UCZ1A331MCL1GS

CAP ALUM 330UF ±20% 10V SMD
Part Description

330 µF 10 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,841 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCZ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance330 µFECCNEAR99
ESR150 mOhm @ 100 kHzHeight Seated (Max)1.05 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp3000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency500 mA @ 10 kHzRipple Current Low Frequency250 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 10 mmSurface Mount Land Size10.3 x 10.3 mm
Tolerance-20%~20%Voltage10 V

Overview of UCZ1A331MCL1GS – Surface Mount 330 µF, 10 V Aluminum Electrolytic Capacitor

The UCZ1A331MCL1GS from Nichicon is a surface-mount aluminum electrolytic capacitor in the UCZ series, designed for chip-type, high-reliability applications. It provides 330 µF capacitance at a 10 V rating with low-temperature ESR performance and a wide operating range from −40 °C to +125 °C.

Targeted at demanding power electronics and automotive systems, this embossed-carrier-taped SMD capacitor delivers high ripple handling, defined ESR and loss tangent characteristics, and a long endurance spec for reliable operation in elevated-temperature environments.

Key Features

  • Capacitance & Voltage: 330 µF nominal capacitance with a 10 V rated voltage and ±20% tolerance for power rail decoupling and smoothing functions.
  • Low Loss / DF Specified: tanδ (DF) 0.30 measured at 20 °C, 120 Hz and 10 V, providing a verifiable loss characteristic for AC performance planning.
  • Defined ESR: ESR of 150 mΩ measured at 20 °C and 100 kHz enables predictable impedance behavior at high switching frequencies.
  • Ripple Current Capability: Low-frequency ripple current 250 mA (120 Hz) and high-frequency ripple current 500 mA (10 kHz) for handling dynamic loads.
  • Endurance & Temperature Range: Rated for 3000 hours at +125 °C and specified to operate from −40 °C to +125 °C for high-temperature applications.
  • Leakage Current: Specified leakage current of 33 µA, enabling predictable standby behavior in power-sensitive designs.
  • Package & Mounting: φ10 × 10L can-style SMD (chip type) designed for automatic mounting; supplied in embossed carrier taping for assembly efficiency.
  • Compliance & Qualification: RoHS compliant and AEC-Q200 qualified for use in applications requiring component-level reliability verification.

Typical Applications

  • Automotive Electronics: Suitable for electronic control modules and in-vehicle power rails where AEC-Q200 qualification and −40 °C to +125 °C operation are required.
  • Power Supply Filtering: Use on DC–DC converters and regulator outputs for bulk filtering and smoothing, leveraging 330 µF capacitance and 150 mΩ ESR.
  • Embedded System Power Rails: Board-level decoupling for microcontroller and power-management circuits that require compact SMD capacitors with defined ripple ratings.
  • Industrial Control Electronics: Filtering and energy buffering in controllers and sensor interfaces operating in high-temperature environments up to +125 °C.

Unique Advantages

  • High-Temperature Endurance: 3000-hour endurance at +125 °C provides long-term stability in elevated-temperature systems.
  • Predictable High-Frequency Behavior: ESR specified at 100 kHz (150 mΩ) gives designers measurable impedance for switching-power and high-frequency filtering designs.
  • Measurable Loss Characteristics: Defined tanδ (0.30 at 120 Hz, 20 °C) allows accurate AC-loss and thermal calculations for system-level reliability.
  • Assembly-Friendly Packaging: Embossed carrier taping supports automated placement for efficient manufacturing and reduced assembly handling.
  • Industry Qualification: AEC-Q200 rating and RoHS compliance offer traceable quality and environmental compliance for regulated applications.
  • Compact SMD Can Footprint: φ10 × 10L chip-style package delivers substantial capacitance in a small surface-mount form factor for space-constrained boards.

Why Choose UCZ1A331MCL1GS?

The UCZ1A331MCL1GS balances high capacitance, controlled ESR, and defined ripple handling in a compact chip-style SMD package, making it well-suited for power-filtering and decoupling duties in demanding thermal environments. Its AEC-Q200 qualification, RoHS compliance, and 3000-hour endurance at +125 °C position it for applications that require traceable reliability and long-term performance.

Designers specifying this Nichicon UCZ series part benefit from verifiable electrical parameters—capacitance, tanδ, ESR and ripple current—that simplify selection and system-level thermal and filtering calculations while supporting automated assembly through embossed carrier taping.

Request a quote or submit a sales inquiry to obtain pricing, availability, or support for integrating UCZ1A331MCL1GS into your next design.

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