UWG1V470MCL1GS

The UWG1V470MCL1GS is a chip‑type, low‑impedance aluminum electrolytic capacitor from Nichicon's UWG series. It is designed for surface mounting on high‑density PC boards and is compatible with automatic mounting equipment fed by carrier tape.

Targeted at demanding environments, the part offers a wide operating temperature range and industry qualification for robust applications, delivering measurable low impedance and ripple handling in a compact SMD can package.

Key Features

• Electrical Performance — 47 µF nominal capacitance at a 35 V rated voltage with ±20% tolerance, providing bulk capacitance for power filtering and decoupling.
• Low Impedance — Specified impedance of 400 mΩ and low loss (tan δ max. 0.12 at 35 V) to reduce voltage ripple and improve transient response.
• Ripple Current Capability — Rated ripple handling of 115 mA at 120 Hz and 230 mA at 10 kHz to support a range of switching and AC conditions.
• Wide Temperature Range — Operates from −55°C to +105°C for use across broad thermal environments.
• Automotive Qualification & Reliability — AEC‑Q200 qualified; endurance specified as 1000 hours at 105°C with capacitance change within ±20% and leakage current maintained at or below initial specified value.
• Manufacturing & Mounting — Chip type radial can in an SMD form factor designed for surface mounting on high‑density PCBs and compatible with carrier‑tape automatic mounting.
• Robust Soldering and Shelf Life — Meets resistance to soldering heat (30 s on a 250°C hot plate) with capacitance change within ±10%; shelf life endurance after 1000 hours at 105°C when restored per JIS treatment.
• Compliance — RoHS compliant (2011/65/EU, (EU)2015/863).
• Physical Footprint — Compact dimensions: 6.2 × 8 mm (L × D) with recommended surface mount land size 8.3 × 8.3 mm.
• Leakage Current Specification — After 2 minutes at rated voltage and 20°C, leakage current ≤ 0.01CV or 3 μA, whichever is greater.

Typical Applications

• Automotive Electronics — Designed and AEC‑Q200 qualified for use in automotive electronic modules that require robust electrolytic capacitance on surface‑mount PCBs.
• High‑Density PCB Designs — Chip‑type SMD can intended for compact board layouts and automatic carrier‑tape mounting on high‑density assemblies.
• Thermally Demanding Environments — Suitable where components must perform across −55°C to +105°C operating range and meet defined endurance at elevated temperature.

Unique Advantages

• Wide operating temperature window — −55°C to +105°C specification enables use in applications with broad thermal swings.
• AEC‑Q200 qualification — Explicit qualification aligns the part to applications where automotive reliability standards are required.
• Measurable low impedance and loss — 400 mΩ impedance and tan δ max. 0.12 at 35 V provide predictable electrical performance for power filtering.
• High ripple handling for switching domains — Dual ripple ratings at 120 Hz and 10 kHz help support both low‑ and high‑frequency ripple conditions.
• Production‑friendly SMD packaging — Chip can form factor with carrier‑tape compatibility simplifies automated placement on dense PCBs.
• Proven endurance and solder robustness — 1000 hours at 105°C endurance and defined soldering‑heat tolerance provide traceable reliability metrics.

Why Choose UWG1V470MCL1GS?

UWG1V470MCL1GS combines low impedance, defined ripple capability, and a compact SMD can package to meet the electrical and assembly needs of modern PC‑board designs. Backed by the UWG series specifications, this capacitor provides quantifiable endurance and thermal performance for engineers specifying components for challenging environments.

This part is well suited to customers designing automotive electronics and other applications that require AEC‑Q200 qualification, RoHS compliance, and predictable long‑term performance on high‑density surface‑mount boards.

Request a quote or contact sales for pricing and availability of UWG1V470MCL1GS and to discuss volume lead times or technical questions about integration into your design.