UCZ1H330MCL6GS

CAP ALUM 33UF ±20% 50V SMD
Part Description

33 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 678 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUCZ
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance33 µFECCNEAR99
ESR500 mOhm @ 100 kHzHeight Seated (Max)8 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp2000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency197 mA @ 10 kHzRipple Current Low Frequency98.5 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension7.7 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage50 V

Overview of UCZ1H330MCL6GS – 33 µF, 50 V Chip Aluminum Electrolytic Capacitor (AEC‑Q200)

The UCZ1H330MCL6GS is a chip‑type aluminum electrolytic capacitor designed for high‑temperature operation up to +125°C. It delivers 33 µF at 50 V in a compact SMD can package intended for automated assembly and carrier‑tape mounting.

Targeted at environments requiring high reliability, the part is AEC‑Q200 qualified and RoHS compliant, with low‑temperature ESR specification and a specified endurance of 2000 hours at 125°C for its form factor.

Key Features

  • Core Type Chip‑type aluminum electrolytic capacitor in an SMD can (radial can) package suitable for surface‑mount assembly.
  • Electrical Performance 33 µF capacitance at 50 V rated voltage with ±20% tolerance; leakage current per series specification (0.01CV µA after 2 minutes at 20°C).
  • ESR & Frequency Behavior Specified equivalent series resistance of 500 mΩ at 100 kHz and additional ESR specification after −40°C testing to support low‑temperature performance.
  • Temperature & Endurance Operating range −40°C to +125°C and an endurance rating of 2000 hours at 125°C for the φ6.3 × 7.7 L case size.
  • Mechanical & Mounting Compact dimensions L 7.7 × D 6.3 mm with recommended surface‑mount land size 6.6 × 6.6 mm; compatible with automatic mounting machines supplied by carrier tape.
  • Compliance & Qualification AEC‑Q200 qualified and RoHS compliant for use in regulated environments.
  • Ripple Current Ratings Rated ripple current of 98.5 mA at 120 Hz and 197 mA at 10 kHz per the part specifications.

Typical Applications

  • Automotive electronics For subsystems and modules that require AEC‑Q200 qualified components and reliable operation to +125°C.
  • High‑temperature electronic assemblies Use where continuous operation at elevated ambient temperatures is required, supported by the 2000‑hour endurance at 125°C.
  • Automated surface‑mount production Chip can packaged for carrier‑tape feeding and placement on high‑throughput assembly lines.

Unique Advantages

  • High‑temperature endurance: Rated for operation to +125°C with a specified 2000‑hour endurance at that temperature for the matching case size.
  • AEC‑Q200 qualification: Meets AEC‑Q200 requirements, making it suitable for designs that demand automotive‑grade component qualification.
  • Low‑temperature ESR specification: ESR characterized including post‑test at −40°C, providing data for designs that span wide temperature ranges.
  • Compact SMD can: Small L 7.7 × D 6.3 mm footprint and defined land pattern enable dense board layouts and automated placement.
  • Manufacturing ready: Carrier‑tape compatibility simplifies integration into automated assembly lines.
  • Regulatory compliance: RoHS compliant to support regulated supply chains and product requirements.

Why Choose UCZ1H330MCL6GS?

The UCZ1H330MCL6GS combines a compact SMD can form factor with documented high‑temperature endurance and AEC‑Q200 qualification, delivering a reliable capacitor choice for demanding environments. Its specified ESR behavior, temperature range from −40°C to +125°C, and carrier‑tape compatibility make it well suited to applications where thermal resilience and automated assembly are priorities.

This part is appropriate for engineers and procurement teams designing or specifying modules that require traceable qualification, predictable performance across temperature extremes, and a small footprint for space‑constrained boards.

Request a quote or submit an inquiry to discuss availability, lead times and pricing for UCZ1H330MCL6GS.

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