UUR1V330MCL1GS

The UUR1V330MCL1GS is a chip-type aluminum electrolytic capacitor delivering 33 µF at 35 V in a compact surface-mount radial-can package. It is designed for high-density PC boards and automated assembly using carrier tape for pick-and-place compatibility.

With AEC-Q200 qualification and RoHS compliance, this capacitor targets demanding applications that require high capacitance in a small SMD footprint while maintaining defined endurance and temperature specifications.

Key Features

• Capacitance & Voltage — 33 µF rated capacitance at 35 V with ±20% tolerance for bulk decoupling and energy storage in compact circuits.
• Package & Mounting — Chip-type radial can SMD, size L: 5.8 × D: 6.3 mm with surface-mount compatibility for high-density PCB layouts and automatic mounting by carrier tape.
• Electrical Performance — Polarized aluminum electrolytic construction; low-frequency ripple current 55 mA (120 Hz) and high-frequency ripple current 91.85 mA (10 kHz).
• Temperature & Lifetime — Operating range −40 °C to +85 °C with an endurance rating of 2000 hours at 85 °C.
• Reliability Specs — AEC-Q200 rated; leakage current specified as ≤0.03CV (µA) after 1 minute at 20 °C; tan δ max 0.14 at 35 V (measured at 120 Hz, 20 °C).
• Soldering Robustness — Resistance to soldering heat per datasheet: exposure to 250 °C for 30 seconds with capacitance change within ±10% on recovery to 20 °C.
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive Electronics — Energy storage and smoothing in control modules and power subsystems where AEC-Q200 qualification is required.
• Power Supply Filtering — Output filtering and decoupling in compact DC–DC converter designs on high-density PCBs.
• Sensor and Control Modules — Local bulk capacitance for stabilized power rails in compact sensor, communication, and control assemblies.

Unique Advantages

• High capacitance in small SMD footprint: 33 µF at 35 V in a 5.8 × 6.3 mm package enables bulk energy storage without large board area.
• Designed for automated assembly: Carrier-tape compatibility and chip-type SMD form factor simplify placement on high-density production lines.
• Automotive-grade reliability: AEC-Q200 rating provides defined qualification for automotive and other high-reliability uses.
• Defined endurance and temperature performance: 2000 hours at 85 °C and an operating range of −40 °C to +85 °C support stable performance across typical operating environments.
• Measured electrical characteristics: Specified ripple currents, low leakage (≤0.03CV μA), and tan δ limits give clear parameters for circuit design and thermal budgeting.
• RoHS compliance: Conforms to current RoHS directives for regulatory and environmental requirements.

Why Choose UUR1V330MCL1GS?

UUR1V330MCL1GS combines high capacitance density with a compact chip-type SMD can, making it suitable for designers who need reliable bulk capacitance on space-constrained PCBs. Backed by AEC-Q200 qualification and controlled endurance ratings, it provides verifiable performance parameters for demanding applications.

Manufactured by Nichicon, this part is well suited to projects that require clear electrical limits (leakage, tan δ, ripple current) and compatibility with automated assembly processes, enabling straightforward integration into production workflows.

Request a quote or contact sales to discuss availability and pricing for UUR1V330MCL1GS and to obtain further technical information for your design.