UWG1C680MCL1GS

The UWG1C680MCL1GS is a chip-type, low-impedance aluminum electrolytic capacitor designed for surface mounting on high-density PC boards. It is optimized for applications requiring compact bulk capacitance with robust thermal and electrical endurance.

This part supports an operating temperature range of −55°C to +105°C, carries AEC-Q200 qualification, and is RoHS compliant, making it suitable for demanding embedded and automotive electronics where reliability and long-term stability are required.

Key Features

• Capacitance and Voltage — 68 µF rated capacitance at 16 V, with a tolerance of −20% to +20% for predictable charge storage in power and decoupling circuits.
• Low Impedance — Specified impedance of 400 mΩ, supporting lower ripple and improved transient response in power supply decoupling.
• Ripple Current Capability — Rated ripple current of 115 mA at 120 Hz and 230 mA at 10 kHz to handle both low- and high-frequency ripple components.
• Thermal and Endurance — Operates from −55°C to +105°C with a rated lifetime of 1000 hours at 105°C, meeting endurance requirements for long-term thermal stability.
• Surface-Mount, Chip-Type Package — Compact chip/can SMD package (L: 6.2 × D: 8 mm) suitable for automated placement on high-density PCBs; surface mount land size L: 8.3 × W: 8.3 mm.
• Polarity and Leakage — Polarized aluminum electrolytic construction with leakage current limits defined by the series (0.01CV or 3 µA after 2 minutes at 20°C, per series specifications).
• Quality and Compliance — AEC-Q200 qualified and RoHS compliant for regulated market deployment.

Typical Applications

• Automotive Electronics — Bulk and decoupling capacitance in control modules and power circuits where AEC-Q200 qualification and wide temperature range are required.
• Power Supply Filtering — Bulk filtering and ripple smoothing on DC–DC converters and voltage regulators, leveraging the low impedance and defined ripple current ratings.
• High-Density PCB Designs — Surface-mount chip package enables automated placement and compact layout in space-constrained consumer and industrial boards.

Unique Advantages

• Compact SMD Form Factor: Chip-type can package (6.2 × 8 mm) enables high-density board layouts and automated assembly.
• Reliable Thermal Endurance: 1000-hour rating at 105°C provides predictable aging and stability for long-term deployments.
• Lower System Noise: Low impedance (400 mΩ) and specified ripple current performance at both 120 Hz and 10 kHz help reduce power rail noise and improve transient response.
• Industry-Recognized Qualification: AEC-Q200 qualification and RoHS compliance support use in regulated and safety-conscious designs.
• Clear Mounting Footprint: Defined surface mount land size (8.3 × 8.3 mm) simplifies PCB layout and manufacturing preparation.

Why Choose UWG1C680MCL1GS?

UWG1C680MCL1GS combines chip-type convenience with low impedance and defined ripple handling to address power decoupling and bulk-storage needs in compact, high-density designs. Its wide operating temperature range, 1000-hour endurance at 105°C, and AEC-Q200 qualification position it for reliable use in demanding embedded and automotive systems.

This capacitor is well suited to engineers and purchasers looking for a RoHS-compliant, surface-mount aluminum electrolytic that balances size, electrical performance, and thermal durability for long-term, production-grade applications.

To request a quote or submit a pricing inquiry for UWG1C680MCL1GS, please provide your quantity and delivery requirements so our team can respond with availability and lead-time information.