UUL1H100MCL1GS

CAP ALUM 10UF ±20% 50V SMD
Part Description

10 µF 50 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,862 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUUL
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotiveCapacitance10 µFECCNEAR99
ESRN/AHeight Seated (Max)6.1 mmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp5000 h @ 105°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 105°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency45 mA @ 10 kHzRipple Current Low Frequency30 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension5.8 x 6.3 mmSurface Mount Land Size6.6 x 6.6 mm
Tolerance-20%~20%Voltage50 V

Overview of UUL1H100MCL1GS – 10 µF, 50 V Aluminum Electrolytic Chip Capacitor

The UUL1H100MCL1GS is a chip-type aluminum electrolytic capacitor designed for surface mounting on high-density printed circuit boards. It delivers 10 µF capacitance at a 50 V rating with polarized construction and is engineered for long-life operation in elevated-temperature applications.

Key value propositions include a 5000-hour load life at +105°C, AEC-Q200 qualification, and RoHS compliance, making this part suitable for demanding environments where reliability and compact SMD packaging are required.

Key Features

  • Electrical Performance 10 µF nominal capacitance with ±20% tolerance and a 50 V rated voltage suitable for general decoupling and energy-storage tasks within its voltage class.
  • High-Temperature Endurance Rated for operation from −40°C to +105°C with a specified load life of 5000 hours at +105°C; endurance limits include capacitance change within ±30% after the life test.
  • Automotive-Grade Reliability AEC-Q200 qualified, supporting use in applications requiring industry-recognized quality standards for electronic components.
  • Surface-Mount Can Package Radial, can-style SMD package optimized for high-density PCB assembly; case dimension L: 5.8 × D: 6.3 mm and recommended land size L: 6.6 × W: 6.6 mm.
  • Low Leakage and Loss Characteristics Datasheet leakage specification: after 2 minutes at rated voltage and 20°C, leakage current ≤ 0.01 CV or 3 µA (whichever is greater); tan δ values defined across rated voltages to characterize dissipation.
  • Manufacturing Robustness Meets resistance-to-soldering-heat criteria (hot plate at 250°C for 30 seconds) with capacitance change within ±10% and unchanged leakage/tan δ within specified limits.
  • Compliance RoHS directive compliant (2011/65/EU, (EU)2015/863).

Typical Applications

  • Automotive electronics Suitable for surface-mounted use in automotive electronic assemblies where AEC-Q200 qualification and extended high-temperature life (5000 h at +105°C) are required.
  • Power supply decoupling Use for smoothing and decoupling tasks within 50 V systems where 10 µF capacitance and specified ripple current (30 mA at 120 Hz, 45 mA at 10 kHz) meet circuit needs.
  • High-density PCB assemblies Designed for compact surface-mount placement on high-density boards thanks to its radial can SMD package and small footprint (5.8 × 6.3 mm).
  • Thermally stressed environments Appropriate for applications requiring reliable operation across −40°C to +105°C and validated endurance after extended high-temperature exposure.

Unique Advantages

  • Long operational life: 5000 hours at +105°C provides predictable aging characteristics for designs that must withstand prolonged elevated temperatures.
  • AEC-Q200 qualified: Formal qualification supports use in designs that require recognized reliability standards for demanding environments.
  • Compact SMD can footprint: Small L × D dimensions and recommended land pattern enable placement on high-density PCBs while maintaining through-life performance.
  • Documented thermal and solder robustness: Resistance-to-soldering-heat verification at 250°C for 30 seconds reduces assembly risk for typical solder processes.
  • Measured leakage and dissipation data: Clear leakage current and tan δ specifications allow designers to evaluate end-of-life and in-circuit behavior against application requirements.
  • Regulatory compliance: RoHS conformity simplifies environmental compliance for global manufacturing.

Why Choose UUL1H100MCL1GS?

The UUL1H100MCL1GS combines a compact surface-mount can package with verified high-temperature endurance and AEC-Q200 qualification, offering a reliable capacitor solution for assemblies that demand long life under thermal stress. Its documented electrical characteristics—capacitance, leakage, tan δ, and ripple current—give engineers concrete data to design and validate power and decoupling functions.

This part is well suited to OEMs and engineers building robust electronic modules where space is limited, environmental compliance is required, and predictable behavior over extended high-temperature exposure is essential.

Request a quote or contact sales to check availability, pricing, and lead times for UUL1H100MCL1GS. Provide your quantity and delivery requirements to receive a prompt response.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


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