UWH1E101MCL1GS

The UWH1E101MCL1GS is a Nichicon UWH-series chip type aluminum electrolytic capacitor designed for high-temperature operation up to +125°C. It is a surface-mount radial can (chip) package intended for automated assembly and high-reliability applications.

Targeted at markets requiring robust temperature and soldering performance, this part combines a 100 µF / 25 V rating with AEC-Q200 qualification and RoHS compliance, delivering long-term endurance (1000 hours at 125°C) and compatibility with high-temperature reflow processes.

Key Features

• Chip type, surface-mount packaging — Radial can SMD (chip) package suitable for automatic mounting machines fed with carrier tape; recommended land pattern L: 8.3 × W: 8.3 mm. Physical size: L: 1.0 cm × D: 0.8 cm.
• Electrical rating — 100 µF capacitance at a rated voltage of 25 V with ±20% tolerance.
• Wide operating temperature — Rated for operation from −40°C to +125°C and specified for +125°C use.
• High-temperature reflow compatibility — Designed to withstand 260°C peak reflow soldering; recommended reflow: 260°C peak for 5 seconds, 230°C over 60 seconds (two cycles in specified sizes).
• Endurance at elevated temperature — Specified lifetime: 1000 hours at 125°C. After endurance testing, capacitance change remains within ±30% and leakage current stays within initial specified values.
• Leakage and dissipation characteristics — Leakage current after 1 minute at 20°C is ≤ 0.03CV or 4 µA (whichever is greater). Tangent of loss angle (tan δ) for 25 V is specified with a maximum of 0.21 at 120 Hz, 20°C.
• Ripple current performance — 74 mA at 120 Hz (low frequency) and 111 mA at 10 kHz (high frequency), supporting board-level ripple handling in high-temperature environments.
• Quality and compliance — AEC-Q200 qualified and RoHS compliant (2011/65/EU, (EU)2015/863), with black top-case marking for identification.

Typical Applications

• Automotive electronics — AEC-Q200 qualification and +125°C rating make this capacitor suitable for automotive electronic modules and control systems that require components rated for elevated temperatures.
• Automated surface-mount production — Chip-type SMD packaging and carrier-tape compatibility enable streamlined placement in high-volume automated assembly processes.
• High-temperature industrial electronics — Designed for circuits and assemblies exposed to elevated operating temperatures and high-temperature soldering processes.

Unique Advantages

• High-temperature durability: Rated to +125°C with 1000-hour endurance at that temperature, supporting designs that must operate reliably in hot environments.
• Reflow process compatibility: Certified for 260°C peak reflow conditions, reducing process constraints for assemblies that require high-temperature soldering.
• Automated assembly ready: Chip-form factor compatible with carrier-tape feeding simplifies pick-and-place integration and throughput on surface-mount lines.
• AEC-Q200 qualification: Automotive-level qualification provides a documented reliability baseline for use in transportation and other demanding sectors.
• Measurable electrical characteristics: Specified leakage current limits, tan δ, and ripple current values give predictable performance for thermal and ripple-sensitive designs.
• RoHS compliance: Meets current RoHS directives for environmental and regulatory requirements.

Why Choose UWH1E101MCL1GS?

The UWH1E101MCL1GS positions itself as a high-reliability, high-temperature SMD electrolytic capacitor for applications that demand stable capacitance, controlled leakage, and proven endurance at elevated temperatures. With AEC-Q200 qualification, RoHS compliance, and compatibility with 260°C reflow processes, it is well suited to engineering teams designing for automotive and other harsh-environment electronics where thermal and soldering robustness are required.

Choose this part when you need a compact, surface-mount aluminum electrolytic solution with documented endurance at +125°C, clear electrical specifications (100 µF, 25 V, ±20%), and manufacturing-friendly packaging for automated assembly.

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