UUD1V4R7MCL1GS

The UUD1V4R7MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor designed for surface-mount assembly. It delivers 4.7 µF capacitance at a 35 V rating in a compact φ4 × 5.8 mm SMD can, optimized for high‑density PCBs and automated placement.

With an operating temperature range of -55°C to 105°C, AEC‑Q200 qualification, low leakage and defined ripple current ratings, this part is intended for demanding automotive and industrial electronic power management applications where space, reliability and thermal endurance are important.

Key Features

• Capacitance & Voltage: 4.7 µF rated capacitance with a 35 V nominal voltage suited for local energy storage and decoupling in power rails.
• Low Impedance Design: Impedance specified at 1.8 Ω and a low loss tangent (tanδ = 0.12 measured at 20°C, 120 Hz) for efficient AC performance.
• Ripple Current Ratings: Low‑frequency ripple current 80 mA (120 Hz) and high‑frequency ripple current 120 mA (10 kHz) to support suppression of ripple across a range of frequencies.
• Reliability & Endurance: Lifecycle endurance of 2000 hours at 105°C (specified for φD = 4) with leakage current specified at 3 µA, supporting long-term operation under elevated temperature.
• Automotive Grade: AEC‑Q200 qualified and listed for automotive applications, indicating suitability for automotive electronic designs.
• Compact SMD Package: φ4 × 5.8 mm radial can SMD package with embossed carrier taping for automatic mounting and high‑density board layouts; recommended land size L: 4.3 × W: 4.3 mm.
• Wide Temperature Range & Compliance: Operates from -55°C to 105°C and is RoHS compliant.

Typical Applications

• Automotive Electronic Modules: Local decoupling and filtering in control units and sensor modules where AEC‑Q200 qualification and thermal endurance are required.
• Power Supply Decoupling: Smoothing and transient suppression on DC power rails benefiting from the part’s low impedance and defined ripple current capabilities.
• High‑Density PCB Designs: Compact SMD can with embossed carrier taping for automated placement in space‑constrained electronic assemblies.

Unique Advantages

• AEC‑Q200 Qualification: Provides an explicit qualification level for automotive applications, supporting use in automotive electronic designs.
• Reliable High‑Temperature Operation: Specified for −55°C to 105°C operation with 2000 hours endurance at 105°C for sustained performance in elevated temperature environments.
• Low Leakage & Stable Loss: Leakage current specified at 3 µA and tanδ = 0.12 (20°C, 120 Hz) for predictable behavior in precision and power circuits.
• Frequency‑Versatile Ripple Handling: Defined ripple current values at both 120 Hz and 10 kHz allow designers to assess performance across typical low and high frequency loading conditions.
• Assembly‑Friendly Packaging: Embossed carrier taping enables automated SMT placement for streamlined manufacturing and higher throughput.

Why Choose UUD1V4R7MCL1GS?

The UUD1V4R7MCL1GS combines compact SMD packaging with low impedance and defined ripple capabilities to meet the needs of modern power and automotive electronics. Its AEC‑Q200 qualification, broad temperature range and 2000‑hour endurance at 105°C make it a suitable choice for designs that require reliable performance under thermal stress.

This part is well suited to engineers and procurement teams targeting compact, assembly‑friendly capacitors for automotive and industrial power management designs where measured impedance, leakage and ripple specifications must be met with predictable, documented performance.

Request a quote or contact sales to discuss availability, lead times and sample requirements for UUD1V4R7MCL1GS.