UUG1J331MNJ1MS

The UUG1J331MNJ1MS is a surface-mount aluminum electrolytic chip capacitor from Nichicon's UUG series, offering a higher capacitance range in a compact SMD can package. It is designed for automotive and other demanding electronic systems that require bulk capacitance, defined ripple handling and automotive-grade component ratings.

Key Features

• Capacitance & Tolerance — 330 µF nominal capacitance with ±20% tolerance (measured at 120 Hz, 20°C), providing defined bulk energy storage.
• Voltage Rating — Rated at 63 V to support higher-voltage system buses.
• Ripple Current Handling — Low-frequency ripple current of 680 mA (120 Hz) and high-frequency ripple current of 1.02 A (10 kHz), useful for smoothing and filtering across a range of frequencies.
• Leakage Current — Specified leakage current of 623.7 µA after rated voltage application, enabling predictable bias behavior in designs.
• Automotive-Grade Qualification — Rated to AEC-Q200, matching requirements for many automotive electronic applications.
• Endurance and Temperature Range — Rated for 2000 hours at 85°C and an operating temperature range of −40°C to +85°C for long-term stability in elevated-temperature environments.
• Package & Mounting — Chip-type SMD can (φ16 × 16.5 mm length) with embossed carrier taping for automated surface-mount assembly; surface mount land size: 1.63 × 1.63 cm.

Typical Applications

• Automotive electronics — Suitable for automotive electronic modules where an AEC-Q200-rated, surface-mount bulk capacitor is required.
• Power bus smoothing — 330 µF at 63 V provides bulk energy storage and smoothing for higher-voltage DC buses.
• Ripple mitigation in power stages — Specified ripple current ratings at 120 Hz and 10 kHz support filtering across low and high frequency components.

Unique Advantages

• AEC-Q200-rated reliability — Meets an automotive component qualification standard for use in automotive electronic assemblies.
• Defined ripple performance — Separate low- and high-frequency ripple current specs (680 mA at 120 Hz, 1.02 A at 10 kHz) support designers targeting multi-frequency power conditioning.
• Compact SMD can format — φ16 × 16.5 mm chip package offers higher capacitance in a surface-mount form factor compatible with automated assembly.
• High-voltage capability — 63 V rating enables use on higher-voltage rails without series stacking.
• Long endurance at elevated temperature — 2000 hours at 85°C offers predictable lifetime behavior for temperature-stressed applications.
• Embossed carrier taping — Packaging suited for high-throughput pick-and-place and reflow assembly processes.

Why Choose UUG1J331MNJ1MS?

The UUG1J331MNJ1MS combines a high 330 µF capacitance with a 63 V rating in a chip-type surface-mount can, delivering defined ripple current capability and leakage characteristics that make it a practical choice for higher-voltage power conditioning. With AEC-Q200 rating and a 2000-hour endurance at 85°C, it targets designs that require automotive-grade reliability and long-term performance in elevated-temperature environments.

This part is well suited for engineers specifying bulk capacitance and ripple handling in surface-mount assemblies for automotive systems and other robust electronic applications that demand traceable electrical characteristics and packaging compatible with automated manufacturing.

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