UWH1C101MCL1GS

CAP ALUM 100UF ±20% 16V SMD
Part Description

100 µF 16 V ±20% Aluminum Electrolytic Capacitor, SMD

Quantity 1,378 Available (as of November 3, 2026)
Product CategoryAluminum Electrolytic Capacitors
Part SeriesUWH
ManufacturerNichicon
Manufacturing StatusMass Production
Manufacturer Standard Lead TimeContact Us
Datasheet

Specifications & Environmental

ApplicationsAutomotive, High Temperature ReflowCapacitance100 µFECCNEAR99
ESRN/AHeight Seated (Max)1.15 cmHTS Code8532.22.0020
ImpedanceN/ALead SpacingN/ALifetime @ Temp1000 h @ 125°C
Moisture Sensitivity LevelN/AMounting MethodSurface MountOperating Temperature-40°C - 125°C
Package / CaseRadial, Can - SMDPolarizationPolarRatingsAEC-Q200
REACH ComplianceREACH AffectedRipple Current High Frequency99 mA @ 10 kHzRipple Current Low Frequency66 mA @ 120 Hz
RoHS ComplianceCompliantSize / Dimension10 x 8 mmSurface Mount Land Size8.3 x 8.3 mm
Tolerance-20%~20%Voltage16 V

Overview of UWH1C101MCL1GS – 100 µF, 16 V High‑Reliability SMD Aluminum Electrolytic Capacitor

The UWH1C101MCL1GS is a chip‑type aluminum electrolytic capacitor designed for high‑reliability, high‑temperature surface‑mount applications. It is AEC‑Q200 qualified and rated for operation from −40°C to +125°C, providing robust electrical performance for demanding assemblies.

Engineered for automatic mounting and lead‑free reflow processing, this 100 µF, 16 V polarized capacitor combines elevated temperature endurance with controlled impedance and leakage characteristics useful in automotive and other high‑temperature electronic systems.

Key Features

  • Capacitance & Voltage — 100 µF rated capacitance at 16 V for bulk decoupling and energy storage in compact SMD form.
  • Temperature Range & Endurance — Rated for −40°C to +125°C operation with endurance specified as 1000 hours at 125°C under rated voltage; capacitance change within ±30% after endurance test.
  • High‑Temperature Reflow Compatibility — Designed to withstand 260°C peak reflow soldering (recommended: 260°C peak 5 s; 230°C over 60 s ×2 for standard sizes), and meets soldering heat resistance (250°C hot‑plate, 30 s) with capacitance change within ±10%.
  • Electrical Performance — Low leakage current (≤0.03CV or 4 µA after 1 minute at 20°C) and specified tan δ (max. 0.24 at 16 V, 120 Hz, 20°C) for predictable AC behavior.
  • Ripple Current Ratings — Rated ripple currents: 66 mA at 120 Hz and 99 mA at 10 kHz, useful for filtering and smoothing in pulsed or noisy power rails.
  • Package & Mounting — Chip type, surface mount can style suitable for automated assembly; designed for carrier‑tape feed and placement. Typical size: L 1.0 × D 0.8 cm with recommended land size 8.3 × 8.3 mm.
  • Qualification & Compliance — AEC‑Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863).
  • Polarized — Polarized aluminum electrolytic chemistry for DC power applications.

Typical Applications

  • Automotive electronic modules — AEC‑Q200 qualification and +125°C endurance make this capacitor suitable for control modules and other vehicle electronics that require high‑temperature stability.
  • Power supply filtering in harsh environments — 100 µF at 16 V with defined ripple current and low leakage supports bulk smoothing and decoupling where temperature and reliability are critical.
  • Automated surface‑mount assembly — Chip form factor and carrier‑tape compatibility simplify placement on high‑volume PCBs assembled with reflow processes.

Unique Advantages

  • High‑temperature endurance: Specified for 1000 hours at +125°C under rated voltage, providing predictable long‑term performance in hot environments.
  • Reflow process compatibility: Designed for 260°C peak reflow profiles and verified resistance to soldering heat, enabling lead‑free assembly without special handling.
  • AEC‑Q200 qualified: Meets automotive component qualification standards to support designs that require recognized reliability credentials.
  • Measured AC characteristics: Documented tan δ and impedance stability at low temperature (Z(−40°C)/Z(+20°C) = 8 for 16 V) help designers predict frequency and temperature behavior.
  • Compact SMD can package: Chip type construction with defined land pattern (8.3 × 8.3 mm) reduces PCB footprint while remaining compatible with automated placement.

Why Choose UWH1C101MCL1GS?

UWH1C101MCL1GS positions itself as a reliable SMD aluminum electrolytic solution where elevated temperature operation, AEC‑Q200 qualification, and automated assembly compatibility are required. Its combination of 100 µF capacitance at 16 V, controlled leakage, and documented ripple current make it a practical choice for designers balancing space, thermal stress, and electrical performance.

This part is well suited to engineers specifying components for automotive electronics and other systems exposed to high ambient temperatures, offering traceable endurance data and reflow robustness to support production and long‑term field reliability.

Request a quote or submit your component inquiry to receive pricing and availability information for UWH1C101MCL1GS from our sales team.

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    Date Founded: 1950


    Headquarters: Nakagyo, Kyoto, Japan


    Employees: 5,000+


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