UWG1V3R3MCL1GB
| Part Description |
3.3 µF 35 V ±20% Aluminum Electrolytic Capacitor, SMD |
|---|---|
| Quantity | 1,575 Available (as of November 3, 2026) |
| Product Category | Aluminum Electrolytic Capacitors |
|---|---|
| Part Series | UWG |
| Manufacturer | Nichicon |
| Manufacturing Status | Mass Production |
| Manufacturer Standard Lead Time | Contact Us |
| Datasheet |
Specifications & Environmental
| Applications | Automotive | Capacitance | 3.3 µF | ECCN | EAR99 | ||
|---|---|---|---|---|---|---|---|
| ESR | N/A | Height Seated (Max) | 5.7 mm | HTS Code | 8532.22.0020 | ||
| Impedance | 3 Ohm | Lead Spacing | N/A | Lifetime @ Temp | 1000 h @ 105°C | ||
| Moisture Sensitivity Level | N/A | Mounting Method | Surface Mount | Operating Temperature | -55°C - 105°C | ||
| Package / Case | Radial, Can - SMD | Polarization | Polar | Ratings | AEC-Q200 | ||
| REACH Compliance | REACH Affected | Ripple Current High Frequency | 60 mA @ 10 kHz | Ripple Current Low Frequency | 30 mA @ 120 Hz | ||
| RoHS Compliance | Compliant | Size / Dimension | 5.4 x 4 mm | Surface Mount Land Size | 4.3 x 4.3 mm | ||
| Tolerance | -20%~20% | Voltage | 35 V |
Overview of UWG1V3R3MCL1GB – 35 V, 3.3 µF Low‑Impedance SMD Aluminum Electrolytic Capacitor
The UWG1V3R3MCL1GB is a chip‑type aluminum electrolytic capacitor in a low‑impedance surface‑mount can package. It is designed for high‑density PC boards and automated assembly, offering a compact 5.4 × 4 mm footprint with SMD-compatible land pattern.
Built for demanding operating conditions, the part supports a wide temperature range from −55 °C to +105 °C, carries AEC‑Q200 qualification, and is RoHS compliant—positioning it for reliable use in automotive and other temperature‑sensitive electronics.
Key Features
- Electrical Rating — 3.3 µF capacitance at 35 V rated voltage with ±20% tolerance, suitable where compact value and moderate voltage are required.
- Low Impedance Performance — Specified low impedance (3 Ω) and low‑loss characteristics help support stable operation across frequency ranges.
- Ripple Current Capability — Specified ripple handling of 30 mA at 120 Hz and 60 mA at 10 kHz for applications requiring AC ripple endurance.
- Wide Temperature Range — Operates from −55 °C to +105 °C, with endurance specified as 1000 hours at 105 °C under rated voltage.
- Surface‑Mount Chip Package — Chip type radial can in an SMD form factor sized L: 5.4 × D: 4 mm, designed for placement on high‑density PC boards and feedable by carrier tape for automated assembly.
- Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant, supporting regulated and qualification‑driven product developments.
- Assembly Footprint — Recommended surface mount land size L: 4.3 × W: 4.3 mm to match the part’s package dimensions for reliable soldering and placement.
Typical Applications
- Automotive Electronic Systems — AEC‑Q200 qualification and wide temperature performance make this capacitor suitable for automotive electronic control modules and related assemblies.
- High‑Density Surface‑Mount PCBs — Chip‑type SMD can package and carrier‑tape compatibility enable use in compact assemblies and automated production lines.
- Temperature‑Challenged Electronics — Rated for −55 °C to +105 °C with defined endurance at 105 °C, applicable where extended thermal range is required.
Unique Advantages
- Automotive‑grade Qualification: AEC‑Q200 rating supports designs that require industry qualification and reliability documentation.
- Compact SMD Form Factor: 5.4 × 4 mm package and defined land footprint reduce board space while enabling automated placement.
- Broad Operating Temperature: −55 °C to +105 °C operation and 1000‑hour endurance at 105 °C help ensure long‑term performance in harsh environments.
- Low Impedance and Ripple Handling: Specified low impedance and ripple current ratings deliver stable behavior under AC loading conditions.
- Regulatory Compliance: RoHS compliance supports use in regulated product lines and simplifies environmental compliance tracking.
Why Choose UWG1V3R3MCL1GB?
The UWG1V3R3MCL1GB combines a low‑impedance aluminum electrolytic dielectric in a compact chip‑type SMD can with automotive qualification and a wide operating temperature window. It is suited to engineers and procurement teams specifying robust passive components for high‑density, temperature‑sensitive, and qualification‑driven designs.
Choosing this part supports automated assembly processes and provides verifiable endurance at elevated temperature, delivering a reliable capacitor option where space, thermal range, and industry qualification are prioritized.
Request a quote or submit an inquiry to receive pricing, availability, and technical support for UWG1V3R3MCL1GB.
Date Founded: 1950
Headquarters: Nakagyo, Kyoto, Japan
Employees: 5,000+
Revenue: $1.2 Billion
Certifications and Memberships: ISO9001:2015, IATF16949:2016