UWH1H100MCL1GS

The UWH1H100MCL1GS from Nichicon is a chip-type aluminum electrolytic capacitor designed for high-reliability surface-mount assemblies. It is optimized for operation up to +125°C and is qualified to AEC-Q200, addressing demanding environments where elevated temperature endurance and automated assembly compatibility are required.

This part supports high-temperature soldering processes with a 260°C peak reflow profile and is produced for tape-fed automatic mounting. Key value propositions include proven endurance at elevated ambient temperature, controlled leakage and loss characteristics, and RoHS compliance.

Key Features

• Capacitance & Voltage — 10 µF rated capacitance at 50 V, with a tolerance of ±20% (120 Hz, 20°C).
• High-temperature Operation — Category temperature range of −40°C to +125°C with endurance specified as 1000 hours at 125°C.
• 260°C Reflow Compatibility — Corresponds with 260°C peak reflow soldering; recommended profile: 260°C peak for 5 seconds and 230°C over 60 seconds (details vary by case size).
• Automotive Qualification — AEC-Q200 qualified; suitable for automotive electronic designs that require component-level qualification.
• Leakage & Loss Characteristics — Leakage current after 1 minute at 20°C is specified as not more than 0.03CV or 4 µA (whichever is greater); tan δ max for 50 V is 0.18 (measured at 120 Hz, 20°C).
• Ripple Current Ratings — 24 mA at 120 Hz and 36 mA at 10 kHz, suitable for applications with modest ripple requirements.
• Package & Assembly — Chip-type radial can SMD (6.2 mm height × 8 mm diameter); compatible with carrier-tape automatic mounting and surface-mount land size 8.3 × 8.3 mm.
• Environmental Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).

Typical Applications

• Automotive electronics — For electronic control assemblies where operation to +125°C and AEC-Q200 qualification are required.
• Surface-mount assemblies for high-temperature processes — Designed for tape-fed automatic mounting and reflow profiles up to a 260°C peak.
• High-reliability board designs — Where defined endurance at elevated temperature (1000 hours at 125°C) and controlled leakage specifications are part of the system requirements.

Unique Advantages

• High-temperature endurance: Rated for operation to +125°C with a 1000-hour endurance specification at that temperature, supporting long-term performance in hot environments.
• Reflow-process ready: Engineered to withstand 260°C peak reflow profiles and compatible with tape-fed automatic placement to streamline assembly.
• Automotive-grade qualification: AEC-Q200 qualification supports usage in automotive electronic designs that require component-level qualification.
• Predictable leakage and loss: Specified leakage current limits and tan δ values provide measurable parameters for power and energy-storage budgeting in designs.
• Compact SMD form factor: Chip-type radial can (6.2 × 8 mm) enables surface-mount placement with standardized land pattern (8.3 × 8.3 mm) for automated manufacturing.
• Regulatory compliance: RoHS compliant to applicable directives, supporting environmental requirements for end products.

Why Choose UWH1H100MCL1GS?

The UWH1H100MCL1GS combines high-temperature endurance, AEC-Q200 qualification, and compatibility with 260°C reflow processes to meet the needs of demanding surface-mount assemblies. Its defined electrical characteristics—10 µF at 50 V, controlled leakage, and specified tan δ—make it straightforward to integrate where predictable behavior at elevated temperatures is required.

Manufactured by Nichicon and delivered in a tape-fed SMD chip form, this capacitor suits engineers and procurement teams designing for robust board-level manufacturing and long-term thermal endurance in automotive and other high-reliability applications.

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