UUD1V331MNL1GS

The UUD1V331MNL1GS is a chip-type aluminum electrolytic capacitor tailored for surface-mount applications that require low impedance and high-temperature endurance. It is designed for automated assembly on high-density PC boards and is verified to AEC-Q200 standards.

With a 330 µF capacitance at 35 V, a wide operating temperature range of −55°C to +105°C, and RoHS compliance, this capacitor targets demanding electronics including automotive systems that need stable smoothing and decoupling in compact SMD form factors.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance rated at 35 V to support bulk energy storage and smoothing on power rails.
• Low Impedance — Specified impedance of 90 mΩ for improved ripple handling and lower AC voltage drop in filter and decoupling roles.
• High Temperature Endurance — Rated for operation from −55°C to +105°C with a lifetime of 5000 hours at 105°C, supporting sustained operation in hot environments.
• Ripple Current Performance — 670 mA at 120 Hz and 1.005 A at 10 kHz to address both low- and high-frequency ripple conditions.
• Surface-Mount Chip Form — Chip-type, radial can SMD package designed for high-density PCB assembly and compatible with carrier-tape automated mounting.
• Reliability & Compliance — AEC-Q200 qualified and RoHS compliant, suitable for designs requiring regulated component standards.
• Polarized, Industry Tolerance — Polarized capacitor with ±20% capacitance tolerance appropriate for standard power supply designs.
• Compact Footprint — Small package dimensions (approximately 1.0 cm × 1.0 cm) and defined PCB land size for predictable board placement.

Typical Applications

• Automotive Electronics — Designed for electronic control modules and subsystems where AEC-Q200 qualification and operation up to +105°C are required.
• High-Density PCB Assemblies — Chip-type SMD format enables placement on compact, space-constrained boards used in compact power and control modules.
• Automated Surface-Mount Production — Compatible with carrier-tape feeding for streamlined automated pick-and-place assembly on production lines.

Unique Advantages

• AEC-Q200 Qualification: Provides an established reliability baseline for automotive and other high-reliability applications.
• Sustained High-Temperature Life: 5000 hours at +105°C delivers predictable long-term performance in thermally demanding environments.
• Low Impedance & Rated Ripple: 90 mΩ impedance plus specified ripple currents at 120 Hz and 10 kHz reduce voltage ripple and improve power rail stability.
• Surface-Mount, Tape-Feed Ready: Chip-type SMD format and carrier-tape compatibility simplify automated assembly and help reduce PCB area.
• Regulatory Compliance: RoHS compliance supports use in designs that require restricted-substance conformance.
• Compact Footprint: Small dimensions and specified PCB land size enable integration into space-constrained modules.

Why Choose UUD1V331MNL1GS?

The UUD1V331MNL1GS combines a high capacitance density with low impedance and robust high-temperature endurance, making it well suited for power filtering and decoupling in demanding electronic assemblies. Its chip-type SMD construction and carrier-tape compatibility support efficient automated production on high-density PCBs.

Engineers designing for automotive-grade and other high-reliability systems will find the AEC-Q200 qualification, specified ripple performance, and 5000-hour life at +105°C to be practical attributes that help ensure sustained circuit performance and predictable system behavior over time.

For pricing, availability, or to request a quote for UUD1V331MNL1GS, please contact sales to discuss your quantity and delivery requirements.