UCZ1J220MCL1GS

The UCZ1J220MCL1GS is a chip-type aluminum electrolytic capacitor designed for high-reliability, high-temperature applications. It delivers 22 µF capacitance at a 63 V rating in a surface-mount, can-style package optimized for automated tape-fed assembly.

Engineered for operation from -40 °C to +125 °C and qualified to AEC‑Q200, this part targets applications that require stable capacitance, controlled ESR at low temperature, and proven endurance under elevated temperatures.

Key Features

• Capacitance & Voltage: 22 µF rated at 63 V with ±20% tolerance, suitable for decoupling and bulk energy storage in compact board layouts.
• High‑Temperature Operation: Rated operating temperature range of -40 °C to +125 °C with specified endurance (3000 hours at 125 °C) for long-term high‑temperature use.
• Low‑Temperature ESR Specification: ESR characterized down to -40 °C and specified as 700 mΩ at 100 kHz, providing predictable performance across the full temperature range.
• Ripple Current Ratings: Specified ripple current capability of 50 mA at 120 Hz and 100 mA at 10 kHz for both low‑ and high‑frequency applications.
• Surface‑Mount, Tape‑Feed Compatible: Chip/can SMD package designed for automatic mounting machines fed with carrier tape; recommended land size 8.3 × 8.3 mm.
• Reliability & Compliance: AEC‑Q200 qualified and RoHS compliant, with soldering-heat resistance and defined leakage current and tan δ limits per datasheet.
• Physical Footprint: Compact dimensions L: 1.0 cm × D: 0.8 cm with seated height considerations suitable for space‑constrained designs.

Typical Applications

• Automotive electronics — Designed for automotive systems where AEC‑Q200 qualification and operation to +125 °C are required.
• Surface‑mount production — Compatible with automatic tape‑fed placement processes for high-volume SMD assembly.
• High‑temperature environments — Suited to systems that demand stable ESR and capacitance from -40 °C up to +125 °C.

Unique Advantages

• High-temperature endurance: Rated for 3000 hours at 125 °C, enabling longer service life in elevated-temperature designs.
• Low-temperature performance: Added ESR specification after -40 °C testing provides predictable impedance and behavior in cold conditions.
• Automated assembly ready: Tape‑feed compatibility and SMD can package simplify integration into automated production lines.
• Qualified for demanding environments: AEC‑Q200 qualification and RoHS compliance support use in regulated and reliability‑focused programs.
• Compact SMD footprint: Small L × D profile and defined land pattern (8.3 × 8.3 mm) make it suitable for space‑constrained PCBs.

Why Choose UCZ1J220MCL1GS?

UCZ1J220MCL1GS combines a compact chip/can SMD form factor with a 63 V, 22 µF rating and engineered performance across -40 °C to +125 °C. Its low‑temperature ESR specification, defined ripple currents, and long high‑temperature endurance make it a strong candidate for designs that require reliable energy storage and stable impedance under thermal and electrical stress.

This part is well suited to engineers developing systems for automotive and other high‑reliability markets who need predictable capacitive behavior, assembly compatibility with tape‑fed pick‑and‑place lines, and supplier-backed qualification and compliance.

If you would like pricing, availability, or a formal quote for UCZ1J220MCL1GS, please submit a request or inquiry to receive a prompt response from our commercial team.