UCX1V101MCS6GS

The UCX1V101MCS6GS is a chip‑type aluminum electrolytic capacitor from Nichicon's UCX series, designed for surface‑mount assembly and automated carrier‑tape feeding. It delivers 100 µF at a 35 V rating with an extended operating temperature range of -40 °C to +135 °C, targeting applications that require stable capacitance and defined ESR behavior across harsh thermal conditions.

With AEC‑Q200 qualification, a defined low‑temperature ESR specification, and endurance specified at elevated temperature, this part is suited for designs where high‑temperature tolerance, repeatable electrical performance and automated manufacturing compatibility are required.

Key Features

• Core Electricals — 100 µF rated capacitance at 35 V with capacitance tolerance of ±20% (–20% to +20%).
• Low‑Temperature ESR Spec — ESR defined as 250 mΩ at 100 kHz and an added ESR specification after the −40 °C test to ensure predictable performance in cold conditions.
• Impedance and Ripple Performance — Impedance listed at 15 Ω and ripple current ratings of 98.5 mA at 120 Hz and 197 mA at 10 kHz for frequency‑dependent ripple handling.
• High‑Temperature Endurance — Rated endurance of 2000 hours at 135 °C with specified limits on capacitance change, tan δ and leakage current following the endurance test.
• Reliability & Qualification — AEC‑Q200 qualified and RoHS compliant, supporting use in regulated and reliability‑focused programs.
• Surface‑Mount Package — Chip type SMD "radial, can" package sized L: 1.00 × D: 0.63 cm with recommended land size 6.6 × 6.6 mm and compatibility with automatic mounting using carrier tape.

Typical Applications

• Automotive Electronics — Power filtering and decoupling in automotive control modules where AEC‑Q200 qualification and operation to +135 °C are required.
• High‑Temperature Power Systems — Bulk and rail stabilization in power electronics that operate in elevated ambient temperatures up to 135 °C.
• Surface‑Mount Assemblies — Automated, tape‑fed production lines benefiting from chip‑type SMD packaging for efficient placement and reflow processing.

Unique Advantages

• Defined performance across −40 °C to +135 °C: Specification of operating temperature range and post‑low‑temperature ESR measurement provides design confidence in extreme environments.
• AEC‑Q200 qualification: Formal reliability qualification supports inclusion in designs targeting regulated or demanding markets.
• Long high‑temperature life: 2000 hours at 135 °C endurance rating documents sustained performance under continuous elevated temperature stress.
• SMD and automated assembly ready: Chip‑type SMD form factor and carrier‑tape compatibility simplify high‑volume PCB assembly flows.
• Measurable ripple handling: Specified ripple current values at 120 Hz and 10 kHz allow straightforward thermal and ripple budgeting in power designs.
• Regulatory compliance: RoHS compliance supports deployment in markets requiring restricted substance adherence.

Why Choose UCX1V101MCS6GS?

The UCX1V101MCS6GS combines a purpose‑built chip SMD package with electrical and environmental specifications tuned for high‑temperature, reliability‑focused designs. Its AEC‑Q200 qualification, defined low‑temperature ESR behavior and 2000‑hour endurance at 135 °C make it a practical option for applications that demand predictable capacitance and ESR across a wide temperature range.

This part is well suited to engineering teams specifying components for automotive and other harsh‑environment systems where automated assembly, documented endurance and compliance are important selection criteria.

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