UCX1H821MNQ1MS

The UCX1H821MNQ1MS from Nichicon is a chip-type aluminum electrolytic capacitor in the UCX series, designed for surface-mount assembly. With a rated voltage of 50 V and 820 µF capacitance, it delivers high-capacity smoothing and energy storage in compact SMD packaging.

Engineered for high-temperature environments and automated production, this component combines a wide operating temperature range (−40°C to 135°C), AEC-Q200 qualification, and embossed carrier taping for automated mounting to support demanding electronics applications.

Key Features

• Capacitance & Voltage — 820 µF rated capacitance at 50 V provides bulk energy storage and smoothing in power circuits.
• Temperature Range & Endurance — Rated for operation from −40°C to 135°C with an endurance of 2000 hours at 135°C to support high-temperature applications.
• Low‑temperature ESR Specification — ESR specified at low temperature and measured ESR of 70 mΩ at 20°C/100 kHz for stable performance under high-frequency stress.
• Ripple Current Capability — Supports 600 mA at 120 Hz (low frequency) and 1.2 A at 10 kHz (high frequency) for effective ripple handling in power stages.
• Loss Tangent & Leakage — tanδ of 0.16 (measured at 20°C, 120 Hz) and a leakage current of 410 µA, enabling predictable AC loss and DC leakage behavior.
• Surface-Mount Packaging — Chip-type radial can for SMD placement, size φ18 × 16.5 mm, packaged on embossed carrier tape suitable for automatic mounting machines.
• Compliance & Qualification — RoHS compliant and AEC-Q200 listed in specifications.
• Polarized Device — Designed as a polarized electrolytic capacitor for DC power applications.

Typical Applications

• Automotive electronic modules — Bulk smoothing and decoupling in modules where AEC-Q200 qualification and operation to 135°C are required.
• Power supply filtering — Energy storage and ripple suppression in DC‑DC converters and linear regulators, leveraging high ripple current capability and low ESR.
• High-temperature embedded systems — SMD capacitor suited for boards exposed to elevated ambient temperatures up to 135°C.
• Automated PCB assembly — Embossed carrier taping and chip SMD packaging enable pick-and-place assembly in volume manufacturing.

Unique Advantages

• High-temperature endurance: 2000 hours at 135°C provides predictable life performance in hot environments.
• Low-temperature ESR characterization: ESR specified with low-temperature testing and 70 mΩ at 20°C/100 kHz supports stable high-frequency behavior.
• Broad ripple handling: Combined low- and high-frequency ripple ratings (600 mA at 120 Hz, 1.2 A at 10 kHz) address a range of power-conversion conditions.
• Automated assembly ready: Embossed carrier taping and SMD can package streamline placement for high-volume manufacturing.
• Standards and compliance: RoHS compliance and AEC-Q200 listing align with regulatory and qualification needs.
• Compact high-capacity form factor: 820 µF in a φ18 × 16.5 mm chip package minimizes board area while delivering bulk capacitance.

Why Choose UCX1H821MNQ1MS?

The UCX1H821MNQ1MS is positioned for designs that require a high-capacitance, high-temperature-capable SMD electrolytic solution with characterized ESR and ripple performance. Its combination of 820 µF at 50 V, validated endurance at 135°C, and assembly-friendly packaging makes it suitable for demanding power-electronics and automotive module applications where reliable bulk energy storage and predictable losses matter.

Designers and procurement teams seeking a robust SMD aluminum electrolytic capacitor with clear electrical and thermal specifications will find the UCX1H821MNQ1MS a practical choice for thermal-stress environments and automated manufacturing workflows.

If you would like pricing, lead-time details, or a custom quote for UCX1H821MNQ1MS, please submit a request to our sales team and reference the part number for a fast response.