UCZ1C331MCS1GS

The UCZ1C331MCS1GS is a high-reliability, chip-type aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 330 µF at a 16 V rating with polarization and a compact 1 cm × 1 cm package footprint.

Engineered for applications requiring wide operating temperatures and robust assembly characteristics, it is suitable for automotive electronics and other systems that need AEC-Q200 qualification, low-temperature ESR performance, and extended life at elevated temperature.

Key Features

• Capacitance and Voltage: 330 µF rated capacitance at 16 V with ±20% tolerance, providing bulk energy storage in a compact SMD package.
• High-temperature operation: Specified for -40 °C to +125 °C operation and endurance of 3000 hours at 125 °C, supporting high-temperature system deployment.
• Low-temperature ESR behavior: ESR specified at low temperature with an equivalent series resistance of 150 mΩ measured at 100 kHz, and added ESR specification after -40 °C testing.
• Assembly-ready package: Chip-type, surface-mount can design compatible with automatic mounting machines fed with carrier tape for efficient high-volume assembly.
• Reliability and quality: AEC-Q200 qualified and compliant to RoHS (2011/65/EU,(EU)2015/863), meeting industry reliability and environmental standards.
• Leakage and loss characteristics: Leakage current defined as ≤0.01CV (µA) after 2 minutes at 20 °C; tan δ specified (0.23 max. at 16 V, 120 Hz, 20 °C) for predictable AC performance.
• Assembly and thermal robustness: Meets soldering heat resistance criteria (hot plate 250 °C for 30 s) and is suitable for standard reflow processes used in automated assembly.
• Ripple current capability: Specified ripple currents of 250 mA at 120 Hz (low frequency) and 500 mA at 10 kHz (high frequency) for real-world power filtering needs.

Typical Applications

• Automotive Electronics: Applicable to automotive systems where AEC-Q200 qualification and operation across -40 °C to +125 °C are required.
• High-temperature Assembly Environments: Designed for automatic mounting with carrier tape and withstands soldering heat typical of reflow processes.
• High-temperature Electronics: Use in electronic equipment that must maintain capacitance and controlled ESR at elevated ambient temperatures up to +125 °C.

Unique Advantages

• AEC-Q200 Qualification: Supports use in demanding environments by meeting recognized automotive-equivalent reliability testing.
• Wide operating temperature span: Rated from -40 °C to +125 °C, enabling deployment in thermal extremes without changing the component footprint.
• Low-temperature ESR specification: Ensures defined ESR behavior after -40 °C testing, improving performance predictability in cold conditions.
• Extended high-temperature lifetime: 3000 hours at 125 °C provides long-term stability for designs operating at elevated temperatures.
• Tape-and-reel mounting compatibility: Chip form factor and carrier-tape compatibility speed assembly and reduce handling complexity for production lines.
• Regulatory compliance: RoHS-compliant materials support regulatory and environmental requirements.

Why Choose UCZ1C331MCS1GS?

The UCZ1C331MCS1GS blends high-capacitance density with a chip-style SMD can package designed for automated assembly and high-temperature operation. Its specified low-temperature ESR performance, AEC-Q200 qualification, and 3000-hour endurance at 125 °C make it a dependable choice where stable bulk capacitance and predictable ESR across a wide temperature range are required.

This part is aimed at engineers and procurement teams specifying components for automotive-qualified electronics, high-temperature equipment, and production lines that prioritize consistency, assembly efficiency, and regulatory compliance.

Request a quote or contact sales to discuss lead times, volume pricing, and availability for UCZ1C331MCS1GS.