UUD1V470MCL1GS

The UUD1V470MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It delivers 47 µF at 35 V in a compact radial can SMD package optimized for automated, carrier-tape assembly.

Built for elevated-temperature operation and durability, this capacitor is RoHS compliant and AEC-Q200 qualified, making it suitable for demanding applications where low impedance, compact size, and assembly compatibility are required.

Key Features

• Electrical Rating — 47 µF capacitance at a 35 V rated voltage with ±20% tolerance, providing a stable capacitance value for board-level designs.
• Low Impedance Performance — Specified impedance of 440 mΩ supports low-impedance requirements; ripple current capability is 230 mA at 120 Hz and 345 mA at 10 kHz.
• High Temperature Endurance — Operating temperature range from −55 °C to +105 °C and rated for 2000 hours at 105 °C, enabling reliable operation in elevated-temperature environments.
• Package and Mounting — Chip-type radial can SMD package sized L: 5.8 × D: 6.3 mm with recommended land size L: 6.6 × W: 6.6 mm; designed for surface mounting on high-density PCBs and compatible with carrier-tape automated placement.
• Reliability and Compliance — AEC-Q200 qualified and compliant with the RoHS directive (2011/65/EU, (EU)2015/863), suitable for regulated production environments.
• Polarized Electrolytic — Polarized design appropriate for circuits requiring electrolytic capacitance; leakage current and tan δ characteristics follow the UUD series specifications.

Typical Applications

• Automotive Electronics — Suitable for automotive modules where AEC-Q200 qualification and an operating range to +105 °C are required.
• High-Density Surface-Mount Assemblies — Designed for placement on compact, densely populated PCBs thanks to its chip-type SMD can package.
• Automated, High-Volume Manufacturing — Applicable to automatic mounting machines and carrier-tape feed for streamlined assembly and throughput.

Unique Advantages

• Compact SMD Can Package — Small footprint (L: 5.8 × D: 6.3 mm) enables space-efficient placement on dense PCBs.
• Low Impedance with Defined Ripple Ratings — 440 mΩ impedance and ripple current specs at both 120 Hz and 10 kHz support stable performance under AC stress.
• High-Temperature Durability — Rated for −55 °C to +105 °C and 2000 hours at 105 °C to support extended operation in hot environments.
• AEC-Q200 Qualification — Qualification for AEC-Q200 provides an added reliability marker for applications targeting regulated or ruggedized markets.
• Assembly-Friendly — Designed for surface-mount placement and carrier-tape automated handling to reduce handling complexity and support high-volume production.
• RoHS Compliant — Conforms to RoHS (2011/65/EU, (EU)2015/863) for environmental regulatory compliance in production.

Why Choose UUD1V470MCL1GS?

UUD1V470MCL1GS combines a compact chip-type SMD can with low impedance and rated ripple performance to support dense PCB designs that require reliable electrolytic capacitance at elevated temperatures. Its AEC-Q200 qualification and RoHS compliance make it appropriate for regulated production environments that demand traceable reliability.

This capacitor is well suited to engineers and procurement teams designing assemblies for automotive and other high-temperature applications where automated placement, compact form factor, and defined electrical characteristics are priorities.

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