UWG1V6R8MCL1GB

The UWG1V6R8MCL1GB is a chip-type aluminum electrolytic capacitor engineered for surface-mount use on high-density printed circuit boards. It delivers low-impedance performance in a compact SMD can package and is designed for automated placement using carrier tape.

With AEC-Q200 qualification, RoHS compliance, and a wide operating temperature range from −55°C to +105°C, this capacitor is intended for demanding environments where temperature tolerance, reliability, and automated assembly compatibility are required.

Key Features

• Core Type – Chip, Low Impedance Chip-type construction optimized for low impedance; datasheet lists the series as "Low Impedance."
• Electrical Ratings 6.8 µF capacitance at a rated voltage of 35 V with ±20% tolerance and polarization as an electrolytic capacitor.
• Wide Temperature Range & Endurance Rated for operation from −55°C to +105°C and endurance of 1000 hours at 105°C under rated voltage.
• Ripple Performance Specified ripple current of 47.5 mA at 120 Hz and 95 mA at 10 kHz, supporting decoupling and filtering roles in SMD designs.
• Automotive-Grade Reliability AEC-Q200 qualified, suitable for applications requiring automotive-level component qualification.
• Surface-Mount Package & Assembly Radial can SMD package designed for high-density PC boards and compatible with automatic mounting machines fed with carrier tape.
• Regulatory Compliance Compliant to the RoHS directive (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — For use in vehicle electronics where AEC-Q200 qualification and wide temperature capability are required.
• High-density SMD assemblies — Designed for surface mounting and automatic placement on compact printed circuit boards.
• Temperature-challenged environments — Suited to designs that must operate reliably from −55°C to +105°C and endure 1000 hours at peak temperature.

Unique Advantages

• Qualified for automotive use: AEC-Q200 qualification provides documented suitability for designs requiring automotive-grade components.
• Wide operating temperature: −55°C to +105°C range supports deployment in demanding thermal environments.
• Low-impedance performance: Chip-type, low-impedance construction combined with specified impedance and ripple current figures supports effective smoothing and filtering in power rails.
• Automated assembly friendly: Package is compatible with carrier-tape feeding for efficient pick-and-place production on high-density PCBs.
• Long high-temperature life: Endurance defined as 1000 hours at 105°C under rated voltage delivers predictable life performance for thermal stress conditions.
• RoHS compliant: Meets RoHS directive requirements for restricted substances.

Why Choose UWG1V6R8MCL1GB?

The UWG1V6R8MCL1GB combines compact, chip-type packaging with low-impedance behavior and automotive-grade qualification, making it a strong option for designs that require reliable SMD aluminum electrolytic capacitance across a broad temperature range. Its specified ripple-current capability and defined endurance at elevated temperature provide predictable performance for thermal and electrical stress conditions.

This part is well suited to engineering teams and procurement sourcing components for high-density assemblies and applications that demand AEC-Q200 qualification, RoHS compliance, and automated assembly compatibility. It offers a clear specification set for evaluating long-term robustness in temperature-challenged environments.

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