UUR1E331MNL6GS

The UUR1E331MNL6GS is a chip-type aluminum electrolytic capacitor providing higher capacitance in a compact surface-mount can package. It is designed for high-density PCBs and for automated assembly using carrier tape feeding.

This part is RoHS compliant and AEC-Q200 listed for automotive applications. Note: this product is scheduled to be discontinued and is not recommended for new designs.

Key Features

• Capacitance & Voltage — 330 µF rated capacitance at 25 V for bulk energy storage and smoothing in compact SMD formats.
• Chip-type SMD Package — Radial, can-style surface-mount package sized L: 1.0 × D: 0.8 cm and compatible with carrier-tape automatic mounting.
• Temperature Range & Endurance — Rated for −40 °C to +85 °C with endurance specified as 2000 hours at 85 °C under rated voltage.
• Ripple Current Performance — Specified ripple current of 284 mA at 120 Hz and 369.2 mA at 10 kHz to support power-decoupling duties across frequency ranges.
• Leakage Current — Leakage current meets the datasheet formula: after 1 minute’s application of rated voltage at 20 °C, I ≤ 0.03 × C × V (μA), where C is capacitance and V is rated voltage.
• Stability and Loss — Capacitance tolerance ±20%; tangent of loss angle (tan δ) for 25 V is specified at a maximum of 0.16 (measured at 120 Hz, 20 °C).
• Low-temperature Impedance — Impedance ratios for 25 V: Z(−25 °C)/Z(+20 °C) = 2 and Z(−40 °C)/Z(+20 °C) = 4, supporting operation in cold environments.
• Soldering Robustness — Meets resistance-to-soldering-heat criteria (hot plate 250 °C, 30 s) with capacitance change within ±10% after recovery to 20 °C.
• Compliance — RoHS compliant and AEC-Q200 listed for use in automotive electronics where that qualification is required.

Typical Applications

• Automotive Electronics — Bulk filtering and decoupling on control modules and electronic subassemblies that require AEC-Q200 listed components.
• High-density SMD Power Supplies — Energy storage and smoothing on compact, surface-mounted power and distribution boards.
• Automated Assembly Lines — Designed for carrier-tape feeding and automatic placement on high-volume production lines.

Unique Advantages

• High Capacitance in an SMD Can — 330 µF in a compact chip-type can reduces board area compared to through-hole alternatives.
• Assembly-friendly Packaging — Carrier-tape compatibility and surface-mount format simplify automated placement and throughput.
• Automotive-oriented Qualification — AEC-Q200 listing supports use in automotive-grade electronics and environments.
• Designed for Temperature and Life — Specified for −40 °C to +85 °C operation with 2000-hour endurance at 85 °C for predictable service life in thermal stress conditions.
• Measured AC Performance — Published ripple current values at 120 Hz and 10 kHz and defined tan δ support engineers in frequency-domain design tradeoffs.
• Regulatory Compliance — RoHS compliance supports environmental and regulatory requirements in procurement and manufacturing.

Why Choose UUR1E331MNL6GS?

The UUR1E331MNL6GS positions itself as a compact, high-capacitance SMD solution for designs that require robust filtering and energy storage in space-constrained layouts. With explicit ripple current, impedance and loss-angle data, plus endurance and soldering-heat specifications, engineers can evaluate performance against system-level thermal and frequency requirements.

This part is particularly suited to established automotive and industrial designs that require AEC-Q200-listed aluminum electrolytic capacitors and automated assembly compatibility. Note the product is scheduled for discontinuation and is not recommended for new designs; use this information when planning long-term supply and BOM management.

For pricing, lead-time inquiries or to request a formal quote for UUR1E331MNL6GS, submit a request to the supplier sales channel or request a quote through official procurement channels.