UCZ1V100MCL1GS
| Part Description |
10 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,441 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UCZ |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive, High Temperature Reflow | Capacitance | 10 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | 1.6 Ohm @ 100 kHz | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 125°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -40°C - 125°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 69 mA @ 10 kHz | Ripple Current Low Frequency | 34.5 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 6.3 mm | Surface Mount Land Size | 6.6 x 6.6 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UCZ1V100MCL1GS – Aluminum Electrolytic SMD Capacitor, 10 µF, 35 V, −40°C to +125°C
The UCZ1V100MCL1GS is a chip-type aluminum electrolytic capacitor from Nichicon’s UCZ series, designed for surface-mount applications that require stable operation across a wide temperature range. This polarized SMD capacitor delivers 10 µF at 35 V with low-temperature ESR characterization and is packaged for automated assembly from carrier tape.
Targeted at demanding environments, the part is specified for operation from −40°C to +125°C, carries AEC-Q200 qualification, and is RoHS compliant, making it suitable for automotive and industrial electronic designs where temperature endurance and reliable board-level mounting are required.
Key Features
- Capacitance & Voltage: 10 µF rated capacitance at 35 V, with tolerance ±20% (measured at 120 Hz, 20°C).
- Temperature Range & Endurance: Rated for operation from −40°C to +125°C; endurance specified at 1000 hours at 125°C for the φ6.3 × 5.8L case size.
- Low-Temperature ESR Specification: ESR defined at low temperature with a measured value of 1.6 Ω at 100 kHz, supporting stable behavior after −40°C testing.
- Ripple Current Ratings: Specified ripple performance of 34.5 mA at 120 Hz and 69 mA at 10 kHz for effective AC performance management.
- Package & Mounting: Chip-type SMD (φ6.3 × 5.8L) for automatic mounting from carrier tape; surface-mount land size recommended L: 6.6 × W: 6.6 mm.
- Reliability & Compliance: AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863) for regulated markets and reliability-focused designs.
- Soldering Robustness: Meets soldering heat resistance tested at 250°C for 30 seconds per datasheet conditions with defined post-test electrical limits.
- Physical Size: Compact footprint with dimensions L: 5.8 × D: 6.3 mm to support space-constrained PCB layouts.
Typical Applications
- Automotive electronics: Bulk decoupling and smoothing in modules requiring AEC-Q200-qualified, high-temperature components.
- Power conversion and regulation: Input/output filtering for DC–DC converters and regulators exposed to elevated ambient temperatures.
- Industrial controls and instrumentation: Board-level energy storage and ripple suppression where extended temperature endurance is needed.
- Sensor and ECU modules: Stabilizing supply rails in compact modules that require automated surface-mount assembly.
Unique Advantages
- High-temperature endurance: Specified 1000-hour endurance at 125°C for the φ6.3 × 5.8L case size, enabling sustained performance in hot environments.
- Low-temperature performance defined: ESR characterized after −40°C testing and specified at 1.6 Ω (100 kHz), reducing uncertainty in cold-start and low-temperature operation.
- Automated assembly ready: Supplied for carrier-tape feeding and surface-mount placement to streamline high-volume manufacturing.
- AEC-Q200 qualification: Provides an established reliability baseline for designs targeting automotive-grade or similarly demanding applications.
- Compact SMD footprint: Small physical dimensions (5.8 × 6.3 mm) and recommended land size simplify layout in space-constrained designs.
- Regulatory compliance: RoHS conformity supports use in regulated markets without additional material qualification overhead.
Why Choose UCZ1V100MCL1GS?
The UCZ1V100MCL1GS balances compact SMD packaging with clearly specified electrical and environmental performance, making it a practical choice for engineers designing power systems and modules that must operate reliably from −40°C up to +125°C. Its low-temperature ESR characterization, AEC-Q200 qualification, and soldering heat resistance provide predictable behavior across manufacturing and field conditions.
This part is well suited to automotive and industrial designs where certified reliability, automated assembly compatibility, and a small board footprint are priority considerations, delivering a component whose datasheet-backed specifications support long-term design decisions.
Request a quote or submit an inquiry to receive pricing and availability information for UCZ1V100MCL1GS. Our team can provide order support and technical details to help integrate this capacitor into your design.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016