UWG1H010MCL1GB

The UWG1H010MCL1GB is a chip-type, low-impedance aluminum electrolytic capacitor in a compact surface-mount can. It delivers 1 µF capacitance at 50 V in a φ4 × 5.4 mm package designed for automatic placement and high-density PC boards.

Engineered for wide temperature operation and endurance, this part is AEC-Q200 qualified and RoHS compliant, making it suitable for applications that require stable filtering and decoupling across −55°C to 105°C with proven reliability.

Key Features

• Capacitance & Voltage — 1 µF rated capacitance with a 50 V rating and ±20% tolerance (120 Hz, 20°C), providing a compact option for mid-voltage decoupling and smoothing.
• Low Loss / Low Impedance — Tangent of loss angle (tanδ) 0.12 (measured at 120 Hz, 20°C, 50 V) and specified impedance of 5 Ω, optimized for low-loss performance.
• Ripple Current Capability — Low-frequency ripple current 15 mA at 120 Hz and high-frequency ripple current 30 mA at 10 kHz, suitable for AC ripple handling in power circuits.
• Leakage Current — Leakage current specified at 3 µA, supporting low-standby current designs.
• Temperature & Endurance — Operating range −55°C to 105°C with rated endurance of 1000 hours at 105°C, supporting long-term reliability under elevated temperature stress.
• SMD Chip Package — Chip-type radial can SMD (φ4 × 5.4 mm; L: 5.4 × D: 4 mm) with surface mount land recommendation 4.3 × 4.3 mm; packaged in embossed carrier tape for automated assembly.
• Automotive-Grade Qualification — AEC-Q200 qualified and manufactured for mass production; RoHS compliant.

Typical Applications

• Automotive Electronics — Use in automotive modules and electronic control units where AEC-Q200 qualification and a −55°C to 105°C temperature range are required.
• Power Supply Decoupling — Local decoupling and smoothing on 50 V rails where compact size and low impedance help stabilize converters and regulators.
• High-Density PCB Assemblies — Surface-mount chip design and embossed carrier taping allow reliable automated placement on space-constrained boards.

Unique Advantages

• Compact, SMD Can Format — φ4 × 5.4 mm chip-type package provides electrolytic capacitance in a small footprint for dense board layouts.
• Designed for Automated Assembly — Embossed carrier taping and surface-mount compatibility simplify pick-and-place and reflow processes.
• Temperature and Endurance Trade-offs Optimized — Rated for 1000 hours at 105°C, delivering predictable performance over life in elevated-temperature environments.
• Measured Electrical Stability — Specified tanδ, impedance, and leakage current values enable engineers to predict AC performance and power-loss behavior.
• Automotive-Grade Reliability — AEC-Q200 qualification supports use where automotive-grade component qualification is a requirement.
• Regulatory Compliance — RoHS compliant to meet restriction of hazardous substances requirements.

Why Choose UWG1H010MCL1GB?

The UWG1H010MCL1GB combines a compact chip-type aluminum electrolytic construction with low impedance characteristics and defined ripple and leakage performance, making it a practical choice for designers needing reliable decoupling and smoothing in constrained board space. Its AEC-Q200 qualification and 1000-hour endurance at 105°C position it for applications where elevated-temperature reliability and automotive-grade qualification matter.

Produced for mass assembly with embossed carrier taping and surface-mount compatibility, this part supports high-volume manufacturing and integration into tight-layout power and control modules from a reputable manufacturer.

Request a quote or contact sales to discuss availability, volume pricing, and lead times for UWG1H010MCL1GB.