ESR data: ESR specified at 20°C and after -40°C testing supports predictable performance across the specified temperature range.
• Dual-frequency ripple ratings: Explicit low- and high-frequency ripple current specifications (600 mA at 120 Hz and 1.2 A at 10 kHz) enable designers to match part selection to real-world ripple conditions.
• SMD-ready packaging: Embossed carrier tape packaging and defined land size simplify integration into automated surface-mount assembly processes.
• AEC‑Q200 qualification: Manufacturer-declared AEC‑Q200 status supports use in applications demanding recognized component-level reliability.

Why Choose UCX1H681MNS1MS?

UCX1H681MNS1MS is positioned for designs that require substantial bulk capacitance in a chip-type surface-mount package with verified performance at elevated temperatures. Its combination of 680 µF capacitance, 50 V rating, measurable ESR behavior, and defined ripple current ratings makes it suitable where reliable energy buffering and thermal endurance are priorities.

This part is well-suited to engineers and procurement teams specifying components for production assemblies requiring tape-fed SMD parts, long-term high-temperature operation, and AEC‑Q200-level reliability. The clear specification set simplifies validation and lifecycle planning for temperature- and stress-sensitive systems.

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