UUP1E3R3MCL1GS
| Part Description |
3.3 µF 25 V ±20% Bi-Polar Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,534 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UUP |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 3.3 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 6.1 mm | HTS Code | 8532.22.0020 | ||
| Impedance | N/A | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Bi-Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 18 mA @ 10 kHz | Ripple Current Low Frequency | 12 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.8 x 5 mm | Surface Mount Land Size | 5.3 x 5.3 mm | ||
| Tolerance | -20%~20% | Voltage | 25 V |
Overview of UUP1E3R3MCL1GS – 3.3 µF, 25 V Bi‑Polar Chip Aluminum Electrolytic Capacitor
The UUP1E3R3MCL1GS is a chip‑type, bi‑polarized aluminum electrolytic capacitor from Nichicon's UUP series. Optimized for surface mounting on high‑density PC boards, it is suitable for automated placement using carrier tape and is RoHS compliant. With AEC‑Q200 qualification and an operating temperature range of −55°C to +105°C, this part addresses demanding thermal and reliability requirements in automotive and industrial electronics.
Key Features
- Bi‑Polarized construction — Chip type capacitor specified as bi‑polarized for designs that call for non‑polar or bipolar capacitor behavior.
- Temperature and endurance — Rated for −55°C to +105°C with a specified endurance of 1000 hours at 105°C (with polarity changes every 250 hours as defined in endurance testing).
- Electrical characteristics — 3.3 µF capacitance at 25 V with tolerance ±20%, leakage current specified as ≤ 0.05·C·V or 10 µA (whichever is greater) after 2 minutes at 20°C, and a maximum tan δ of 0.17 at the 25 V rating.
- Ripple current — Rated ripple current of 12 mA at 120 Hz and 18 mA at 10 kHz, with frequency coefficients defined in the UUP series (120 Hz = 1.00; ≥10 kHz = 1.50).
- Package and mounting — Radial can SMD (chip type) designed for surface mounting on high‑density PC boards; compatible with automatic mounting machines fed with carrier tape.
- Automotive qualification and compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), supporting use in regulated environments.
- Low‑temperature stability (25 V rating) — Impedance ratios defined as Z(−25°C)/Z(+20°C) ≤ 2 and Z(−40°C)/Z(+20°C) ≤ 4 for the 25 V rating.
- Compact footprint — Physical size 5.8 × 5.0 mm (L × D) with a recommended surface mount land size of 5.3 × 5.3 mm.
Typical Applications
- Automotive electronics — For use in automotive electronic assemblies where AEC‑Q200 qualification and wide temperature operation are required.
- High‑density surface‑mount assemblies — Designed for placement on tightly packed PCBs and compatible with carrier‑tape automated mounting.
- Thermally demanding environments — Suited to circuits that require sustained performance up to +105°C and validated endurance at elevated temperature.
Unique Advantages
- AEC‑Q200 qualification — Provides a defined qualification level for applications that require recognized automotive testing.
- High temperature endurance — 1000 hours at 105°C endurance specification supports long‑term performance in elevated temperature conditions.
- Defined electrical performance — Clear leakage current and tan δ limits, plus specified ripple current at both low and high frequencies, simplify design margin calculations.
- Surface‑mount ready — Chip can package and carrier‑tape compatibility enable high‑volume automated assembly and compact PCB layouts.
- RoHS compliance — Meets 2011/65/EU and (EU)2015/863 requirements for restricted substances.
Why Choose UUP1E3R3MCL1GS?
UUP1E3R3MCL1GS combines a compact chip‑type package with bi‑polarized aluminum electrolytic construction, delivering defined electrical parameters and endurance for applications that must tolerate wide temperature swings and rigorous qualification. Its combination of AEC‑Q200 qualification, RoHS compliance, and automated‑assembly compatibility makes it a practical choice for engineers specifying capacitors for automotive and other demanding electronic systems.
If you would like pricing, availability, or technical details for UUP1E3R3MCL1GS, please request a quote or contact sales to discuss your requirements and obtain a formal quotation.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016