UUJ1E331MNQ1MS

The UUJ1E331MNQ1MS from Nichicon is a chip-type aluminum electrolytic capacitor in the UUJ series, offering 330 µF capacitance at a 25 V rating. Engineered for surface-mount placement on high-density PC boards, it combines higher capacitance in larger chip case sizes with qualification for demanding environments.

Designed for automated assembly, RoHS compliance, and AEC-Q200 qualification, this part targets automotive and other applications requiring wide operating temperature range and long-term endurance.

Key Features

• Capacitance & Voltage — 330 µF nominal capacitance with a 25 V rating and ±20% tolerance for bulk energy storage and decoupling in compact SMD form.
• Chip-Type SMD Package — Radial can-style SMD package sized L: 1.35 × D: 1.25 cm with recommended land pattern L: 1.28 × W: 1.28 cm, optimized for high-density PCB layouts.
• Automated Assembly Ready — Applicable to automatic mounting machines and supplied in carrier tape format for pick-and-place compatibility.
• Wide Temperature Range — Operating range from −55 °C to +105 °C, suitable for applications that require low-temperature performance and high-temperature endurance.
• Long Endurance — Rated for 5000 hours at 105 °C with defined limits: capacitance change within ±20%, tan δ within 200% of initial, and leakage current not exceeding initial spec after endurance testing.
• Electrical Performance — Ripple current handling of 320 mA at 120 Hz and 480 mA at 10 kHz; leakage current after 1 minute at 20 °C meets the series specification I ≤ 0.03 × C × V (μA) for 10–100 V range.
• Compliance & Qualification — Compliant with RoHS (2011/65/EU, (EU)2015/863) and AEC-Q200 qualified for applications requiring industry-recognized component qualification.

Typical Applications

• Automotive electronics — Suited for electronic control modules and subsystems where AEC-Q200 qualification is required.
• High-density surface-mount PCBs — Designed for compact board layouts that demand higher capacitance in an SMD-compatible chip form.
• Automated manufacturing — Compatible with carrier-tape fed pick-and-place assembly for streamlined production.
• Temperature-stressed systems — Applicable where operation across −55 °C to +105 °C and extended high-temperature endurance are essential.

Unique Advantages

• AEC-Q200 Qualified: Provides the documented qualification needed for designs targeting automotive or similarly demanding markets.
• High Capacitance in SMD Form: Delivers 330 µF in a compact chip package to reduce board area while maintaining bulk capacitance.
• Designed for Automated Assembly: Carrier-tape compatibility and SMD can-style packaging simplify high-volume production and placement.
• Proven Endurance: 5000 hours at 105 °C with controlled limits on capacitance, dissipation factor, and leakage ensures predictable long-term performance.
• Broad Temperature Performance: −55 °C to +105 °C operating range supports designs exposed to wide thermal cycles.

Why Choose UUJ1E331MNQ1MS?

UUJ1E331MNQ1MS combines the higher capacitance of larger chip case sizes with SMD mounting convenience and automated assembly readiness. Its combination of 330 µF at 25 V, defined ripple current ratings, and long-term endurance at elevated temperature make it a practical choice for engineers designing compact, reliable power-supply and electronic modules—particularly in automotive and other temperature-challenging environments.

Backed by Nichicon’s UUJ series specifications and AEC-Q200 qualification, this part supports robust, production-ready designs that require traceable qualification, RoHS compliance, and consistent long-term behavior under thermal stress.

If you would like pricing, lead-time information, or a formal quote for UUJ1E331MNQ1MS, please request a quote or contact sales to discuss availability and volume options.